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【扒一扒】日本高纯球形硅微粉材料生产商
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《【扒一扒】日本高纯球形硅微粉材料生产商》:  作为一种无机非金属矿物功能性粉体材料,硅微粉广泛应用于电子材料、电工绝缘材料、胶黏剂、特种陶瓷、精密铸造、油漆涂料、油墨、硅橡胶等领域。 目前,世界上只有中国、日本、韩国、美国等少数国家具备硅微粉生产能力... 全文 ?

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HENKEL HYSOL E1470 TDS&MSDS

找到这款产品是因为有个客户咨询到LCP材料的粘接,我在网上找了半天,后来发现hysol这款产品是专门针对LCP及有机硅粘接的型号,不过此胶水资料显示的是环氧体系的。 关于LCP材料,网上的内容也不是太多,简单理解成为液晶聚合物,关于LCP网上搜集了一些资料,会在另一篇博客中再详述,先将此份资料摘录如下,有兴趣的朋友可以下载附件查看之:

 

PRODUCT DESCRIPTION
E1470 provides the following product characteristics:

Technology Epoxy
Appearance Off-white
Components One-component
Product Benefits • Thermosetting
• B-Stageable
• Controlled particle size
• Controlled rheology
• Sag resistant
• Excellent adhesion
• Non-conductive
Cure Heat Cure
Application Assembly
Surfaces LCP, Silicon, Metals, Aluminum and Plastics
Typical Package Application Component attach and Lid seal

E1470 adhesive is designed for component attach and lid seal applications. E1470 can be applied by syringe dispense and cured in conventional batch oven or continuous IR convection oven at low temperatures.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity , AR 1000, mPa∙s (cP)                                       12,000
Shear Thinning Index (Rheometer)                                    2.1
Shelf Life:  @ -20ºC (wet), months                                        3
Pot Life: @ 25ºC (wet), weeks                                                  1
@ 25ºC (dry), months                                               1
Flash Point – See MSDS
TYPICAL CURING PERFORMANCE
Recommended B-Stage Condition         45 minutes @ 100°C – Batch
Cure Schedule                                                5 minutes @ 180°C
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Glass Transition Temperature ,DMA, °C                                     85
Thermal Conductivity, W/mk                                                         0.2
Water Absorption, %:  85°C/85 RH                                                2
Thermal Decomposition TGA, °C                                                    300

TYPICAL PERFORMANCE OF CURED MATERIAL
Lap Shear Strength :
LCP                                      N/mm² 13                         (psi) (1,900)
Gold                                    N/mm² 17                         (psi) (2,500)
Ceramic                             N/mm² 16.5                     (psi) (2,400)

PERFORMANCE AND RELIABILITY DATA
Gross Leak Results   1,000 hours, 85°C/85 RH, 150°C     Pass

GENERAL INFORMATION
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
THAWING:
1. Allow material to reach room temperature before use.
DIRECTIONS FOR USE
1. E1470 is sag resistant and can be dispensed on vertical surfaces like the edge of a lid.
2. B-stage using a conventional batch oven, then cure in a batch oven or continuous IR convection oven.
3. E1470 can be dispensed on the underside of a lid or component and dried to tack-free. In this state, the pre-applied adhesive can be stored and/or shipped to another location for attachment.
Not for product specifications
The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.
Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.
Optimal Storage: -20 °C
Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.

Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
Note
The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

 

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HENKEL HYSOL ECCOBOND D125F TDS

一款不大常见的汉高旗下的SMT粘接剂,不过不是在乐泰品牌下而是在HYSOL品牌下,并且其颜色也不是传统的红色,而是黄色的,貌似之前只见过贺利氏Heraeus旗下有黄色的贴片胶,而且主要是用于刷胶用途。而HSYOL 此款D125F是用于点胶的,有兴趣了解的朋友可以到文章末尾下载TDS查看之:

PRODUCT DESCRIPTION
ECCOBOND D125F provides the following product characteristics:

Technology Epoxy
Appearance Yellow
Components One-component
Product Benefits • Low exotherm
• Low water absorption
• No stringing
• High hot strength
• High speed dispensing
• Low cure temperature
• Non-sag
Cure Heat Cure
Application Surface mount adhesive
Operating Temperature -40 to 105 °C
Typical Assembly
Applications
Chip   capacitors,   Chip    resistors, SOTs, SOICs and PLCCs

 

ECCOBOND D125F surface mount adhesive is designed for high speed dispensing.

 

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity, Brookfield , 25 °C, mPa·s (cP):

Speed 1 rpm, #TD                                           1,500,000 to2,000,000

Speed 10 rpm, #TD                                         300,000 to 400,000

Calculated Yield (Bingham), mPa·s (cP)             300,000 to 400,000

Specific Gravity                                                               1.25 to 1.3

Hegman Fineness, µm                                                    <50

Shelf Life:

@ 0 to 8ºC, months                                                   6

@ 18 to 25ºC, months                                               2

Flash Point – See MSDS

TYPICAL CURING PERFORMANCE

IR or Convection Conveyor Oven

20 minutes @ 100°C or

7 minutes @ 110°C or

2.5 minutes @ 120°C or

1.5 minutes @ 150°C

Convection Box Oven

30 minutes @ 100°C or

20 minutes @ 110°C or

10 minutes @ 120°C or

5 minutes @ 150°C

Note: A ramp up temperature of not more than 1°C per second should be used.

 

The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Coefficient of Thermal Expansion ASTM D 3386: Below Tg, ppm/°C 55 to 60
Glass Transition Temperature, ISO 11357-2, °C 85
Coefficient of Thermal Conductivity,   W/(m·K) 0.3
Shore Hardness, ISO 868, Durometer D >80
Linear Shrinkage, , % 0.5
Degree of Conversion by DSC, %: 3 minutes @ 125°C >90

 

Electrical Properties:

Dielectric Constant IEC 60250:    1mHz                                                               3.5

Volume Resistivity, IEC 60093, Ω·cm                                                                 1×1014

TYPICAL PERFORMANCE OF CURED MATERIAL
Lap Shear Strength , ISO 4587:   Aluminum @ 25 °C                                       N/mm² >8     (psi) (>1,160)

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

THAWING:

1.  Allow material to reach room temperature before use.

DIRECTIONS FOR USE

1.  ECCOBOND D125F can be applied by dispensing, pin transfer, screen or stencil printing.

2.  Equipment  set-up  and  related  product  information  is available from your Henkel Corporation support group.

Storage

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.

Optimal Storage : 0 to 8 °C

Material removed from containers may be contaminated during use.  Do not return product to the original container.  Henkel Corporation cannot assume responsibility for product  which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please   contact   your   local   Technical   Service   Center   or Customer Service Representative.

Not for product specifications

The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.

