双组分underfill产品，好像是用于一道底部填充工艺！
Product Information Sheet
| MATERIAL ID: | EPO-TEK® OE121 Black | ||||||
| Date: 08/2007 | Per: | ||||||
| Rev: III | |||||||
| Material Description: | A two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the electronics, medical, and optical industries. It is a black version of EPO-TEK® OE121. | ||||||
| Number of Components: | Two | ||||||
| Mix Ratio by weight: | 100:35 | ||||||
| Cure Schedule (minimum) | 90°C/1 Hour – 80°C/3 Hours – 23°C/2 Days | ||||||
| Specific Gravity: |
— |
Part A: | 1.18 | Part B: | 0.96 | ||
| Pot Life: | 5 Hours | ||||||
| Shelf Life: | One year at room temperature | ||||||
NOTE: Container(s) should be kept closed when not in use. Filled systems should be stirred thoroughly before mixing and prior to use
| MATERIAL CHARACTERISTICS: To be used as a guide only, not as a specification. Data below is not guaranteed. Different batches, conditions and applications yield differing results; Cure condition: varies as required * denotes test on lot acceptance basis | ||||||||||
| PHYSICAL PROPERTIES: | ||||||||||
| *Color (before cure): | Part A: BlackPart B: Clear/Colorless | Weight Loss: | ||||||||
| *Consistency: | Pourable liquid | @ 200°C: | 1.20 % | |||||||
| *Viscosity (23°C): | @ 250°C: | 1.71 % | ||||||||
| @ 100 rpm | 300 – 500 cPs | @ 300°C: | 3.91 % | |||||||
| Thixotropic Index: | N/A | Operating Temp: | ||||||||
| *Glass Transition Temp: | ≥ 55 °C (Dynamic Cure | Continuous: | – 55°C to + 200°C | |||||||
| 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min) | Intermittent: | – 55°C to + 275°C | ||||||||
| Coefficient of Thermal Expansion (CTE): | Storage Modulus @ 23°C: | 248,652 psi | ||||||||
| Below Tg: | 43 x 10-6 in/in°C | Ion Content: | ||||||||
| Above Tg: | 158 x 10-6 in/in°C | Cl–: | 62 ppm | |||||||
| Shore D Hardness: | 81 | NH4+: | 15 ppm | |||||||
| Lap Shear @ 23°C: | 1,716 psi | Na+: | 16 ppm | |||||||
| Die Shear @ 23°C: | ≥ 15 Kg / 5,100 psi | K+: | 1 ppm | |||||||
| Degradation Temp: | 350 °C | *Particle Size: | ≤ 20 microns | |||||||
| ELECTRICAL AND THERMAL PROPERTIES: | ||||||||||
| Thermal Conductivity: | N/A | Dielectric Constant (1KHz): | 3.67 | |||||||
| Volume Resistivity @ 23°C: | ≥ 1 x 1013 Ohm-cm | Dissipation Factor (1KHz): | 0.012 | |||||||
| OPTICAL PROPERTIES @ 23°C: | ||||||||||
| Spectral Transmission: | < 1 % @ 340-1260 nm | Index of Refraction: | N/A | |||||||
EPOXY TECHNOLOGY, INC.
14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782
WEB SITE: www.epotek.com
Document No. 43 Rev. D
点击下载TDS资料：
OE121_BLACK.pdf (110.0 KB, 8 次)
您没有权限下载此文件。
《【扒一扒】日本高纯球形硅微粉材料生产商》： 作为一种无机非金属矿物功能性粉体材料，硅微粉广泛应用于电子材料、电工绝缘材料、胶黏剂、特种陶瓷、精密铸造、油漆涂料、油墨、硅橡胶等领域。 目前，世界上只有中国、日本、韩国、美国等少数国家具备硅微粉生产能力... 全文 ?