今日有网友咨询我FP4651这款产品，之前没有接触过，但是从牌号来看应该是属于HYSOL系列的环氧产品，下载了一下TDS资料，果不其然，而且这款FP4651产品官方显示是“Hysol FP4651 is a low viscosity version of FP4650 for a large array of packages.”，所以顺便也下载了FP4650这款产品的资料来看看。从TDS来看FP4650是2002年就推出的一款型号，而FP4651是2011年推出的一款产品。这款产品从用途来看也是属于高可靠性的环氧包封剂，关于HYSOL系列高可靠性环氧包封剂请参看此文《关于汉高乐泰HYSOL FP系列液态封装材料的应用》，或者以HYSOL为关键字在本站搜索可以找出很多相关的产品。这款产品的填料含量达到82%，也不知道是怎样加进去的，呵呵！另外它的CTE只有15ppm左右，几乎达到EMC的水平，也难怪会具有很高的可靠性了。 闲话少说，贴出部分FP4651的TDS内容，大家可以下载附件查看PDF文件：

PRODUCT DESCRIPTION

FP4651 provides the following product characteristics:

Technology	Epoxy
Appearance	Black
Product Benefits	• High purity• Self-leveling• Excellent chemical resistance • High thermal stability • Low thermal expansion • Low viscosity
Components	One-component
Filler     content      ,      %ignition	82
Cure	Heat cure
Application	Encapsulant
Typical Applications	Cavity-fill    and     fine    wire     pitch applications

FP4651 epoxy encapsulant features very low thermal expansion while retaining syringe dispense capabilities. Its low viscosity  and  50  micron  maximum  particle  size  gives  it improved handling properties over FP4650 for fine wire pitch and  cavity-fill  applications. It  is  based  on   FP4450  resin chemistry, therefore exhibiting excellent chemical resistance and thermal stability properties.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity, Brookfield – RVF, 25 °C, mPa·s (cP):
Spindle 7, speed 20 rpm	130,000
Specific Gravity                                        1.91Pot life @ 25 °C, days:
(Time required to double viscosity)	2
Gel Time @ 121 °C, minutes	9
Shelf Life @ -40°C, monthsFlash Point – See MSDS	9

TYPICAL CURING PERFORMANCE Recommended Cure Schedule
1 hour @ 125°C plus
90 minutes @ 165°C

Alternative Cure Schedule
2 hours @ 110°C plus
3 hours @ 165°C

The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

Below Tg (40 to 120°C)	11
Above Tg (190 to 220°C)	50
Glass Transition Temperature (Tg), °C	150
Extractable Ionic Content, ppm: Chloride (Cl-)	5
Potassium (K+)	1
Sodium (Na+)	1

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials.

Not for product specifications
The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.

THAWING：

1.	Frozen packages must be completely thawed before use.
2.	Warm at room temperature until no longer cool to the
	touch (normally 20 to 60 minutes).
3.	DO NOT thaw in an oven.

Directions for use

1.	FP4651 should be dispensed onto a substrate warmed to
	approximately   80°C.    This    will    help    minimize    air
2.	entrapment.Warm FP4651 to 30 to 40°C for faster dispensing.
3.	NOTE: Elevated temperatures reduce working life.

Storage

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.

Optimal Storage: ≤-40 °C

Material removed from containers may be contaminated during use.  Do not return product to the original container.  Henkel Corporation cannot assume responsibility for product  which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please   contact   your   local   Technical   Service   Center   or Customer Service Representative.

……

 

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汉高公司3月12日在官网发布了他们最新的底填胶水产品UF3810产品的相关新闻，官网TDS数据库里面也有对应的TDS资料。资料显示是2011年12月份发布的。摘录学习之：

PRODUCT DESCRIPTION

UF3810 provides the following product characteristics:

Technology	Epoxy
Appearance	Black liquid
Product Benefits	●   One component●   Fast cure at moderate temperatures●   High Tg ●   Halogen free ●   Compatible with most Pb-free solders ●   Stable electrical performance in Temperature Humidity Bias ●   Reworkable
Cure	Heat cure
Application	Underfill
Typical Package Application	Chip scale packages and BGA

 

UF3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.

TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Cone & Plate,@ 25 °C , mPa∙s (cP):
@ 20 s-1 394
Specific Gravity, 1.13
Pot life @ 25 °C, 25% viscosity increase, days 3
Shelf Life @ -20°C (from date of manufacture), months 6
Flash Point – See MSDS

TYPICAL CURING PERFORMANCE
Cure Schedule    ≥8 minutes @ 130°C
The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

TYPICAL PROPERTIES OF CURED MATERIAL
Physical Properties:
Coefficient of Thermal Expansion , TMA, ppm/°C:
Below Tg 55
Above Tg 171
Glass Transition Temperature (Tg) by TMA, °C 102
Storage Modulus, DMA:
@ 25 °C N/mm² 2,990
(psi) (435,000)

Electrical Properties:
Dielectric Constant @ 23ºC :
@ 1GHz 3.44
@ 2GHz 2.87
Dissipation Factor @ 23ºC:
@ 1GHz 0.0071
@ 2GHz 0.0037
TYPICAL PERFORMANCE OF CURED MATERIAL
Lap Shear Strength , ISO 4587:  Glass Epoxy to Glass Epoxy N/mm² 9.7(psi) (1,400)

GENERAL INFORMATION
For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).
THAWING:
1. Thaw 30 cc syringes at least 1 hour at room temperature prior to use.
2. Allow container to reach room temperature before use.
3. After removing from the freezer, set the syringes to stand vertically while thawing.
4. DO NOT open the container before contents reach 25°C temperature. Any moisture that collects on the thawed container should be removed prior to opening the container.
5. DO NOT re-freeze. Once thawed to 25°C, the adhesive should not be re-frozen.
DIRECTIONS FOR USE
1. Thawed adhesive should immediately be placed on dispense equipment for use.
2. If the adhesive is transferred to a final dispensing reservoir, care must be exercised to avoid entrapment of contaminants and/or air into the adhesive.
3. Adhesive must be completely used within the product’s recommended work life.
Not for product specifications
The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.
Storage
Store product in the unopened container in a dry location. Storage information may be indicated on the product container
labeling.

 

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  UF3810 TDS (63.4 KB, 15 次)
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  UF3810 MSDS (44.5 KB, 10 次)
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PRODUCT DESCRIPTION

ECCOBOND 45 Clear/Catalyst 15 Clear provides the following
product characteristics:

Technology	Epoxy
Technology (Catalyst)	Amine
Appearance (Resin)	Clear yellow
Appearance (Catalyst)	Clear yellow
Mix Ratio – Resin : HardenerRigid Formula	100 : 100
Mix Ratio – Resin : HardenerSemi-Rigid Formula	100 : 200
Mix Ratio – Resin : HardenerFlexible Formula	100 : 300
Product Benefits	●   Unfilled●   Ease of use ●   Non-conductive ●   General purpose ●   Controllable flexibility ●   Bond dissimilar substrates
Cure	Heat cure
Application	Assembly

ECCOBOND 45 Clear/Catalyst 15 Clear is a clear, unfilled epoxy adhesive which, by varying the amount of catalyst used, can adjust the hardness from flexible to rigid. It has an easy mix ratio and bonds well to a wide variety of substrates. ECCOBOND 45 Clear/Catalyst 15 Clear is the clear, unfilled version of ECCOBOND 45/Catalyst 15.

ECCOBOND 45 Clear/Catalyst 15 Clear can be used with a variety of catalysts.  For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations.

 

TYPICAL PROPERTIES OF UNCURED MATERIAL

Part A Properties 45 Clear
Viscosity, Brookfield , ASTM D2393, mPa•s (cP) 13,500
Density, ASTM D792, g/cm³ 1.17
Flash Point – See MSDS

Part B Properties Catalyst 15
Viscosity, Brookfield , ASTM D2393, mPa•s (cP) 25,000
Density, ASTM D792, g/cm³ 0.97
Flash Point – See MSDS

Mixed Properties
Rigid Formulation:
Viscosity, Brookfield , ASTM D2393, mPa•s (cP) 20,000
Density, ASTM D792, g/cm³ 1.06

此产品据悉PCB行业有用到，分为透明和黑色两种！

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  ECCOBOND 45 CLEAR-CAT 15 CLEAR-EN (73.1 KB, 2 次)
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  ECCOBOND 45-CAT 15-EN (80.8 KB, 3 次)
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PRODUCT DESCRIPTION

Hysol® FP4549G is a high purity, low stress, liquid epoxy designed for enhanced adhesion to integrated circuit passivation materials. This material is formulated to quickly underfill devices at 90°C to 120°C with as little as a ½ mil gap. When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extend thermal cycling performance. FP4549G also exhibits low moisture absorption for improved JEDEC performance.