 

Conversions

(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm²  x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP

 

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation and its affiliates (“Henkel”) specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel products. Henkel specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted  as  representation  that  they  are  free  from domination of patents owned by others or as a license under any Henkel patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  Hysol ECCOBOND D125F TDS (69.6 KB, 10 次)
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5

第四章 LED的封装形式

一、LED常见分类

1、根据发光管发光颜色分类:

红光LED、橙光LED、绿光LED(黄绿、标准绿、纯绿)、蓝光LED……

上述各颜色可分为有色透明、无色透明、有色散射、无色散射四种。

2、根据发光管出光面特征分类:

圆灯、方灯、矩形、面发光管、表面安装用微型管;

从发光强度角分布有高指向性、标准型、散射型。

3、根据发光二极管的结构分类:

全环氧包封、金属底座环氧封装、陶瓷底座环氧封装及玻璃封装。

4、根据发光强度和工作电流分类:

根据发光强度和工作电流,可分为普通亮度LED(发光强度<10mcd)、高亮度LED(10~100mcd)和超高亮度LED(发光强度>100mcd)。

 

二、LED封装形式简述

1、为什么要对LED进行封装

1)对LED封装的作用:LED封装的作用是将外线连接到LED芯片的电极上,不但可以保护LED芯片,而且起到提高发光效率的作用,所以LED封装不仅仅只是为了光辐射,更重要的是保护管芯正常工作。LED封装既有电参数,又有光参数的设计及技术要求,并不是一项简单的工作。

顶部包封的环氧树脂做成一定形状,其作用是:保护管芯等不受外界侵蚀;采用不同形状和材料,起透镜或漫射透镜的作用,控制光的发散角;管芯折射率与空气折射率相差较大,选用相应折射率的环氧树脂作过渡,可提高管芯的光出射效率。

2)对LED封装的要求:

◆用于构成LED管壳的环氧树脂须具有良好的耐湿性、绝缘性以及较高的机械强度,对管芯发出光的折射率和透射率高,选择不同折射率的封装材料,封装几何形状,对光子取出效率的影响是不同的;

◆发光强度的角分布也与管芯结构、光输出方式、封装透镜所用材料及其形状有关;

◆LED设计应用中,PCB板等的热设计、导热性能也十分重要。

2、LED封装形式

LED产品封装形式五花八门,根据不同的应用场合、不同的外形尺寸、散热方案和发光效果,设计和确定LED的封装形式。

1)LED按封装形式分类:

◆垂直LED(Lamp-Led)

◆平面封装LED(Flat pack-LED)

◆贴片式封装LED(SMD-LED)

◆侧发光LED(Side-LED)

◆顶部发光LED(Top-LED)

◆高功率LED(High Power-LED)

◆覆晶封装LED(Flip Chip-LED)

◆集成封装LED(Integration-LED 、Polycrystalline LED)

2)按LED芯片发光面分类:

◆点光源(发光灯)

◆面光源(面发光灯)

◆发光显示器(线或面)

 

三、几种常用LED的典型封装形式

1、lamp(引脚)式封装

1)引脚封装形式概述:LED脚式封装采用引线架作各种封装外形的引脚,是最先研发成功投放市场的封装结构,品种数量繁多,技术成熟,封装内结构与反射层仍在不断改进。标准LED被大多数客户认为是目前显示行业中最方便、最经济的解决方案。引脚封装最突出特点就是可弯曲成所需形状,体积小。

2)引脚式封装结构:支架、芯片、金线或铝线、反光杯、环氧树脂或硅胶透镜;

2、平面封装

1)平面封装概述(类型)

◆数码管:单位数码管、多位数码管、双色数码管;

◆点阵:单色点阵、双色点阵、各种字符字体;

◆光柱:单色光柱、多色光柱、环形光柱;

◆面光源:多芯片集成白光、大功率芯片组合、食人鱼封装;

◆SMD贴片:硬片、软片光带。

2)典型平面封装器件结构原理

3、贴片式(SMD)封装

1)SMD封装的工艺:

芯片安放—银浆固化—金丝键合—封装—烘干固化—划片—测试分选—编带—出货检查

2)测试LED与选择SMD

◆对SMD封装的LED进行测试,因为其体积小,不便于手工操作,所以必须使用自动测试仪器;

◆由于结构SMD型化,PCB的选材和版图设计十分重要;

◆对于PCB基板的质量要求包括:要有足够的精度、镀金属的厚度和质量必须确保金丝键合后的拉力大于8g、表面无粘污;

4、食人鱼封装

1)因为此种封装的形状很像亚马逊河中的食人鱼,故命名之;

2)食人鱼LED产品有很多优点,由于食人鱼LED所用的支架式铜制的,面积较大,因此传热和散热快。

3)食人鱼LED的封装工艺

4)食人鱼LED的应用

5、功率型封装

 

四、几种前沿领域的LED封装形式

1、高亮度、低衰减、完美配光的红绿蓝直插式椭圆封装

1)户外大型彩色LED显示屏用的椭圆形LED属于高端LED领域,需具备如下主要特异特性:高亮度、高抗静电性、一致性(波长、高度、角度)、低衰减、低失效率、红绿蓝配光一致性;

2)国内封装技术须在以下几个方面努力赶超国外:高亮度方面、高抗静电方面、高一致性方面、低衰减方面、低失效率方面、红绿蓝光一致性方面;

2、高防护等级的户外型SMD

户外高防护等级SMD满足耐高温、耐高湿、耐紫外线的苛刻条件,故在金属支架与PPA材料的粘合性能、外封胶水的抗UV性能、PPA材料抗UV性能、外封胶水与PPA的粘合性能、外封胶水的渗透性能等关键要素上须全面通过选材、试验工艺和管控来解决。

3、广色域、低衰减、高色温稳定性白色SMD

LED器件的一个重要应用领域是大尺寸液晶显示屏背光源。

 

0

HENKEL LOCTITE UNDERFILL 3536 TDS&MSDS

初次接触乐泰的3536底填胶水是在2008年参与宇龙公司底填胶水竞标时,请参看此文 《LOCTITE 3536 UNDERFILL》。但是只知道此款产品有一个特性据说是可以经过二次回流,客户的理解就是耐热性比较好。 当时此款产品的技术资料也没找到,只是在网上截取了一个产品简介图片。 今天之所以又将此型号摘录下来,一来是因为近日发现此款产品也是属于乐泰公司不多的阳离子体系的底填胶水,大家参看附件的MSDS可略知一二,二来是因为近日参与了一家大公司的底填胶水评估,送了一款阳离子体系的胶水参与评估,表现不大理想。不过阳离子体系的底填胶水兼容性其实真的不大好,早期的有zymet公司的1703系列(那个时候乐泰还没有推出阳离子体系的underfill产品)。仔细的对比了一下乐泰官方版的TDS资料以及当时此产品刚推出时乐泰公司此型号彩页的参数,发现还是几个参数略有调整的,例如粘度、Tg、CTE的参数,也难怪但是乐泰一直没有发布官方的TDS资料了。 后来在网上找到了乐泰在2007年时的3536的内部TDS资料,及官网现在提供下载的TDS资料,这两者没什么区别的。 摘录2007年的TDS如下,有兴趣的朋友去下载附件查看原文:

 

PRODUCT DESCRIPTION

3536 is a CSP/BGA underfill that is designed to cure quickly at low  temperature  to  minimize  thermal  stress  to  other components and provide rapid device throughput.  When cured, it provides excellent protection for solder joints against mechanical stress, such as shock, drop, and vibration common in  hand-held  devices.     The  material  is  also  reworkable, allowing for recovery of high-cost substrates and PWBs.

