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【扒一扒】日本高纯球形硅微粉材料生产商
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《【扒一扒】日本高纯球形硅微粉材料生产商》:  作为一种无机非金属矿物功能性粉体材料,硅微粉广泛应用于电子材料、电工绝缘材料、胶黏剂、特种陶瓷、精密铸造、油漆涂料、油墨、硅橡胶等领域。 目前,世界上只有中国、日本、韩国、美国等少数国家具备硅微粉生产能力... 全文 ?

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HERNON Voice Coil Bonder 360 TDS

Product Description

HernonVoice Coil Bonder 360 is a single component, black, heat cure adhesive formulated for bonding and coating voice coil components and high temperature lamination. The cured bond withstands temperatures exceeding 600ºF (316ºC).

Product Benefits

  • • Single component
  • • Excellent resistance to high temperature, chemicals, and water
  • • Flexible, thermal shock resistant bond
  • • Excellent adhesion
  • • High strength at room temperature and elevated temperatures.

Typical Applications

  • • Coating of Aluminum, copper-clad and copper wire coils.
  • • Coating of form materials including Kapton H, HN, HPPST AND MTB, fiberglass composite, aluminum and Nomex. 全文 »

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