 

TYPICAL APPLICATIONS

Flip chip on board applications with low moisture absorption for improved JEDEC performance.

 

PROPERTIES OF UNCURED MATERIAL

Value

Chemical Type Epoxy

Appearance Grey

Flow Rate 500 mil flow, 3 mil gap, 90°C) 15 seconds

Filler Content,% ignition, ITM3A 50

Shelf Life @ -40°F,(-40°C), months 9

Typical Range

Viscosity @ 25ºC, (77°F)

Cone & Plate , (Brookfield, cps)

CP52; speed 20 (ITM2A) 2,300

 

Work Life at Room Temperature 全文 »

PRODUCT DESCRIPTION

Hysol® FP4549FC is a high purity, low stress, liquid epoxy designed for enhanced adhesion to integrated circuit passivation materials. This material is formulated to quickly underfill devices at 110°C to 120°C with as little as a ½ mil gap. When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extend thermal cycling performance. FP4549FC also exhibits low moisture absorption for improved JEDEC performance. FP4559FC has been specially formulated for improved compatibility with no-clean flux residues.

 

TYPICAL APPLICATIONS

Encapsulant for Flip Chip Underfill

 

PROPERTIES OF UNCURED MATERIAL

Color White

Filler content, (%, ignition) (ITM3A) 50

Flow Rate (500 mil flow, 3 mil gap, 110°C) 18 seconds

Shelf Life @-40°C, (-40°F), months 9

Typical Value

Viscosity @ 25°C, (77°F) (ITM2R)

Brookfield Cone & Plate

CP52, Speed 20 13,000

 

PHYSICAL PROPERTIES, CURED MATERIAL

Color White/Yellow

Glass Transition (Tg), °C, (TMA) (ITM65B) 125

Coefficient of Linear Thermal Expansion, (ITM65B)

α1, ppm/°C 45

α2, ppm/°C 143

Extractable Ionic Content, @ 121°C (ITM107B)

Chloride (Cl-), ppm 6

Sodium (Na+), ppm 2

Flexural Modulus, Gpa (ASTM D790) 5.6

Adhesion

Die shear strength 50±2Kg

Nitride passivated/FR4 substrate

100 mil x 100 mil die @ 25°C, (77°F)

 

Handling

Gel Time @ 121°C, (250°F), minutes, (ITM10N) 12

Pot Life @ 25°C, (77°F), hours 12

(ITM10T), (time required to double viscosity)

 

Frozen storage at approximately –40°C or lower is required for maximum shelf life. Frozen packages must be completely thawed before use. Warm at room temperature until no longer cool to the touch (normally 60-90 minutes). Do not thaw in an oven. For best results in dispensing, a 22 gauge needle should be used at 10-20 psi pressure. For best flow rates, a substrate temperature of 110-120°C is recommended.

 

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

 

Cure Schedule

Recommended Cure 30 minutes @ 165°C

 

Use suggested cure conditions as general guidelines. Other cure conditions may yield satisfactory results. With all fast cure systems, the minimum required time for cure depends on the rate of heating. Conditions where a hot plate or heat sink is used are optimum for fastest cure. Cure rates depend on the mass of material to be heated and intimate contact with the heat source.

 

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Loctite Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Loctite Corporation’s products. Loctite Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Loctite Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  Henkel Loctite Hysol FP4549FC TDS (78.2 KB, 81 次)

PRODUCT DESCRIPTION

FP4549 provides the following product characteristics:

Technology Epoxy

Appearance White

Product Benefits • High purity

• Low stress

• Liquid flexible

• Low moisture absorption

Filler Weight, % 50

Components One-component

Cure Heat cure

Application Encapsulation

Typical Applications Flip Chip

 

FP4549 also exhibits low moisture absorption for improved JEDEC performance.

