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【扒一扒】日本高纯球形硅微粉材料生产商
—— anndi

《【扒一扒】日本高纯球形硅微粉材料生产商》:  作为一种无机非金属矿物功能性粉体材料,硅微粉广泛应用于电子材料、电工绝缘材料、胶黏剂、特种陶瓷、精密铸造、油漆涂料、油墨、硅橡胶等领域。 目前,世界上只有中国、日本、韩国、美国等少数国家具备硅微粉生产能力... 全文 ?

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3M Optically Clear Adhesives (Contrast Enhancement Film)

最近开始学习了解手机和触屏上的一些用胶点,其中光学透明胶OCA是一个重要应用点,找了一些资料来慢慢学习! 这份《3M Optically Clear Adhesives (Contrast Enhancement Film)》是在2007年时3M公司就发布的资料,世界级的公司始终走在前面的!主要内容如下:

OCA Product Description
Adhesive Transfer Tape (ATT) Format or Double Coat
ATT = Unsupported adhesive sandwiched between two release liners
Formulated for Optical Applications
– Transparent and non-yellowing
– Bonds well to common display polymers and glass
– Bonds well to printed and coated surfaces
Manufactured for Optical Applications
– Clean room or clean practices to minimize defects
–No gels or voids
–Precision coating for uniform caliper
–Clean room ready packaging

几个专有缩写:

ATT—Adhesive Transfer Tape
CEF—Contrast Enhancement Film
OCA—Optically Clear Adhesive
ASF—Anti-splinter film
HTMF—High Transmission Mirror Film
LOCA—Liquid Optically Clear Adhesive
3M Solutions for Touch

Protective tape 
3M Novec  EGC 1720 Electronic Coating
Anti Splinter Film
High Transmission Mirror Film
Trizact Diamond Tile
Optically Clear Adhesive
Contrast Enhancement Film
8880 Ultra Transparent EMI Film
Double Coated Bonding Tapes 
Anisotropic Conductive Film 
Labels

点击下载附件查看之:

  3M OCA FOR TP (3.3 MB, 22 次)
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华为网盘下载:http://dl.dbank.com/c01hiu3bee

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美国赫能HERNON Tuffbond 395 TDS

Product Description

Hernon  Tuffbond  395 is a single component, high temperature resistant, heat activated epoxy. It cures to a high performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond  395 will change from amber-yellow to a reddish brown upon cure.

Bonding the voice coil to the cone has been a challenge for  engineers,  specifically  when  the  adhesive temperature resistance requirement is above 200ºF (93ºC). Two component epoxy has been most commonly used for this application, but limitations such as mixing ratio, cure speed, potential solidification in equipment and static mixers and the need for equipment flushing solvents have made Tuffbond  395 more practical.

Product Benefits
High temperature resistance.
Single component (no mixing, no pot life). Solventless.
Cures on demand (heat cure).
Will not slip during cure.
Fast setting: 1.5 minutes at 150oC bondline. Changes color upon cure (yellow to brown). Excellent adhesion to various substrates. Gives high shear.
Low water absorption. Very rigid.
Low density.
No porosity upon cure.

Typical Properties (Uncured)

Property Value
Resin Epoxy
Appearance Amber-yellow paste
Viscosity @ 25ºC, cP 340,000 to 370,000
Specific gravity 1.23
Flash point See MSDS

Curing Characteristics

Tuffbond  395 can be cured by infra-red or convection oven.  Cure  time  will  depend  on  the  bondline temperature.

Temperature, ºC (ºF) Cure Time, minutes
150 (300)

≤1.5

100 (212)

≤10

Typical Properties (Cured)

Property

Value

Heat Resistance, ºC (ºF)

204 (400)

Elongation, %

6.1

Typical Cured Performance

Shear Strength, ISO 4587

Cured 5 minutes at 150ºC

Substrate Shear Strength, N/mm² (psi)
Steel 13.8 (2000)
Aluminum 12.4 (1800)

 

Typical Environmental Resistance

Chemical/Solvent Resistance

Shear Strength, gritblasted steel, ISO 4587

Cured 2 minutes at 150ºC

30 days immersion in chemical/solvent

Chemical/Solvent % Initial Strength Retained
Water

100

Sulfuric Acid

99

Ammonia, 25%

99

Methanol

97

Xylene

98

 