 

TYPICAL APPLICATIONS

Reworkable CSP/BGA Underfill.

 

PROPERTIES OF UNCURED MATERIAL

Typical Value

Chemical Type Epoxy
Appearance          Black
Viscosity @ 25°C, mPas,      1,848

Brookfield, CP52/20

 

PHYSICAL PROPERTIES, CURED MATERIAL

Cure for 60min @ 120°C

Typical Value

Glass Transition, (Tg), °C, by TMA                     53

Coefficient of Thermal Expansion cm/cm/°C,

α1  (<Tg)       63 x 10-6

α2  (>Tg)       178 x 10-6

Storage Modulus, GPa                                        3.5

 

GENERAL INFORMATION

For safe handling information on this product, consult the

Material Safety Data Sheet (MSDS).

 

Handling

Pot Life @ 25°C, days                                         >14 days

(ITM10T), (time to double in viscosity)

Shelflife @ 2-8°C (estimated), months                     6

 

Optimal  Storage:  2-8ºC.    Storage  at  lower  than  2°C  or higher than 8°C may adversely affect product properties. Material removed from containers may be contaminated during use.  Do not return products to the original container.  Henkel Corporation  cannot  assume  responsibility  for  product  which has been contaminated or stored under conditions other than those previously indicated.  If additional information is required, please   contact   your   local   Technical   Service   Center   or Customer Service Representative.

 

Substrate Preheat

For best results, substrate should be preheated (up to 70°C) to allow fast capillary flow.

Recommended Cure Conditions

5 min. @ 120°C

2 min. @ 130°C

Curing above 140°C is not recommended

 

Removal Procedure

The basic removal procedure for 3536 involves heating the underfill to approximately 240°C using a hot air nozzle on standard BGA rework equipment.   This component is then twisted and removed.  Residue removal is accomplished using a tacky flux or liquid flux and a solder removal vacuum tool.

 

NOTE

The data contained herein are furnished for information only and are believed to be reliable.    We cannot assume responsibility for the results obtained by others over whose methods we have no control.  It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Loctite Corporation’s products.  Loctite Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits.  The discussion herein of various processes or compositions is not to be interpreted  as  representation  that  they  are  free  from domination of patents owned by others or as a license under any Loctite Corporation patents that may cover such processes or compositions.  We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide.  This product may be covered by one or more United States or foreign patents or patent applications.

 

最后发现了乐泰宣传资料及正式发布的TDS上一个显著的矛盾点, 宣传资料上显示回流炉固化条件可做到150度1分钟,而在正式发布的TDS固化条件中明确强调:“Curing above 140°C is not recommended”。的确阳离子体系产品固化温度过高会产生很多莫名其妙的问题,估计乐泰也是在和客户的配合过程中发现了这个问题,所以在资料里面做了修正。

 

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第三章 LED的封装制程

一、概述

1、封装(package)对于芯片来说是必需的,也是至关重要的。封装也可以说是安装半导体芯片用的外壳,它不仅起着保护芯片和增强导热性能的作用,而且还是沟通芯片内部世界与外部电路的桥梁,半导体封装具有规格通用化的功能,封装的主要作用有物理保护、电气连接、标准规格化。

2、顶部包封的环氧树脂做成一定的形状,有这样几种作用:保护管芯等不受外界侵蚀;采用不同的形状的材料性质,起透镜或漫射透镜功能,控制光的发散角;选用相应折射率的环氧树脂过渡,可提高管芯的光出射效率。

3、在室温附近,温度每升高1度,LED的发光强度会相应地减少1%左右,封装散热时保持色纯度与发光强度非常重要。以往采用减少其驱动电流的办法,降低结温。全新的LED封装设计理念和低热阻封装结构及技术,改善了热特性,此外在应用设计中,PCB线路板等的热设计、导热性能也十分重要。

4、LED封装不仅将外线连接到LED芯片的电极上,并且起到提高光取出效率的作用。关键工序有装架、压焊、封装。LED封装形式可以说是五花八门,主要根据不同的应用场合采用相应的外形尺寸,散热对策和出光效果。LED按封装形式分类有Lamp-LED(引脚式LED)、TOP-LED(顶部发光LED)、Side-LED(侧发光LED)、SMD-LED(表面贴装LED)、Flip-Chip-LED(覆晶LED)、High-Power-LED(高功率LED)。

 

二、LED封装流程简介

1、LED封装整体流程:

固晶站—焊线站—灌胶站—测试站—分光站;

2、手动Lamp-LED封装线流程:

翻晶(扩晶)+手动点胶或机器点胶(银胶搅拌+排支架)+手动固晶或机器固晶+烘烤—机台调试—焊线—装模条+模条预热+模条吹尘+喷离模剂—至灌胶(胶水预热+配胶+胶水搅拌+胶水抽真空)—支架点胶—插支架—压支架—烘烤—出炉—前切—参数测试—后切—测试—包装—参数设定—分光—标签打印—包装封口—入库。

3、手动固晶站流程:

翻晶—扩晶—银胶解冻搅拌—排支架—点胶—固晶—烘烤;

4、点胶不良现象:漏点、点偏、银胶过多、银胶过少、杯壁粘胶;

5、固晶站不良:漏固、多固芯片、混芯片、银胶过高、银胶过低、芯片破损、芯片粘胶、位置不当、芯片刺伤、芯片倾斜、芯片翻倒、掉晶、支架变色、阳极粘胶、晶粒倒置、推力不足。

 

三、焊线站制程

1、焊线站总流程:转料—机台调试—焊线—转料

2、焊线站细部流程:

1)机台调试

2)焊线

3)焊线站不良的原因和解决方法:

常见的焊线不良:塌线、断线、虚焊、焊垫打穿、芯片松动、芯片龟裂、掉晶、尾线过长、偏焊、倒线、杂线、弧度过高、弧度过低、金球过大、金球过小、拉力不足、漏焊、掉电极、二焊过近、二焊过远;

 

四、灌胶站制程

1、灌胶站总流程;

2、灌胶站细部流程:

装模条—模条预热—模条吹尘—喷离模剂—支架粘胶—胶水预热—配胶搅拌—胶水抽真空—灌胶—插支架压支架—初烤—离模—长烤;

3、胶水不良原因和解决方法:

常见不良:胶水预热异常、模粒预热异常、配胶错误、多胶、少胶、插浅、插深、插反、杯内气泡、胶色不一、混模条、烤箱温度误差、刮伤、表面气泡、偏心、杂物、表面不良、卡点错误。

 

五、测试站制程

测试站总流程:转料—前切—参数设定—测试—点数后切—包装—入库(转料)

 

六、LED封装制程指导书

1、T/B机操作指导书;

2、AM机操作指导书;

3、模具定期保养操作指导书;

4、排测机操作指导书;

5、电子秤操作指导书;

6、搅拌机操作指导书;

7、真空机操作指导书;

8、封口机操作指导书;

9、AM自动固晶机参数范围作业指导书;

10、AM自动焊线机参数范围作业指导书;

11、扩晶机操作指导书;

12、AM自动固晶机易耗品定期更换作业指导书;

13、瓷嘴检验作业指导书;

14、自动焊线操作指导书;

15、自动固晶操作指导书;

16、手动焊线机操作指导书;

 

七、金线(或铝线)的正确使用

键合金丝是由含金99.99%的纯金拉制而成,规格齐全。它是优异电气、导热、机械性能以及化学稳定性极好的内引线材料,主要作为半导体的封装材料。

1、  正确取出金线(或铝线)和AL-4卷轴的方法与步骤:

先把手套戴上,并以垂直方向将盖子取出——把手指放入卷轴内侧——小心地从盒子中拿出卷轴,注意不要触及金线表面——按图示方向,用镊子把最后一层的黏带取出——握住卷轴内侧,把卷轴装在转轴上——把金线取出使用——取出空的卷轴——将卷轴放回塑胶盒里——将盖子盖回——将所有用过的卷轴排放回塑胶盒内——放好后把它们盖好——把盒子整齐地放在箱子里;

2、正确保存剩余金线(或铝线)和AL-4卷轴的方法与步骤:

在贴始端胶带前,卷轴的缺口必须向上放置——用适当的力度拉紧粘线,让金线与卷轴接触——贴上始端胶带,粘住金线——从胶带边缘,去除多余的金线——取出卷轴——将金线放回塑胶盒里——将盖子盖回。

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HENKEL LOCTITE HYSOL EDGEBOND SB-50 TDS

乐泰公司的一款用于EDGEBOND的胶水,关于EDGEBOND请查看此文《关于Edgebond Adhesive的应用》,不过这个型号的命名规则貌似不是乐泰的风格,看来还是HYSOL的技术基础,呵呵!

此资料里面几个与别的环氧胶不同的地方,第一个是其粘度的表征,使用的是锥板粘度计,不同剪切梯度下从12万到7千不等,如果按以往使用brookfield粘度计的比值方法,其触变岂不是有17以上了,呵呵! 难怪有个胶粘剂技术人员告诉我其实红胶用brookfield粘度计或者用流变仪测试的触变都不如锥板粘度计来得准确,以往用低转速下的粘度除以高转速下的粘度得到触变指数也只是个权宜的测试方法而已。第二个是在固化条件那一段,有一个推荐的升温速率“Recommended Ramp Rate:  30°C/ minute or less”,这个应该是针对多温区回流炉的建议,之前的胶粘剂很少会推荐这个参数,不知何故。

摘录TDS资料如下:

PRODUCT DESCRIPTION

SB-50 provides the following product characteristics:

Technology Epoxy
Appearance Black
Cure Heat cure
Product Benefits • No-flow characteristics
• Excellent adhesion
• Reworkable
• Low cure temperature
Application Edgebond
Typical Package Application Chip scale packages and BGA

SB-50 underfill material is ideal for high volume assembly processes.  As the  product  does  not  flow  under  the  solder array, it is ideal for large packages where underfill flow is challenging.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity, Cone & Plate, mPa∙s (cP)
Shear Gradient: 1 s-1                                                119,000
Shear Gradient: 10 s-1                                             19,000
Shear Gradient: 100 s-1                                          7,000

Work Life:     @ 25ºC, days                                            4
Shelf Life:      @ -20ºC, months                                    6
Flash Point – See MSDS

 

TYPICAL CURING PERFORMANCE
Cure Schedule                                                   4 minutes @ 120°C
Recommended Ramp Rate:                        30°C/ minute or less

The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties:

Coefficient of Thermal Expansion :        Below Tg, ppm/°C                                                        70
Glass Transition Temperature (Tg) by TMA, °C                                                                              30
Storage Modulus, DMA , MPa                                                                                                              1,700

GENERAL INFORMATION

For safe handling information on this product, consult the

Material Safety Data Sheet, (MSDS).

 

THAWING:

1.  After removing from the freezer, set the syringes to stand vertically while thawing.

2.  Syringes should thaw a minimum of 2 hours.

3.  DO NOT re-freeze. Once thawed, the adhesive should not be re-frozen.

 

DIRECTIONS FOR USE

1.  Dispense a bead of SB-50 along the outer corners of the component with the needle/nozzle heated to 45°C

2.  Apply only 25% of the length of the component (for a 1 mm wide component only apply 0.25 mm on each side) to obtain performance characteristics

3. Because SB-50 is thixotropic, it will not flow under the component, leaving a nice fillet on the corner of the component

Rework Procedure
1. Remove the component from the substrate by using local application of heat onto the component.
2. The recommended heat profile is identical to the profile used during initial assembly.
3. Once the solder has reached temperatures above it’s reflow temperatures, lift the component off by using a slight twisting motion.
4. The site should be cleaned, removing any excess underfill and solder remaining on the PCB site.
5. Use appropriate flux remover or solvent.
6. A non-contact, vacuum method is preferred because it minimizes potential damage to the PCB and solder-mask.
7. Total time required for component removal is about 5 to 7 minutes.
Not for product specifications
The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.

Storage
Store product in the unopened container in a dry location.  Storage information may be indicated on the product container
labeling.
Optimal Storage: -20°C. Storage below -20°C or greater than minus -20°C can adversely affect product properties.
Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
Note
The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered
by one or more United States or foreign patents or patent applications.