 

TYPICAL PROPERTIES OF UNCURED MATERIAL

Viscosity, Brookfield – Cone & Plate, 25 °C, mPa·s (cP):

Spindle 52, speed 20 rpm 2,300

Pot Life @ 25 °C(time to double viscosity), hours 24

Gel Time @ 121ºC, minutes 13.5

Shelf Life: @ -40ºC, months 9

Flow Rate @ 90°C, seconds

500mil travel, 3mil gap 15

Flash Point – See MSDS

 

TYPICAL CURING PERFORMANCE

Recommended Cure Schedule

30 minutes @ 165°C

 

The above cure profile is a guideline recommendation. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

 

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties:

Coefficient of Thermal Expansion , ppm/°C:

Below Tg 45

Above Tg 143

Glass Transition Temperature (Tg) °C 140

(Cured 7 minutes @ 160ºC)

Extractable Ionic Content, ppm:

Chloride (Cl-) 3

Sodium (Na+) 2

Flexural Modulus N/mm² 5.6

(psi) (784)

 

TYPICAL PERFORMANCE OF CURED MATERIAL

Adhesive Properties

Die Shear Strength, Kg:

Nitride Passivated/FR4 substrate:

100 mil x 100 mil die @ 25°C 50±2

 

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

 

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or other strong oxidizing materials.

 

Not for product specifications

The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.

 

THAWING:

1. Allow container to reach room temperature before use.

2. Warm at room temperature until no longer cool to the touch (normally 60 to 90 minutes).

3. DO NOT thaw in an oven.

 

Directions for use

1. For best flow rates, a preheat temperature of 90 °C is recommended.

2. For best results in dispensing a 22 gauge needle should be used at 10 to 20 psi pressure.

 

Storage

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.

 

Optimal Storage: -40 °C

Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.

 

Conversions

(°C x 1.8) + 32 = °F

kV/mm x 25.4 = V/mil

mm / 25.4 = inches

N x 0.225 = lb

N/mm x 5.71 = lb/in

N/mm² x 145 = psi

MPa x 145 = psi

N·m x 8.851 = lb·in

N·m x 0.738 = lb·ft

N·mm x 0.142 = oz·in

mPa·s = cP

 

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  Henkel Loctite Hysol FP4549 TDS (66.2 KB, 130 次)

PRODUCT DESCRIPTION

FP4323 provides the following product characteristics:

Technology Epoxy

Appearance (Part A) Black

Appearance (Part B) Cream

Appearance (Mixed) Black

Product Benefits • Low CTE for improved thermal cycling

• High purity

• Thixotropic

• Excellent moisture resistance

• Excellent chemical resistance

Filler Weight, % 65

Filler Type Silica

Mix Ratio, by weight – Part

A: Part B

100 : 100

Cure Heat cure

Application Encapsulant – glob top

Typical Assembly

Applications

Chip-on-board and Plastic PGA

applications

Substrates Plastic

FP4323 liquid epoxy encapsulant glob top is designed with flow capabilities that allows encapsulation without flowing beyond the chip.

 

TYPICAL PROPERTIES OF UNCURED MATERIAL

Part A Properties

Viscosity, Brookfield – RVF, 25 °C, mPa·s (cP):

Spindle 7, speed 2 rpm 172,500

Spindle 7, speed 20 rpm 115,000

Specific Gravity @ 25 °C 1.7

Shelf Life @ 25°C, months 12

Flash Point – See MSDS

Part B Properties

Viscosity, Brookfield – RVF, 25 °C, mPa·s (cP):

Spindle 7, speed 2 rpm 250,000

Spindle 7, speed 20 rpm 72,500

Specific Gravity @ 25 °C 1.7

Shelf Life @ 25°C, months 12

Flash Point – See MSDS

Mixed Properties

Mixed Viscosity, Brookfield – RVF, 25 °C, mPa·s (cP):

Spindle 7, speed 2 rpm 220,000

Spindle 7, speed 20 rpm 100,000

Specific Gravity @ 25 °C 1.67

Gel Time @ 121ºC, minutes 11

Pot Life @ 25 °C, days 2

Shelf Life @ -40 °C, months 9

Working Life@ 25 °C, hours 48

Flash Point – See MSDS

 

TYPICAL CURING PERFORMANCE

Recommended Cure Schedule

4 hours @ 150°C or

1 hour @ 170°C

Alternative Cure Schedule

2 hours @ 125°C + 4 hours @ 150°C

Substrate Temperature

Temperature, °C 90

The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

A two-step cure will minimize stress.