点击下载PDF文件:

  hernon 395 (54.3 KB, 6 次)
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华为网盘下载:http://dl.dbank.com/c0f4j5krwm
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3M Scotch-WeldTM Epoxy Adhesives DP-100 Series TDS

最近有朋友咨询到镁合金与塑胶的粘接,查了一下,貌似3M公司DP100系列可以胜任,在其官网找到了两份TDS,有一个型号是1998年推出的型号,后面在2009年又推出了升级版的型号! 摘录TDS如下,如有兴趣到文章末尾下载PDF文件查看之:

Product Description          3M™ Scotch-Weld™ Epoxy Adhesive DP100 Plus Clear is a fast setting, two-part,1:1 mix ratio mercaptan-cured epoxy adhesive. It is unique among fast setting mercaptan cure epoxies in that it combines high shear strength with good peel performance properties. Scotch-Weld epoxy adhesive DP100 Plus Clear is transparent and slightly flexible when cured. Available in bulk containers as 3M™ Scotch-Weld™ Epoxy Adhesive 100 Plus B/A Clear.

Features • 4 minute worklife • High shear and peel strength
• Slightly flexible • 1:1 mix ratio

Typical Uncured Physical Properties

Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes.

Base Resins Epoxy/Mercaptan
Viscosity1 Approximate                          Base (B)@ 80°F (23°C)                                           Accelerator (A) 4,000 to 11,000 cps7,000 to 13,000 cps
Net Weight                                                 Base (B)(Lbs./Gallon)                                              Accelerator (A)

9.7 to 9.9

9.4 to 9.8

Color                                                            Base (B) Accelerator (A)

Clear

Clear

Mix Ratio (B:A)                                         By Volume

By Weight

1:1

1:1

Worklife2                                                                                    2 gram@ 73°F (23°C)                                           20 gram

4 min.

3 min.

点击下载附件查看之:

  DP100-100NS (86.0 KB, 5 次)
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  DP100-PLUS-CLEAR (28.1 KB, 5 次)
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华为网盘下载:http://dl.dbank.com/c0mz6ss0t8

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得复康DEVCON PUH94167 TDS

最近了解到有些手机组装客户在塑料的粘接中会用到这款得复康DEVCON PUH94167,开始还以为是和14167类似的产品(这个在笔记本外壳组装上用量非常大),但在网上找不到太多的资料。不过就其前缀来看应该和14167不是同类型的产品,果不其然,这款也是属于反应性的热熔胶,应该和我前面提到的乐泰3541和3542,以及3M 2665类似的产品。 去了ITWDEVCON的官网,找不到任何相关资料,后来也是在网上其代理商发布的信息中了解了一些,摘录如下:

产品名称:
DEVCON PUH94167-HV
产品备注:电子粘接胶
产品类别:消费电子行业

产 品 说 明
PUH94167-HV 电子粘接胶

特性
100%固含量、反应性、单组份聚氨酯热熔胶
较好的开放时间
极好的抗剥离力
高粘度,高强度粘接,耐热耐化学性
较低的应用温度
操作设施方便
在施胶温度中具有较好的粘接温度性

应用
该产品在特定的电子行业具有极好初粘性和粘接强度。例如:手机和比较表电脑等小型电子产品上的金属和塑胶,以及塑胶与塑胶直接的粘接等。

产品技术参数:

固体含量

100%

磅每加仑

9.9

比重

1.19

粘度at212℉

10000cps

抗张强度@77℉(固化后)

2600psi

断裂延伸率@77℉(固化后)

460%

Yong’s模量

2840psi

颜色

无色

施胶温度

200-225℉

预热温度

200-225℉

开放时间

>5

哪位网友如果有完整版的TDS资料,麻烦共享一下哦,谢谢咯!

