ECCOBOND D125F provides the following product characteristics:
|Product Benefits||• Low exotherm
• Low water absorption
• No stringing
• High hot strength
• High speed dispensing
• Low cure temperature
|Application||Surface mount adhesive|
|Operating Temperature||-40 to 105 °C|
|Chip capacitors, Chip resistors, SOTs, SOICs and PLCCs|
ECCOBOND D125F surface mount adhesive is designed for high speed dispensing.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield , 25 °C, mPa·s (cP):
Speed 1 rpm, #TD 1,500,000 to2,000,000
Speed 10 rpm, #TD 300,000 to 400,000
Calculated Yield (Bingham), mPa·s (cP) 300,000 to 400,000
Specific Gravity 1.25 to 1.3
Hegman Fineness, µm <50
@ 0 to 8ºC, months 6
@ 18 to 25ºC, months 2
Flash Point – See MSDS
TYPICAL CURING PERFORMANCE
IR or Convection Conveyor Oven
20 minutes @ 100°C or
7 minutes @ 110°C or
2.5 minutes @ 120°C or
1.5 minutes @ 150°C
Convection Box Oven
30 minutes @ 100°C or
20 minutes @ 110°C or
10 minutes @ 120°C or
5 minutes @ 150°C
Note: A ramp up temperature of not more than 1°C per second should be used.
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
|TYPICAL PROPERTIES OF CURED MATERIAL
|Coefficient of Thermal Expansion ASTM D 3386: Below Tg, ppm/°C||55 to 60|
|Glass Transition Temperature, ISO 11357-2, °C||85|
|Coefficient of Thermal Conductivity, W/(m·K)||0.3|
|Shore Hardness, ISO 868, Durometer D||>80|
|Linear Shrinkage, , %||0.5|
|Degree of Conversion by DSC, %: 3 minutes @ 125°C||>90|
Dielectric Constant IEC 60250: 1mHz 3.5
Volume Resistivity, IEC 60093, Ω·cm 1×1014
TYPICAL PERFORMANCE OF CURED MATERIAL
Lap Shear Strength , ISO 4587: Aluminum @ 25 °C N/mm² >8 (psi) (>1,160)
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
1. Allow material to reach room temperature before use.
DIRECTIONS FOR USE
1. ECCOBOND D125F can be applied by dispensing, pin transfer, screen or stencil printing.
2. Equipment set-up and related product information is available from your Henkel Corporation support group.
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.
Optimal Storage : 0 to 8 °C
Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.
Not for product specifications
The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation and its affiliates (“Henkel”) specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel products. Henkel specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.
Hysol ECCOBOND D125F TDS (69.6 KB, 10 次)