14281-99B-Snap Heat Cure Anisotropic Conductive Adhesive Paste

汉高乐泰收购emersoncuming后主推的一款异向导电胶，用于rfid等领域，基本参数如下：

粘度： 16300cps；   固化条件：加压加热170度以上 8秒左右；储存条件：零下40度6个月！

Product Description:

14281-99B is a snap curable thermoset anisotropic conductive adhesive paste. This material is especially suited in applications where throughput is critical; the material is specially designed to cure very fast.

Depending on the cure temperature, 14281-99B can be spot cured (less than 10 seconds) at temperature as low as 170°C, which makes it ideal to be used in combination with temperature sensitive substrates and components.

Applications:

14281-99B is typically used for very fine pitch flip chip interconnections. In general the material can be used in situation where electrical conductivity is desired in only one direction.

14281-99B shows excellent adhesion to metals (Copper, Gold, Aluminum).

Instructions For Use:

Thoroughly read the information concerning health and safety contained in this bulletin before using. Observe all precautionary statements that appear on the product label and/or contained in individual Material Safety Data Sheets (MSDS).

To ensure the long term performance of the bonded assembly, complete cleaning of the substrates should be performed to remove contamination such as oxide layers, dust, moisture, salt, and oils which can cause poor adhesion or corrosion in a bonded part. For information on proper substrate preparation, refer to the reprint “Good Adhesive Bonding Starts With Surface Preparation” available from Emerson & Cuming Specialty Polymers.

Apply the adhesive to all surfaces to be bonded and join. In most applications, only contact pressure is required.
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preliminary-tds-of-14281-99b