 

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DELO MONOPOX 1197 Construction Adhesive TDS

DELOMONOPOX® 1197

heat curing, construction adhesive

Base

–   epoxy resin, construction adhesive

–   one-component, heat-curing, filled

Use

–   for the bonding of all metal types, temperature-resistant plastic, ferrite and ceramic

–   especially for high-strength, tough-hard bondings with very high static and dynamic loading capacity, even at increased temperatures

–   for bondings requiring a high run resistance

–   the product is normally used in a temperature range of -55 °C to +200 °C; depending on the application, other limits may be more reasonable

–   compliant with RoHS directive 2002/95/EC

Processing

–   to heat the components, increased temperatures can be used, as well

–   the heating time of the components must be added to the actual curing time

–   for curing, the inside of the adhesive layer must have the required temperature

–   depending on the adhesive amount used, exothermic reaction heat is developed which can lead to overheating; in this case, the curing temperature must be reduced accordingly

–   the adhesive is supplied ready for use and can be processed well from the original container or with DELO dispensing units

–   the surfaces to be bonded must be dry as well as free of dust, grease and other contaminations

–   use DELOTHEN cleaners for the cleaning of bonding surfaces

–   adhesion to the components can be improved by sand blasting, grinding or pickling

Curing

–   curing proceeds at temperatures between +130 and +180 °C

–   increased temperatures shorten the curing process, lower temperatures extend it, and can change the properties of the cured product

Technical data
Color                                                                                                               silver grey
Filler                                                                                                               aluminum
Density [g/cm³]  at room temperature (approx. 23 °C)              1.4
Viscosity [mPas] at 23 °C, Brookfield rpm 7/5                               pasty
Processing time   at room temperature (max. 25 °C)                   6 weeks

Curing time until final strength [min]                                                 75
at 130°C in a convection oven
Curing time until final strength [min]                                                 40
at 150 °C in an air convection oven
Curing time until final strength [min]                                                  15
at 180 °C in an air convection oven
Tensile shear strength Al/Al [MPa]                                                       26
DIN EN 1465, sand-blasted
component thickness: 1.6 mm
after 40 min at +150 °C
Tensile shear strength Al/Al [MPa]                                                       55
DELO Standard 39, sand-blasted
component thickness: 6 mm
after 40 min at +150 °C

Floating roller peel resistance St/St [N/mm]                                   12
DELO Standard 38, sand-blasted
component thickness: 1.5 mm
Temperature stability Al/Al at +50 °C [MPa]                                   33
according to DIN EN 1465, sand-blasted
component thickness: 1.6 mmm
Temperature stability Al/Al at +100 °C [MPa]                                 22
according to DIN EN 1465, sand-blasted
component thickness: 1.6 mm
Temperature stability Al/Al at +150 °C [MPa]                                 5
according to DIN EN 1465, sand-blasted
component thickness: 1.6 mm

Tensile strength [MPa]                                                                                 40
according to DIN EN ISO 527
layer thickness: 2 mm
after 40 min at +150 °C
Elongation at tear [%]                                                                                    1.4
according to DIN EN ISO 527
layer thickness: 2 mm
after 40 min at +150 °C
Young’s modulus [MPa]                                                                                3300
according to DIN EN ISO 527
layer thickness: 2 mm
after 40 min at +150 °C
Shore hardness D                                                                                             67
according to DIN EN ISO 868
after 40 min at +150 °C
Decomposition temperature [°C]                                                             280
DELO Standard 36
Ball indentation hardness [MPa]                                                                95
ISO 2039, part 1
Glass transition temperature [°C]                                                              140
rheometer
Coefficient of linear expansion [ppm/K]                                                   93
TMA, in a temperature range of +25 to +140 °C
Coefficient of linear expansion [ppm/K]                                                   65
TMA, in a temperature range of +30 to +90 °C
Coefficient of linear expansion [ppm/K]                                                    171
TMA, in a temperature range of +130 to +150 °C
Shrinkage [vol. %]                                                                                                 3.0
DELO Standard 13
Water absorption [weight %]                                                                            0.1
according to DIN EN ISO 62
after 40 min at +150 °C
Dielectric strength [kV/mm]                                                                               2

VDE 0303, part 2, after 40 min at +150 °C
Dielectric constant                                                                                                   3.6
VDE 0303, part 4, after 40 min at +150 °C
Creep resistance CTI                                                                                                125M
VDE 0303, part 1, IEC 112, after 40 min at +150 °C
Storage life at 0 °C to +8 °C                                                                                     6 months
in unopened original container

Instructions and advice

General

The data and information provided are based on tests performed under laboratory conditions. Reliable information about the behavior of the product under practical conditions and its suitability for a specific purpose cannot be concluded from this.

Many product properties are subject to temperature and may change permanently, especially at high temperatures.

It is the user’s responsibility to test the suitability of the product for the intended purpose and temperature range of use by considering all specific requirements. Type and physical and chemical properties of the materials to be processed with the product, as well as all actual influences occurring during transport, storage, processing and use, may cause deviations in the behavior of the product

compared to its behavior under laboratory conditions. All data provided are typical average values or uniquely determined parameters

measured under laboratory conditions.

The data and information provided are, therefore, no guarantee for specific product properties or the suitability of the product for a specific purpose.

Instructions for use

The instructions for use of DELOMONOPOX are available on: www.DELO.de. We will be pleased to send them to you on demand.

Occupational health and safety

see material safety data sheet

Specification

see quality assurance test report

 

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第二章 LED的封装原物料

一、LED芯片构造

LED芯片是半导体发光器件LED的核心部件,它主要有砷(AS)、铝(AL)、镓(Ga)、铟(IN)、磷(P)、氮(N)、锶(Sr)这几种元素中的若干种组成。法国二极管芯片制作方法和材料的磊晶种类:

◆LPE: Liquid Phase Epitaxy(液相磊晶法)GaP/GaP;

◆VPE: Vapor Phase Epitaxy(气相磊晶法)GaAsP/GaAs;

◆MOVPE: Metal Organic Vapor Phase Epitaxy(有机金属气相磊晶法)AlGaInP/GaN;

◆SH: Single Heterostructure(单异型结构)GaAlAs/GaAs;

◆DH: Double Heterostructure(双异型结构)GaAlAs/GaAs;

不同LED芯片,其结构大同小异,有基板(蓝宝石基板、碳化硅基板等)和掺杂的外延半导体材料及透明金属电极等构成。

1、  LED单电极芯片;

2、  LED双电机芯片;

3、  LED的晶粒种类简介:不同材料晶粒,具有不同带隙,即具有不同发光波长;

4、  LED衬底材料的种类:蓝宝石(Al2O3)、硅(Si)、碳化硅(SiC);

1)蓝宝石衬底有许多优点及缺点:

a.生产技术成熟、器件质量较好;

b.稳定性很好,能运用在高温生长过程中;

c.机械强度高,易于处理和清洗;

d.晶格失配和热应力失配,会在外延层中产生大量缺陷,同时给后续的器件加工工艺造成困难;

e.常温电阻率较大,无法制作垂直结构的器件,通常只在外延层上表面制作电极;

f.硬度非常高,减薄和切割较困难;导热性能不是很好。

2)硅衬底

目前有部分LED芯片采用硅衬底。硅衬底的芯片电极可采用两种接触方式,分别是L接触(Laterial-contact,水平接触)和V接触(Vertical-contact,垂直接触)。

