LOCTITE 3563 UNDERFILL TDS

PRODUCT DESCRIPTION

LOCTITE® 3563™ provides the following product characteristics:

Technology Epoxy

Chemical Type Epoxy

Appearance (uncured) Off-white to beige liquidLMS

Components One component – requires no mixing

Cure Heat cure

Cure Benefit Production – high speed curing

Application Underfill for flip chip devices

Dispense Method Syringe

Key Substrates SMD components to PCB

Reworkable No

 

LOCTITE® 3563™ is a rapid curing, fast flowing, liquid epoxy designed for use as a capillary flow underfill for packaged ICs, such as CSPs and BGAs. Its rheology is designed to allow it to penetrate gaps as small as 25 μm. When fully cured, it minimizes induced stress at solder joint and thus improves thermal cycling performance.

 

TYPICAL PROPERTIES OF UNCURED MATERIAL

Specific Gravity@ 25 °C 1.52

Viscosity, Cone & Plate rheometer, 2 ° Cone, mPa·s (cP):

Temperature: 25 °C, Shear Rate: 5 s-1 5,000 to 12,000LMS

Temperature: 25 °C, Shear Rate: 20 s-1 5,000 to 12,000

Capillary Flow Rate, seconds:

Flow time, 100 °C, glass to glass, 25 μm:

6.35 mm flow ≤15

12.7 mm flow ≤45LMS

25.4 mm flow ≤150

VOC, ASTM D 3960, g/l <10

Moisture Content, ASTM D 4017, % 0.01

Total Volatile Content, ASTM D 2369, % <1

Filler Content, % 40

Particle Size, μm:

Average 1 to 2

Maximum <10

Pot life @ 22 °C, hours 8 to 12

Flash Point – See MSDS

 

Recommended Curing Conditions

>7 minutes @ 150 °C

>5 minutes @ 165 °C

 

Note: With all fast cure systems, the time required for cure depends on the rate of heating. Conditions where a hot plate or heat sink is used are optimum for fastest cure. Cure rates depend on the mass of material to be heated and intimate contact with the heat source. Use suggested cure conditions as general guidelines. Other cure conditions may yield satisfactory results.

 

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties:

Coefficient of Thermal Expansion,

ISO 11359-2, K-1:

Pre Tg (Alpha 1) 35×10-6

Post Tg (Alpha 2) 110×10-6

Glass Transition Temperature, °C:

(Tg) by DMTA 130

Water Absorption, ISO 62, %:

2 hours in boiling water <0.7

24 hours in water @ 22 °C <0.4

Coefficient of Thermal Conductivity ASTM F 433,

W/(m·K)

0.38

Extractable Ionic Content, μg/g:

Chloride <30

Potassium <1

Sodium <1

Shore Hardness, ISO 868, Durometer D 88

Volume Shrinkage, ASTM D 792, % <3

Elongation, ISO 527-3, % 3

Tensile Strength, ISO 527-3 N/mm² 69

(psi) (10,000)

Tensile Modulus, ISO 527-3 N/mm² 2,800

(psi) (406,106)

Electrical Properties:

Volume Resistivity, IEC 60093, Ω·cm 1×1015

Surface Resistivity, IEC 60093, Ω 1×1015

Dielectric Breakdown Strength,

IEC 60243-1, kV/mm

33.5

Dielectric Constant / Dissipation Factor, IEC 60250:

1-kHz 3.56 / 0.005

10-kHz 3.53 / 0.009

100-kHz 3.46 / 0.014

 

TYPICAL PERFORMANCE OF CURED MATERIAL Adhesive Properties

Cured for 30 minutes @ 150 °C, tested @ 22 °C

Lap Shear Strength, ISO 4587:

G-10 Epoxyglass:

0.127 mm gap N/mm² ≥11LMS

(psi) (≥1,595)

After 3 weeks @ 85 °C / 85% RH

Lap Shear Strength, ISO 4587:

G-10 Epoxyglass N/mm² 8.5

(psi) (1,200)

 

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet (MSDS).

 

Handling Information

1. Receiving Frozen Shipments

All shipping boxes are packed with dry ice to maintain temperature below -40 °C during transit.  Due to the extremely low temperature of dry ice, appropriate care and precautions must be taken during handling operations; thermally insulated gloves should be worn

2. Thawing

To prevent introduction of air voids due to thermal shock, a new delivery of material must be maintained at -40 °C for a minimum period of eight hours before further handling. Following this “warming” period, product can be removed from the freezer and allowed to stand at room temperature (22±2 °C) for one hour: cartridges or syringes can then be removed from inner packages and allowed to equilibrate in tip-down orientation at room temperature (22±2 °C) for 1 to 2 hours before use (actual time required will vary with package size / volume). Do not loosen container lids, caps or covers until equilibration is complete. Heat must never be used as partial polymerization (curing) could occur.

 

Directions for use

Load product into dispensing equipment. A variety of application equipment types are suitable and include: hand dispense / time pressure valve; auger style valve; linear piston pump and jet valve. Selection of equipment should be determined by application requirements – for advice on equipment selection and process optimization, users should contact their Technical Service Center.

1. Ensure that air is not introduced to product during equipment set-up.

2. For best results, the substrate should be pre-heated (typically to 90 to 100 °C for about 20 seconds) to allow fast capillary flow and facilitate leveling. The dispense nozzle may also be pre-heated (30 to 50 °C maximum) to further increase capillary flow.

3. Dispense product at moderate speed (2.5 to 12.7 mm/s).Ensure that needle tip is about 0.025 to 0.076 mm from substrate surface and from chip edge – this will ensure optimal flow conditions for the Underfill.

4. The dispense pattern is typically “I” along one side or “L” pattern along two sides, focused at the corner. Application should start at the location furthest away from the chip center – this helps ensure a void free fill underneath the die. Each leg of the “L” or “I” pattern should not exceed 80 % of the length of each die edge being dispensed.

5. In some cases second or third application of product may be necessary.

 

For Cleanup

Wipe the surface using a cotton swab soaked with a suitable solvent (e.g. LOCTITE® 7360™ or acetone). Repeat this step with a clean dry cotton swab.

 

Do Not return product to refrigerated storage; any surplus product should be discarded

 

Loctite Material SpecificationLMS

LMS dated May-14, 1999. Test reports for each batch are available for the indicated properties. LMS test reports include selected QC test parameters considered appropriate to specifications for customer use. Additionally, comprehensive controls are in place to assure product quality and consistency. Special customer specification requirements may be coordinated through Henkel Quality.

 

Storage

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.

 

Product shall be ideally stored at ≤-40 °C. Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.

 

Conversions

(°C x 1.8) + 32 = °F

kV/mm x 25.4 = V/mil

mm / 25.4 = inches

μm / 25.4 = mil

N x 0.225 = lb

N/mm x 5.71 = lb/in

N/mm² x 145 = psi

MPa x 145 = psi

N·m x 8.851 = lb·in

N·m x 0.738 = lb·ft

N·mm x 0.142 = oz·in

mPa·s = cP

 

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

 

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