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ECCOBOND 45 Clear/Catalyst 15 Clear TDS

PRODUCT DESCRIPTION

ECCOBOND 45 Clear/Catalyst 15 Clear provides the following
product characteristics:

Technology Epoxy
Technology (Catalyst) Amine
Appearance (Resin) Clear yellow
Appearance (Catalyst) Clear yellow
Mix Ratio – Resin : HardenerRigid Formula 100 : 100
Mix Ratio – Resin : HardenerSemi-Rigid Formula 100 : 200
Mix Ratio – Resin : HardenerFlexible Formula 100 : 300
Product Benefits ●   Unfilled●   Ease of use

●   Non-conductive

●   General purpose

●   Controllable flexibility

●   Bond dissimilar substrates

Cure Heat cure
Application Assembly

ECCOBOND 45 Clear/Catalyst 15 Clear is a clear, unfilled epoxy adhesive which, by varying the amount of catalyst used, can adjust the hardness from flexible to rigid. It has an easy mix ratio and bonds well to a wide variety of substrates. ECCOBOND 45 Clear/Catalyst 15 Clear is the clear, unfilled version of ECCOBOND 45/Catalyst 15.

ECCOBOND 45 Clear/Catalyst 15 Clear can be used with a variety of catalysts.  For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations.

 

TYPICAL PROPERTIES OF UNCURED MATERIAL

Part A Properties 45 Clear
Viscosity, Brookfield , ASTM D2393, mPa•s (cP) 13,500
Density, ASTM D792, g/cm³ 1.17
Flash Point – See MSDS

Part B Properties Catalyst 15
Viscosity, Brookfield , ASTM D2393, mPa•s (cP) 25,000
Density, ASTM D792, g/cm³ 0.97
Flash Point – See MSDS

Mixed Properties
Rigid Formulation:
Viscosity, Brookfield , ASTM D2393, mPa•s (cP) 20,000
Density, ASTM D792, g/cm³ 1.06

此产品据悉PCB行业有用到,分为透明和黑色两种!

点击下载PDF文件:

  ECCOBOND 45 CLEAR-CAT 15 CLEAR-EN (73.1 KB, 2 次)
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  ECCOBOND 45-CAT 15-EN (80.8 KB, 3 次)
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华为网盘下载:http://dl.dbank.com/c0668daakd

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Underfill for High-end Application

最近在百度文库发现了这篇由Hitachi Chemical Co.,Ltd Semiconductor Materials Div.发布的《Underfill for High-end Application》,里面对underfil的一些可靠性测试做了一些分析和描述,非常专业。从这份资料里面也知道了华为终端在做underfill高低温冲击的依据,这里面也有提到,和华为的方法一模一样。大家可以下载附件学习查看之:

FC-BGA

CUF (solder bump) NUF (solder bump)

Stacked CSP
CUF (solder bump) NUF (solder bump) NCP (Au bump)

Stacked Die

TH Electrode
CUF (High flow) NUF (Voidless)

CUF:Capillary flow underfill NUF:Non flow underfill
Working on Wonders
Flip Chip Trend

Silicon chip trend

Bump count Silicon performance Bump pitch Die gap Large die Low-k Thin die Pb free bump Solder joint

点击附件下载之:

  Underfill for High-end Application (602.7 KB, 33 次)
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华为网盘下载:http://dl.dbank.com/c0h9xqdbw9

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乐泰反应性热熔胶3541和3542技术资料

之前学习过《关于反应性热熔胶—PUR-HM》里面提到过乐泰的3541和3542两款产品,后来学习乐泰公司《Bonding, Sealing and Coating Solutions for Mobile Devices》中也多次提到此款产品。但在乐泰的官网上没法下载到其TDS资料,google和baidu上也没找到完整的资料,后来在电子胶水论坛上发帖求助,有两位热心的网友@haz_2008和@A_camel给我发来了资料。 惊奇地发现这款产品居然1997年就有了,一份TDS是1997年的,一份是2009年的。但仔细看过之后发现不是同一个产品,一个是环氧体系的(1997年),一个是聚氨酯体系的(2009年)。但怎么会取一样的型号呢,呵呵!第一次发现这个问题。 聚氨酯体系才是最近在手机组装中尤其是触控屏手机组装中应用得非常普遍的这款。这份资料应该还只是实验室数据,里面及提供了几个简单的参数。对比了3541和3542的资料,发现除了open time差一分钟外,其它的好像没有任何区别! 技术资料摘录如下,大家可以到后面下载查看之。

PRODUCT DESCRIPTION

LOCTITE 3541 is a reactive hot-melt adhesive based on polyurethane prepolymers.   The adhesive is pressure sensitive and gives a high initial strength instantly after joining the parts. Additionally it has a long open time to be suitable for automatic or manual assembly line.