3)碳化硅衬底

碳化硅衬底的LED芯片电极是L型电极,电流是纵向流动的,采用这种衬底制作的器件的导电和导热性能都非常好,有利于做成面积较大的大功率器件,但是相对于蓝宝石衬底而言,碳化硅制造成本较高,实现商业化还需要降低相应的成本。

4)三种衬底的性能比较:

衬底材料

导热系数

膨胀系数

稳定性

导热性

成本

抗静电能力

蓝宝石

46

1.9

一般

一般

150

5~20

碳化硅

490

-1.4

5、  LED芯片的制作流程:

1)光刻—等离子体蚀刻GaN—扩散和键合—镀金—晶圆芯片—抛光—检验—划片—崩裂—晶粒;

2)磊晶加热—干式蚀刻分离—透明层—p电极连接—n电极连接—测量—衬底研磨—划片—封装;

6、制作LED垒芯片方法的比较;

7、常用芯片见图:

1)单电极芯片:

a.圆电极芯片

b.方电极芯片;

c.带角电极芯片;

2)双电极芯片

 

二、Lamp—LED支架介绍

支架的作用:用来导电和支撑晶片;

支架的组成:一般来说是由支架素材经过电镀而形成,由里到外是素材、铜、镍、铜、银这五层;

1、Lamp—LED支架结构与相关尺寸

1)、LED支架图;

2)、LED支架说明;

3)、尺寸说明;

4)、LED支架材质;

5)、支架电镀知识;

6)、支架管控相关条件;

2、常用支架外观图集

3、LED支架进料检验内容:

数量短少、混料、生锈变色、镀层起泡脱落、弯曲变形、支架扇形弯曲、支架倾斜、支架压伤、支架刮伤、碗口变形、凹凸不平、阴阳极变形、冲压不良、电镀不均、支架污染、支架烧焦、碗底粗糙、脚弯曲、支架粗糙、银残留、支架弯头、支架毛边、支架异物(脚及下Bar发白)、支架电镀过薄、烘烤检验、焊线耐热试验。

 

三、LED模条介绍

1、模条的作用与模条简图

模条是LED成形的模具,一般有圆形、方形、塔形等,支架植得深还是浅由模条的卡点高低所决定,模条需存放在干净及室温以下的环境中,否则会影响产品外观;

2、模条结构说明:导柱、钢片、胶杯、卡点;

3、模条尺寸:

1)模条材质:塑料(TPX材质);

2)TPX物料简介:TPX如同PC、PMMA,具有极佳的透明度,但PC和PMMA是非结晶型,而TPX是结晶的材料,且在物理上有相当的差异存在;

3)TPX在以模具成型时要注意以下几点:

a.TPX具有极佳的耐热性、耐化学品及耐蒸汽性等,且TPX在透光性聚合物中比重最轻;

b.TPX的耐击性和PS及PMMA相当,TPX是结晶型材料,所以比其他非结晶型材料有更大的收缩率。

4)开模注意事项;

5)LED封装成形:圆形LED、方形LED、平头LED、椭圆LED、子弹头LED、内凹LED、特殊型LED;

6)模条进料检验内容:

型号不符、模条混装、模粒内表面模糊、模粒内表面刮伤、模粒裂痕、模粒帽檐破损、硅钢片生锈、硅钢片变形、模条底部塑料残留、卡点脱落、导柱脱落、圆缺边方向错位、卡点误差过大)插深或插浅)、中心间距不等(封胶实验有偏心)、胶杯成形不良(封胶实验有光斑不良)。

 

四、银胶和绝缘胶

银胶是用来导电、散热和固定芯片的;绝缘胶除了不导电外,也是用来散热和固定芯片的。因为在LED封装过程中的作用不同,因此所用位置也不同。

1、  银胶和绝缘胶的包装;

2、  银胶和绝缘胶的成分;

3、  银胶和绝缘胶的作业条件

4、  操作标准及注意事项;

5、  银胶及绝缘胶烘烤注意事项:

a.必须一次性烤干,若有软化、松动现象,为前一次未烤干,取出材料后空气进入银胶再次加温膨胀导致结合度变差;

b.烘干硬化后不能立即从烘箱中取出,应待自然冷却后再取出;

c.烘烤时注意时间不能过长过短,进出烘箱时都需落实做好记录,IPCQ做好监督。

6、银胶与绝缘胶的区别:

a.银胶需要搅拌,绝缘胶不需要搅拌;

b.银胶硬化速度比绝缘胶慢,银胶推力比绝缘胶小;

c银胶散热性较好,绝缘胶散热性较差;

d.银胶较绝缘胶吸光性强,反光性弱,成形产品中银胶亮度较绝缘胶低;

e.银胶推力较小,绝缘胶推力较大;

f.绝缘胶可与荧光粉混合后在一起配制成杯底绝缘胶做白光。

 

五、焊接线—金线和铝线

在封装LED时需要用金线或铝线把芯片两个电极和LED支架焊接起来,这才能把电源通过支架加到LED芯片上。

1、  金线和铝线图样和简介:金线和铝线都可以作为LED芯片与支架间的连接线。金线电阻率比铝线电阻率小,在LED功率比较大或要求电参数比较高的场合往往使用金线,其他场合可以使用比较廉价的铝线。

2、  经常使用的焊线规格;

3、  金线应用相关知识:

1)  焊线示意图;

2)  焊球相关名词定义;

3)  线尾切断方式;

4)  金线原材料质量会影响到焊球;

4、  金线的相关特性:金线在高温下焊接加热时间过长,其结合力会下降。金线放置时间越长与芯片的结合力越低。

5、  金线制造商检测金线的几种方法:在实验金线的延展力、柔韧力及焊球结合力时,通过不同的打线方式来检测—段式焊线、超低式焊、超长式焊线、超短式焊线;

6、  LED封装厂家检验金线的方法:LED生产厂家为了保证金线预先片焊接良好,在使用金线前和使用过程中都要对金线进行检测,检测内容包括焊线拉力、焊点、球颈及色泽。

 

六、封装胶水

1、LED封装经常使用的胶水型号

1)宜加化工生产的部分胶水简表;

2)包装图示;

2、胶水相关知识

1)胶的种类及成分;

2)胶水的应用过程;

3)宜加2015胶水相关特性参数;

4)环氧树脂化学分子式;

5)玻璃态转化温度(Tg)

a.对转化温度的定义:但高分子材料由硬而脆之玻璃状态,转变成软而韧之橡胶状态时,其温度范围称之为玻璃态转化温度;

b.曲线说明:但T>Tg是橡胶状态,但T<Tg是玻璃状态

◆可由玻璃态转化温度来预期温度循环、热冲击、及产品使用温度;

◆玻璃态转化温度与使用条件有关,亦与硬化情形有关;

◆玻璃态转化温度高于使用温度5%~10%较适合;