 

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties:

Coefficient of Thermal Expansion ASTM D-3386, ppm/°C:

Below Tg (40 to 120°C) 28

Glass Transition Temperature (Tg) by TMA, °C 174

Thermal Conductivity, W/mk 0.63

Shore Hardness, ISO 868, Durometer D 97

Linear Shrinkage, % 0.43

Extractable Ionic Content, ppm:

Chloride (Cl-) 20

Sodium (Na+) 20

Potassium (K+) 20

Water Absorption, ISO 62 , %:

8 hours @ 100°C 0.25

Electrical Properties:

Dielectric Constant / Dissipation Factor, IEC 60250:

1kHz 3.7 / 0.004

100-MHz 3.59 / 0.085

1-GHz 3.44 / 0.075

Volume Resistivity, IEC 60093, Ω·cm 6.2×1014

Surface Resistivity, IEC 60093, Ω 1.6×1014

 

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

 

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be used with chlorine or other strong oxidizing materials.

 

DIRECTIONS FOR USE

1. For best results, dispense onto substrate warmed to 90°C.

2. FP4323 may settle upon storage. Each container must be thoroughly mixed before combining.

3. Mix Part A and Part B separately for about 5 to 10 minutes on a standard paint shaker to ensure complete dispersion of the filler.

4. Stir with a large spatula to check for lumps.

5. Cold storage will minimize filler settling.

6. Part B may form a crust if exposed to moist air for an extended period of time. Keep in a well sealed container. For best results, do not use Part B which contains this crust caused by moisture contamination.

7. Thorough mechanical mixing of Part A and Part B together is required for best results. Hand mixing alone is not recommended.

 

Not for product specifications

The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.

 

Storage

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.

 

Optimal Storage: -40°C. Storage below -40°C or greater than -40°C can adversely affect product properties.

 

Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.

 

Conversions

(°C x 1.8) + 32 = °F

kV/mm x 25.4 = V/mil

mm / 25.4 = inches

N x 0.225 = lb

N/mm x 5.71 = lb/in

N/mm² x 145 = psi

MPa x 145 = psi

N·m x 8.851 = lb·in

N·m x 0.738 = lb·ft

N·mm x 0.142 = oz·in

mPa·s = cP

 

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  Henkel Loctite Hysol FP4323 TDS (68.0 KB, 93 次)

DESCRIPTION

Hysol® FP4322 is a high purity liquid epoxy encapsulant designed for semiconductor encapsulation. It is a high flow material which requires a cavity or flow control barrier to prevent excessive flow. Hysol FP4322 is suitable for encapsulation of bare chips mounted to plastic substrates as well as potting of small hybrid circuit modules. Spot encapsulation of bare chips on ceramic substrates is not suggested in most cases.

TYPICAL APPLICATIONS

Semiconductor encapsulation.

PROPERTIES OF UNCURED MATERIAL

Color Black

Filler Content, % (ASTM D2584) 65

Specific Gravity @25°C, (77°F)

(ASTM D1475) 1.69

Shelf Life @-40°C (-40°F), months 9

Typical Value

Viscosity @ 25°C, (77°F)

(ITM2A) (ASTM D2393)

Brookfield RVF

Spindle 7, Speed 2, Cp 92,500

Spindle 7, Speed 20, Cp 52,500

PHYSICAL PROPERTIES, CURED MATERIAL

Color Black

Coefficient of Thermal Expansion, in/in/°C

(ASTM D3386)

(40°-120°C) 30 x 10-6

Linear Shrinkage, %(ASTM D2566) .43

Density, gm/cc (ASTM D792) 1.7

Glass Transition, (Tg), °C, (ASTM D3386) 160

Hardness, Shore D (ASTM D2240) 97

Moisture Absorption, % (ASTM D570)

Immersion @ 100°C, 8 hrs 0.25

Extractable Ionic Content (ITM107B)

