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HENKEL HYSOL E1470 TDS&MSDS

找到这款产品是因为有个客户咨询到LCP材料的粘接,我在网上找了半天,后来发现hysol这款产品是专门针对LCP及有机硅粘接的型号,不过此胶水资料显示的是环氧体系的。 关于LCP材料,网上的内容也不是太多,简单理解成为液晶聚合物,关于LCP网上搜集了一些资料,会在另一篇博客中再详述,先将此份资料摘录如下,有兴趣的朋友可以下载附件查看之:

 

PRODUCT DESCRIPTION
E1470 provides the following product characteristics:

Technology Epoxy
Appearance Off-white
Components One-component
Product Benefits • Thermosetting
• B-Stageable
• Controlled particle size
• Controlled rheology
• Sag resistant
• Excellent adhesion
• Non-conductive
Cure Heat Cure
Application Assembly
Surfaces LCP, Silicon, Metals, Aluminum and Plastics
Typical Package Application Component attach and Lid seal

E1470 adhesive is designed for component attach and lid seal applications. E1470 can be applied by syringe dispense and cured in conventional batch oven or continuous IR convection oven at low temperatures.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity , AR 1000, mPa∙s (cP)                                       12,000
Shear Thinning Index (Rheometer)                                    2.1
Shelf Life:  @ -20ºC (wet), months                                        3
Pot Life: @ 25ºC (wet), weeks                                                  1
@ 25ºC (dry), months                                               1
Flash Point – See MSDS
TYPICAL CURING PERFORMANCE
Recommended B-Stage Condition         45 minutes @ 100°C – Batch
Cure Schedule                                                5 minutes @ 180°C
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Glass Transition Temperature ,DMA, °C                                     85
Thermal Conductivity, W/mk                                                         0.2
Water Absorption, %:  85°C/85 RH                                                2
Thermal Decomposition TGA, °C                                                    300

TYPICAL PERFORMANCE OF CURED MATERIAL
Lap Shear Strength :
LCP                                      N/mm² 13                         (psi) (1,900)
Gold                                    N/mm² 17                         (psi) (2,500)
Ceramic                             N/mm² 16.5                     (psi) (2,400)

PERFORMANCE AND RELIABILITY DATA
Gross Leak Results   1,000 hours, 85°C/85 RH, 150°C     Pass

GENERAL INFORMATION
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
THAWING:
1. Allow material to reach room temperature before use.
DIRECTIONS FOR USE
1. E1470 is sag resistant and can be dispensed on vertical surfaces like the edge of a lid.
2. B-stage using a conventional batch oven, then cure in a batch oven or continuous IR convection oven.
3. E1470 can be dispensed on the underside of a lid or component and dried to tack-free. In this state, the pre-applied adhesive can be stored and/or shipped to another location for attachment.
Not for product specifications
The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.
Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.
Optimal Storage: -20 °C
Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.

Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
Note
The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

 

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