◆当同一配方,其所得硬化物玻璃态转化温度越高时,交联密度较高;

◆硬度越高,对机械或者热应力而言较脆;

◆收缩越大,内应力越大;

◆吸湿性较高;

◆使用寿命下降;

◆预期温度循环下降;

c.Tg与时间的关系图:开始随时间非线性增长,后来随时间略有下降;

d.玻璃态转化温度测试图:差式扫描热量法;

e.吸水与不吸水的Tg进行比较

6)辅助说明

a.通常而言,我们所说的Tg点是取转化区域的中心值,这一温度确切的说是以区域进行表示,而不是由单一点的数值进行表示的;

b.环氧树脂的化学性质称为附加的化学性质;

c.固化不足对环氧树脂的影响;

d.后期固化周期;

7)胶水的操作寿命及反应速率:

a.操作寿命的定义:操作寿命指环氧化合物的黏度超过可使用范围的极限时,通常用cps来表示,此外,温度是一主要的因素;

b.操作寿命具体说明:A/B胶混合后,黏度上升至起始黏度两倍时(黏度上升至无法操作时);

c.反应速率具体说明:多数环氧树脂的反应速率,将会每增加10度的温度就增长一倍,加热环氧树脂通常用来降低黏度,使其达到易除气泡的目的;

d.凝胶点:反应进行中,分子量迅速增加,且最后使得几条分子链连接在一起,成为极大的分子量网状系统,由一粘性的液体变成一有弹性的胶状,将呈现极大网状系统的主要现象,这种迅速且无法改变的变化,称为凝胶点。

8)胶水的硬化

a.定义:硬化在化学上属于完全反应,在工业上使用时,指能得到最佳性能所需的硬化程度;

b.硬化温度对LED的影响

◆前硬化温度太低:凝胶化与玻璃化同时发生,当温度再增高,可能仍会呈液体状;转化率不够,硬化不完全,且所需时间太长;

◆前硬化温度适中:硬化反应速率慢,微粒凝胶大;Tg与硬化温度相同;网状结构密度大;抗化学性高及各种物性优异;

◆硬化温度过高:放热量大,聚温太高,造成边缘与中心温差大;硬化速率太快,微粒凝胶小;网状结构密度小,Tg低;抗化学性低,物性差。

9)胶水的保存条件(环氧树脂系统及相关材料)

a.必须保存在原来的容器里;

b.应避免过热;

c.应避免太阳直接照射;

d.扩散剂Dp(Diffusant paste)内含易于沉淀的填充料,绝对需要先搅拌均匀再取用;

e.建议使用冷藏的方式来保存单液型的原料(银胶)

f.二液型的原料(A\B胶)不需要冷藏,冷藏保存将导致某些原料结晶;

10)胶水使用注意事项;

11)不同胶水组合形成胶体外观方式;

12)胶水Tg点实验图示;

13)LED制造厂对胶水的需求及胶水制造商的潜质问题:

a.LED制造厂对胶水的需求:

◆缩短加工时间;

◆增加模具的使用次数:增加产量;降低成本。同时通过改变树脂配方及提高硬化温度的方法来达到想要的效果;

b.提高硬化温度的潜在问题:

◆树脂硬化反应太紊乱的倾向;

◆网状结构的内部应力增加;

◆温度偏高导致架桥反应与裂解反应相互竞争;

◆硬化物的机械、物理、电气、热稳定性等性质普遍降低。

 

 

0

HENKEL LOCTITE Hysol E-120HP&E-60HP TDS

PRODUCT DESCRIPTION
LOCTITE® Hysol® Product E-60HP is a toughened, mediumviscosity,industrial grade epoxy adhesive with extended work life. Once mixed, the two-component epoxy cures at room temperature to form a tough, off-white, bondline which provides high peel resistance and high shear strengths. The fully cured epoxy is resistant to a wide range of chemicals and solvents, and acts as an excellent electrical insulator.

TYPICAL APPLICATIONS
The high performance epoxy provides excellent bond strengths to a wide variety of plastics and metals. Ideal for general purpose industrial applications requiring extended work life for adjusting parts during assembly.

PROPERTIES OF UNCURED MATERIAL
Resin                                                                                                        Typical
Value                              Range
Chemical Type                                                                  Epoxy
Appearance                                                                Pale yellow liquid
Specific Gravity @ 25°C                                                1.00                                0.9 to 1.1
Viscosity @ 25°C, mPa.s (cP)                                     67,500                      50,000 to 85,000
Flash Point (TCC), °C (°F)                                              >93 (>200)

Hardener                                                                                                Typical
Value                                Range
Chemical Type                                                                 Amine
Appearance                                                                 Yellow liquid
Specific Gravity @ 25°C                                                1.00                                 0.9 to 1.1
Viscosity @ 25°C, mPa.s (cP)                                    7,000                          5,500 to 8,000
Flash Point (TCC), °C (°F)                                          >93 (>200)

Mixture                                                                                              Typical Value
Appearance                                                                                          Off-white
Specific Gravity @ 25°C                                                                      1.00
Mix Ratio (R:H) by Weight                                                               100 to 50
by Volume                                                                2 to 1

 

TYPICAL CURING PERFORMANCE
Cure speed
The graph below shows the shear strength developed over time on abraded, acid etched aluminum lap shears with an average bondline gap of 3 to 9 mils and tested according to ASTM D-1002.

Curing Properties
(@ 25°C unless noted)                                                   Typical Value
Working Life, minutes                                                           60
Tack Free time, minutes                                                      120

TYPICAL PROPERTIES OF CURED MATERIAL
(@ 25°C unless noted)
Physical Properties                                                         Typical Value
Dielectric Strength, Volts/Mil                                              500
Tensile Strength ASTM D638, psi                                      5,100
Tensile Elongation ASTM D-638, %                                       9
Hardness ASTM D-1706, Shore D                                          80
Glass Transition Temperature, Tg, °C                                  70

PERFORMANCE OF CURED MATERIAL
Shear Strength vs Substrate
(Substrates cured for 5 days @ 22°C)
Substrate                                                                                                 Typical Value
Lapshear                                                                                              N/mm2                  (psi)
Grit-Blasted Steel                                                                                 29.8                      4320
Aluminum (Abraded/Acid Etched, 3 to 9 mil gap)               29.9                       4340
Aluminum (Anodized)                                                                       17.9                      2600
Stainless Steel                                                                                        26.8                      3890
Polycarbonate                                                                                       12.6                      1830
Nylon                                                                                                          1.9                          270
Wood (Fir)                                                                                                 11.3                      1640
Block Shear                                                                                          N/mm2                    (psi)
PVC                                                                                                              11.8                         1710
ABS                                                                                                              12.8                         1850
Epoxy                                                                                                         28.8                         4030
Acrylic                                                                                                        1.0                          150
Glass                                                                                                             31.7                       4590

TYPICAL ENVIRONMENTAL RESISTANCE
Hot Strength
Test procedure :                                                            ASTM D-1002
Substrate:                                                                        Abraded, acid etched aluminum
Bondline gap, mils:                                                      3 to 9
Cure procedure:                                                            12 hours at 65°C & 4 hours at 22°C

Heat Aging
Cured for 5 days at 22°C on steel with no induced gap, aged at temperature indicated and tested at 22°C.