Chloride (Cl-), ppm 25

Potassium (K+), ppm 25

Sodium 25

Cured Electrical Properties

25°C

K D

1kHz 3.18 0.005

10kHz 3.15 0.006

100kHz 3.04 0.11

Volume Resistivity 6.2 x 1014

Surface Resistivity 1.6 x 1014

K = Dielectric constant by ASTM D150

D = Dissipation Factor by ASTM D150

Vol. Res.= Volume Resistivity in ohm-cm by ASTM D257

Surf.Res.= Surface Resistivity in ohm by ASTM D257

Handling

Pot Life @ 25°C, 77°F, days, 1

(ITM10T), time to double in viscosity

Gel Time @ 121°C, (250°F), minutes,

(ITM10N) 11

Shelf life at room temperature is approximately 2 days. Product may be stored at –40°C for greater than 6 months. Frozen packages must be thawed before use. Warm at room temperature until no longer cool to the touch (normally 20-60 minutes). Do not thaw in an oven or water bath. For best results FP4322 should be dispensed onto a substrate warmed to approximately 90°C. This will help minimize air entrapment under bonding wire.

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or their strong oxidizing materials

 

Cure Schedule

Recommended Cure 2-3 hours @ 170°C or

3-6 hours @ 150°C

Alternate Cure 1 hour @ 125°C plus

(Low Stress) 4 hours @ 150°C

(Designed for packages which are effected by high levels of stress.)

A two-step cure will minimize stress and warpage on large substrates. Curing below 140°C is not recommended. User should gel devices immediately after dispensing to prevent moisture degradation of ultimate cure properties. Use suggested cure schedules as general guidelines; other cure schedules may yield satisfactory results.

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Loctite Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Loctite Corporation’s products. Loctite Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Loctite Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  Henkel Loctite Hysol FP4322 TDS (22.7 KB, 96 次)

PRODUCT DESCRIPTION

Hysol® OS2800 is a fast curing, water-white epoxy casting system designed specifically for the encapsulation of seven segment displays. This new system will cure rapidly at temperature above 100°C and can be colored by the addition of specific dye concentrates, AC7113 red, AC7044 green and AC7112 yellow. AC7117 is recommended as a standard diffusant for OS2800.

TYPICAL APPLICATIONS

Optoelectronic Liquid Encapsulant

PROPERTIES OF UNCURED MATERIAL

OS2800 OS2800

Part A Part B

Color Clear Blue Clear

Lt. Yellow

Specific Gravity @ 25°C, (77°F) 1.15 1.18

Gm/cc ASTM D1475

Shelf Life @ 25°C, (77°F), months 12 6

Typical Value

Viscosity @ 25°C, (77°F)

ASTM D2393

Brookfield RVF , cP 6,500 225

PHYSICAL PROPERTIES, CURED MATERIAL

OS2800

Color Water-white

Coefficient of Thermal Expansion, in/in/°C

ASTM D3386 70 x 10-6

Glass Transition, T(g),°C 130

Moisture Absorption, % (ASTM D570)

24 hours @ 115°C 1.88

7 days @ 25°C 0.45

Hardness, Shore D, (ASTM D2240) 90

Tensile Strength, psi, (ASTM D790) 10,000

Flexural Strength, psi (ASTM D790) 20,000

Cured Electrical Properties

25°C

K D

100 Hz 3.17 0.006

1 kHz 3.13 0.011

10 kHz 3.05 0.014

100 kHz 2.96 0.012

K = Dielectric constant by ASTM D150

D = Dissipation Factor by ASTM D150

Performance Properties

T-Cycles (55°C-+100°C)

<1% failures 1,000 cycles

Light Transmittance 400 nm 800 nm

Initial 75% 90%

After 500 hours @ 121°C 56% 90%

Handling

(Recommended mix ratio and typical mixed properties)

Mix Ratio, parts by weight* 100/106

Pot Life, Hours 5-6

Initial Mixed Viscosity @ 25°C, cP 1100

*Mix ratio of these materials is fixed by their chemistry. Any attempt to increase or decrease the cure rate by adding more or less hardener will result in degraded materials.

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

 

This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be selected as a sealant for chlorine or their strong oxidizing materials

Cure Schedule

(Recommended for optimum properties)

Recommended Cure 4 hours @ 105°C

Note: Larger parts may require 2 hours @ 85°C pre-cure to minimize exotherm. If exotherm temperature exceeds 140°C, severe yellowing will occur. Typical cured properties were determined using the recommended cure schedule. Some differences in properties may occur with the alternate or other cure schedules.

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Loctite Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Loctite Corporation’s products. Loctite Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Loctite Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

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  Henkel Loctite Hysol OS2800 TDS (32.3 KB, 104 次)