The adhesive provides the following characteristics:

Colour: Transparent when molten, after cooling light ivory
Odour: Weak
Density: 1.15±0.05g/cm3
Solids: 100%
Voiscosity: 6000-10000mPa.s  @110degC
Equipment: Brookfield Thermosel, Spindle 27
Open time: 2-4 min
ApplicationTemperature: 110 to 140 degC
Temperature resistance: Short-term (up to 1 h) -30 to 100 degC-30 to 120 degC

Pretreatment

The bonding surfaces must be clean, dry and free of oil and grease.    Substrate temperature  should not fall below 20degC during application.   Lower temperatures will lead to and early solidification of the adhesive and thus to a reduced open time, possibly the adhesive might even flake off.  If necessary the substrates may be preheated, however longer open times and thus extended  cycle times  will have  to be taken  into consideration at temperatures above 45degC.

Application

LOCTITE  3541 can be applied  from heatable  cartridge  guns, from  usual  syringe  type  melting  equipment.    At  longer  rest periods melting and application temperatures should be decreased.   Longer exposure to higher temperatures  can lead to a viscosity increase.

Curing

LOCTITE  3541  cures  exclusively  by  moisture  and  gains  its final strength after 1-5 days, but exhibits high handling strength instantly after joining.

Curing  is  a  chemical  reaction  depending   on  the  following
parameters:
–       Humidity in the rooms of application and storage
–       Humidity of the substrates
–       Permeability of the substrates to be bonded
–       Application weight/ layer of the adhesive film
点击下载附件查看:

  loctite 3541and 3542 TDS (84.4 KB, 29 次)
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华为网盘下载:http://dl.dbank.com/c0knq6tfuz

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乐泰瞬干胶460和406TDS资料

近日有个客户咨询到在手机塑胶件的粘接时使用乐泰460,但是在做可靠性测试时不理想,测试条件是:50度温度,90-95%的湿度,测试经过96小时后的粘接效果。结果不是太理想。我查阅了一下460的TDS资料,里面显示50度的强度就大概只能达到常温下的60%,另外瞬干胶耐水性相对弱一下,测试不理想也是正常的。另外因为不记得客户说的是460还是406,顺便把406的资料也看了下,貌似应该比460的耐老化要强一些。下面分享两份TDS,有需要的朋友可以下载查看:

PRODUCT DESCRIPTION

LOCTITE® 460™      provides       the      following      product characteristics:

Technology Cyanoacrylate
Chemical Type Alkoxyethyl cyanoacrylate
Appearance (uncured) Transparent,    colorless    to     straw colored liquidLMS
Components One part – requires no mixing
Viscosity Medium
Cure Humidity
Application Bonding
Key Substrates Metals, Plastics and Elastomers

LOCTITE® 460™ has low odor and low blooming properties and is particularly suitable for applications where vapor control is difficult. The product provides rapid bonding of a wide range of materials, including metals,  plastics and  elastomers. LOCTITE® 460™  is particularly suited for bonding porous or absorbent materials such as wood, paper, leather and fabric.

TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C                                        1.1
Flash Point – See MSDS
Viscosity, Cone & Plate, mPa·s (cP):
Temperature: 25 °C, Shear Rate: 3,000 s-1                 25 to 55LMS
Viscosity, Brookfield – LVF, 25 °C, mPa·s (cP):
Spindle 1, speed 30 rpm                                  30 to 60

下载附件查看PDF文件:

  乐泰CA 460 TDS (66.9 KB, 7 次)
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  乐泰406 TDS (66.4 KB, 7 次)
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华为网盘下载:http://dl.dbank.com/c02q58wf1s

 