Chemical / Solvent Resistance
Cured for 5 days at 22°C on steel with no induced gap, aged under conditions indicated and tested at 22°C.
Solvent                                                              Temp.                                       % Initial Strength retained at
500 hr                         1000 hr
Air                                                                       87°C                                                    –                                    120
Motor Oil (10W-30)                                     87°C                                                 138                                  146
Unleaded Gasoline                                        87°C                                                 99                                   125
Water/Glycol (50%/50%)                         87°C                                                  102                                110
Salt/Fog ASTM B-117                                  22°C                                                     –                                     81
95% Relative Humidity                              38°C                                                      –                                     116
Condensing Humidity                                 49°C                                                      –                                      94
Water                                                                 22°C                                                      –                                      94
Acetone                                                            22°C                                                     77                                   93
Isopropyl Alcohol                                       22°C                                                     91                                    104

GENERAL INFORMATION
This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials.
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
Directions for use
1. For high strength structural bonds, removal of surface contaminates such as paint, oxide films, oils, dust, mold release agents and all other surface contaminates.
2. Use gloves to minimize skin contact. DO NOT use solvents for cleaning hands.
3. Dual Cartridges: To use simply insert the cartridge into the application gun and start the plunger into the cylinders using light pressure on the trigger. Next, remove the cartridge cap and expel a small amount of adhesive to be sure both sides are flowing evenly and freely. If automatic mixing of resin and hardener is desired, attach the mixing nozzle to the end of the cartridge and begin dispensing the adhesive. For hand mixing, expel the desired amount of the adhesive and mix thoroughly. Mix approximately 15 seconds after uniform color is obtained. Bulk Containers: Mix thoroughly by weight or volume in the proportions specified in Properties of Uncured Material section. Mix vigorously approximately 15 seconds after uniform color is
obtained.
4. For maximum bond strength apply adhesive evenly to both surfaces to be joined.

5. Application to the substrates should be made within 60 minutes. Larger quantities and/or higher temperatures will reduce this working time.
6. Join the adhesive coated surfaces and allow to cure at 25°C (77°F) for 24 hours for high strength. Heat up to 93°C  (200°F), will speed curing.
7. Keep parts from moving during cure. Contact pressure is necessary. Maximum shear strength is obtained with a 3-9 mil bond line.
8. Excess uncured adhesive can be cleaned up with ketone type solvents.
Storage
Product shall be ideally stored in a cool, dry location in unopened containers at a temperature between 8°C to 28°C (46°F to 82°F) unless otherwise labeled. Optimal storage is at the lower half of this temperature range. To prevent contamination of unused product, do not return any material to its original container. For further specific shelf life information, contact your local Technical Service Center.

Data Ranges
The data contained herein may be reported as a typical value and/or range. Values are based on actual test data and are
verified on a periodic basis.

 

乐泰的双组分胶接触不多,但从TDS看有些也是很多年前就有的产品,今天碰到一个客户用于金属和玻璃的粘接,可耐温150度。日本客户指定,50cc单价约100元,记录之!

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0

HUNSTMAN ARALDITE 2011 (AW106/HV953U) TDS&MSDS

Araldite® 2011 (AW 106/HV 953U)

Two component epoxy paste adhesive

Key properties            ·     High shear and peel strength

  •  Tough and resilient
  •  Good resistance to dynamic loading
  •  Bonds a wide variety of materials in common use

 

 

Description                 Araldite 2011 is a multipurpose, two component, room temperature curing, paste adhesive of high strength and toughness.It is suitable for bonding a wide variety of metals, ceramics, glass, rubber, rigid plastics and most other materials in common use. It is a versatile adhesive for the craftsman as well as most industrial applications.

 

Product data

2011/A

2011/B

2011 (mixed)
Colour (visual) Specific gravity Viscosity (Pas)Pot Life (100 gm at 25°C)

Shelf life (2-40°C)

neutral ca. 1.15

30-50

3 years

pale yellow ca. 0.95

20-35

3 years

pale yellow ca. 1.05

30-45

100 minutes

 

Processing                 Pretreatment

The strength and durability of a bonded joint are dependant on proper treatment of the surfaces to be bonded. At the very least, joint surfaces should be cleaned with a good degreasing agent such as acetone, iso-propanol (for plastics) or other proprietary degreasing agents in order to remove all traces of oil, grease and dirt.Low grade alcohol, gasoline (petrol) or paint thinners should never be used.The strongest and most durable joints are obtained by either mechanically abrading or chemically etching (“pickling”) the degreased surfaces. Abrading should be followed by a second degreasing treatment

 

Mix ratio Parts by weight Parts by volume
Araldite 2011/A Araldite 2011/B 10080 100100

Resin and hardener should be blended until they form a homogeneous mix. Resin and hardener are also available in cartridges incorporating mixers and can be applied as ready-to-use adhesive with the aid of the tool recommended by Huntsman Advanced Materials.

Application of adhesive

The resin/hardener mix is applied with a spatula, to the pretreated and dry joint surfaces.A layer of adhesive 0.05 to 0.10 mm thick will normally impart the greatest lap shear strength to the joint.The joint components should be assembled and clamped as soon as the adhesive has been applied. An even contact pressure throughout the joint area will ensure optimum cure.

Mechanical processing

Specialist firms have developed metering, mixing and spreading equipment that enables the bulk processing of adhesive.We will be pleased to advise customers on the choice of equipment for their particular needs.

Equipment maintenance

All tools should be cleaned with hot water and soap before adhesives residues have had time to cure. The removal of cured residues is a difficult and time-consuming operation.If solvents such as acetone are used for cleaning, operatives should take the appropriate precautions and, in addition, avoid skin and eye contact.

 

Times to minimum shear strength

Temperature                             °C                10               15               23               40               60              100

 

Cure time to reach                 hours            24               12                7                 2                  –                – LSS > 1N/mm2                                                  minutes             –                 –                 –                 –                30                6

Cure time to reach                 hours            36               18               10                3                  –                – LSS > 10N/mm2                                               minutes             –                 –                –                –                45                7

LSS = Lap shear strength.

 

Typical cured properties

Unless otherwise stated, the figures given below were all determined by testing standard specimens made by lap-jointing 170 x 25 x 1.5 mm strips of aluminium alloy. The joint area was 12.5 x 25 mm in each case. The figures were determined with typical production batches using standard testing methods. They are provided solely as technical information and do not constitute a product specification.

……

 

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