CF3350 Film Adhesive, Electrically and Thermally Conductive TDS

今天有个以前的同事咨询到这款产品CF3350 Film Adhesive, Electrically and Thermally Conductive。这原来是emersoncuming旗下的一款产品，后来其被汉高收购后这类产品全部统一归并到Hysol旗下了，找到了新旧两份TDS资料。又在网上找到了一份MSDS资料，还有一份是该产品的使用指南，全部打包放在附件里面提供大家下载学习。从产品本身来说应该是环氧体系的一种导电导热膜，不过在市面上好像并不是很常见，估计也是在某些窄的领域有专门的应用。下面摘抄Tds内容如下，完整版的请下载附件查看之：

 

PRODUCT DESCRIPTION

CF3350 provides the following product characteristics:

Technology Epoxy Film

Appearance Gray Tan

Cure Heat cure

Product Benefits • High electrical conductivity

• High thermal conductivity

• Uniform bondline adhesion

• Custom preforms available

• Adhesion with flexibility

• Void-free bondline

• Clean, easy application with no waste

• Even heat dissipation

• Provides electrical continuity

• Minimum thermal resistance to heat sink

Application Assembly

Filler Type Silver

Operating Temperature -40 to 160 °C

Thickness 2 or 4 mils (±0.5 mils)

Carrier Type Polyester

Typical Assembly

Applications

Circuit board materials, Metal backplanes

and Heatsinks

Substrates Fluoropolymer circuits, Ceramic circuits,

Copper, Brass, Kovar and Aluminum

pH 6.0

CF3350 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Work Life @ 25°C, months 3

Shelf Life @ 5°C (from date of manufacture), months 9

Peak Exotherm Temperature, DSC,

Ramp Rate=10ºC/

177.5ºC ± 5ºC

Flash Point – See MSDS

TYPICAL CURING PERFORMANCE

Cure Schedule

30 minutes @ 150°C

Alternative Cure Schedule

10 minutes @ 175°C or

50 minutes @ 137°C or

120 minutes @ 125°C

Cure Pressure

5 to 60 psi

Cure pressure may vary depending on the materials being bonded and their size. All temperatures are measured at the adhesive and do not include ramp-up time. The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

 

TYPICAL PROPERTIES OF CURED MATERIAL

Physical Properties:

Coefficient of Thermal Expansion TMA:

Below Tg, 10-6//ºC 65

Above Tg, 10-6//ºC 150

Glass Transition Temperature ,DMA, °C 90

Thermal Conductivity, W/mK 7

Thermal Resistance for 1sq cm area @ 10psi assembly pressure:

50μm bondline, W/ºC 0.15

100μm bondline, W/ºC 0.23

Storage Modulus, DMA :

@ -40 °C N/mm² 4,000

(psi) (580,151)

@ 0 °C N/mm² 3,000

(psi) (435,113)

@ 25 °C N/mm² 2,400

(psi) (348,090)

@ 100 °C N/mm² 680

(psi) (98,625)

@ 150 °C N/mm² 60

(psi) (8,702)

Extractable Ionic Content, ppm:

Chloride (Cl-) 50

Sodium (Na+) 30

Potassium (K+) 5

Electrical Properties:

Volume Resistivity, ohm/cm @ 25ºC 0.0002

TYPICAL PERFORMANCE OF CURED MATERIAL

Tensile Lap Shear Strength (psi):

4 mil thickness, @ 25ºC

Substrate

Aluminum to aluminum 3,400

Gold to Gold 3,500

GENERAL INFORMATION

For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).

THAWING:

1. Allow container to reach room temperature before use.

2. DO NOT open the container before contents reach 22°C temperature. Any moisture that collects on the thawed container should be removed prior to opening the container.

 

DIRECTIONS FOR USE

1. While substrate cleaning is not mandatory, wiping with an organic solvent (e.g. isopropanol) is recommended to remove any oils that might interfere with the bonding process .

2. Pressure needs to be applied during cure to promote proper wetting of substrate surfaces. .

3. Common industry practices to apply pressure include the use of spring clamps, lamination presses, dead weights and vacuum bagging.

4. The technique to apply pressure will vary by application and customer preference.

5. For large surface area applications, a load distribution material is recommended between one of the pressure plates and the bonding part in order to equalize the applied pressure over the entire area.

6. After fixturing, the parts are then cured at an elevated temperature.

7. The specified temperatures and times refer to the bondline values. It should be noted that large mass

assemblies will take longer time to achieve bondline temperatures.

8. This material becomes brittle at temperatures below -5ºC. If material goes below this temperature, it should be handled gently and the entire package should be warmed to room temperature before opening. This will minimize the possibility of fracturing in the brittle state or allowing condensation to collect on the product.

 

Not for product specifications

The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.

Storage

Store in original, tightly covered containers in clean, dry areas. Storage information may be indicated on the product container labeling. Usable shelf life may vary depending on method of application and storage conditions

Optimal Storage: 5°C. Storage below 5°C or greater than minus 5°C can adversely affect product properties.

Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.

 

Conversions

(°C x 1.8) + 32 = °F

kV/mm x 25.4 = V/mil

mm / 25.4 = inches

N x 0.225 = lb

N/mm x 5.71 = lb/in

N/mm² x 145 = psi

MPa x 145 = psi

N·m x 8.851 = lb·in

N·m x 0.738 = lb·ft

N·mm x 0.142 = oz·in

mPa·s = Cp

 

Note

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation

specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.

 

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