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关于CIPG和FIPG工艺

今天在看汉高公司关于手机粘接解决方案《Bonding Sealing and Coating Solutions for Mobile Devices》的时候发现了一个专业名词:CIPG,描述如下:
Application: Cushion
Product: CIPG
Benefits:
• Good bonding strength
• Soft and highly flexibility
• Reusable and durable
• Easily processed to high design tolerances
我印象中没有哪类胶粘剂产品或电子产品简称为CIPG,在网上查了一下,找到了一份三键公司的资料《UV-Cured-In-Place Gasket(紫外线固化型现场成形垫圈)》,里面做了详细介绍,原来是FIPG 工艺(Formed-In-Place Gasket)和CIPG 工艺(Cured-In-Place Gasket)。

CIPG 工艺,是指法兰面上涂布液态密封剂后,一般通过加热固化后再进行组装;FIPG 工艺,是指在法兰面上涂布液态密封剂后,在未固化的状态下进行工件组装,之后需要放置一段时间使密封剂完全固化。

附件文章做了详细介绍,有兴趣的朋友可以下载查看之,另外有一份资料是《New Series of Fuel Cell Sealing Compounds – ThreeBond》也提到了类似的工艺,应该是用在燃料电池封装里面的。

华为网盘下载:http://dl.dbank.com/c0t49geob5

点击下载:

  New Series of Fuel Cell Sealing Compounds – ThreeBond (4.9 MB, 32 次)
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  UV-Cured-In-Place Gasket (281.1 KB, 36 次)
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Henkel Electronic Solutions

年初找到了一份《汉高电子部 电子组装解决方案》《Henkel Electronics Assembly Solutions》,这两天在查找3036的underfill技术资料时,找到了这份《Henkel Electronic Solutions》,好像主要是针对封装方面的用胶和材料,很多型号之前都没怎么接触,里面的underfill之类的材料更侧重于一道underfill,此类材料是:MATERIAL SOLUTIONS FORELECTRONIC PACKAGINGAND ASSEMBLY。 罗列产品目录如下,有需要了解的朋友可以下载附件查看:

Semiconductor Market Solutions
Discrete Components . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Quad Flat Pack (QFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Quad Flat No-Lead (QFN) . . . . . . . . . . . . . . . . . . . . . . 11
Ball Grid Array/Chip Scale Package (BGA/CSP) . . . . 14
System-in-Package (SiP) . . . . . . . . . . . . . . . . . . . . . . . 18
Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Semiconductor Materials
Hysol® Die Attach Adhesives . . . . . . . . . . . . . . . . . . . . 23
Hysol® Semiconductor Underfills . . . . . . . . . . . . . . . . 29
Hysol® Semiconductor Encapsulants . . . . . . . . . . . . . 32
Hysol® Thermal Compression Materials . . . . . . . . . . . 34
Hysol® Coating Powders . . . . . . . . . . . . . . . . . . . . . . . 36
Hysol® Electronic Molding Compounds . . . . . . . . . . . 37
Hysol® and Hysol® Huawei™ Semiconductor
Molding Compounds . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Multicore® Accurus™ Solder Spheres . . . . . . . . . . . . . 47
Printed Circuit Board (PCB) Assembly Materials
Multicore® Solder Paste . . . . . . . . . . . . . . . . . . . . . . . . 50
Multicore® Fluxes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Multicore® Cored Wire . . . . . . . . . . . . . . . . . . . . . . . . . 54
Multicore® Solder Accessories . . . . . . . . . . . . . . . . . . 55
Chip on Board Encapsulant Materials . . . . . . . . . . . . 56
Loctite® Board Level Underfills . . . . . . . . . . . . . . . . . . 59
Loctite® Thermal Management Materials . . . . . . . . . . 61
Loctite® Electrically Conductive Adhesives . . . . . . . 64
Loctite® Chipbonder™ Surface Mount Adhesives . . . 66
Circuit Board Protection Solutions . . . . . . . . . . . . . . . 68
Flat Panel Display Materials
Flat Panel Display Solutions . . . . . . . . . . . . . . . . . . . . 79
Semiconductor Solutions . . . . . . . . . . . . . . . . . . . . . . 84
Solutions Across the Board . . . . . . . . . . . . . . . . . . . . . 86
Periodic Table of Elements . . . . . . . . . . . . . . . . . . . . . 88

华为网盘下载:http://dl.dbank.com/c041y3iul2

点击下载附件查看:

  Henkel Electronic Solutions (2.9 MB, 37 次)
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