一款不大常见的汉高旗下的SMT粘接剂，不过不是在乐泰品牌下而是在HYSOL品牌下，并且其颜色也不是传统的红色，而是黄色的，貌似之前只见过贺利氏Heraeus旗下有黄色的贴片胶，而且主要是用于刷胶用途。而HSYOL 此款D125F是用于点胶的，有兴趣了解的朋友可以到文章末尾下载TDS查看之：

PRODUCT DESCRIPTION
ECCOBOND D125F provides the following product characteristics:

Technology	Epoxy
Appearance	Yellow
Components	One-component
Product Benefits	• Low exotherm • Low water absorption • No stringing • High hot strength • High speed dispensing • Low cure temperature • Non-sag
Cure	Heat Cure
Application	Surface mount adhesive
Operating Temperature	-40 to 105 °C
Typical Assembly Applications	Chip   capacitors,   Chip    resistors, SOTs, SOICs and PLCCs

 

ECCOBOND D125F surface mount adhesive is designed for high speed dispensing.

 

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity, Brookfield , 25 °C, mPa·s (cP):

Speed 1 rpm, #TD                                           1,500,000 to2,000,000

Speed 10 rpm, #TD                                         300,000 to 400,000

Calculated Yield (Bingham), mPa·s (cP)             300,000 to 400,000

Specific Gravity                                                               1.25 to 1.3

Hegman Fineness, µm                                                    <50

Shelf Life:

@ 0 to 8ºC, months                                                   6

@ 18 to 25ºC, months                                               2

Flash Point – See MSDS

TYPICAL CURING PERFORMANCE

IR or Convection Conveyor Oven

20 minutes @ 100°C or

7 minutes @ 110°C or

2.5 minutes @ 120°C or

1.5 minutes @ 150°C

Convection Box Oven

30 minutes @ 100°C or

20 minutes @ 110°C or

10 minutes @ 120°C or

5 minutes @ 150°C

Note: A ramp up temperature of not more than 1°C per second should be used.

 

The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

TYPICAL PROPERTIES OF CURED MATERIAL Physical Properties:
Coefficient of Thermal Expansion ASTM D 3386: Below Tg, ppm/°C	55 to 60
Glass Transition Temperature, ISO 11357-2, °C	85
Coefficient of Thermal Conductivity,   W/(m·K)	0.3
Shore Hardness, ISO 868, Durometer D	>80
Linear Shrinkage, , %	0.5
Degree of Conversion by DSC, %: 3 minutes @ 125°C	>90

 

Electrical Properties:

Dielectric Constant IEC 60250:    1mHz                                                               3.5

Volume Resistivity, IEC 60093, Ω·cm                                                                 1×1014

TYPICAL PERFORMANCE OF CURED MATERIAL
Lap Shear Strength , ISO 4587:   Aluminum @ 25 °C                                       N/mm² >8     (psi) (>1,160)

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

THAWING:

1.  Allow material to reach room temperature before use.

DIRECTIONS FOR USE

1.  ECCOBOND D125F can be applied by dispensing, pin transfer, screen or stencil printing.

2.  Equipment  set-up  and  related  product  information  is available from your Henkel Corporation support group.

Storage

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.

Optimal Storage : 0 to 8 °C

Material removed from containers may be contaminated during use.  Do not return product to the original container.  Henkel Corporation cannot assume responsibility for product  which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please   contact   your   local   Technical   Service   Center   or Customer Service Representative.

Not for product specifications

The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.

 

Conversions

(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm²  x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP

 

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation and its affiliates (“Henkel”) specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel products. Henkel specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted  as  representation  that  they  are  free  from domination of patents owned by others or as a license under any Henkel patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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