近日有朋友拿来Epo-Tek 353ND的空产品罐，找我了解此款产品的使用及国产化的情况，最早期接触到光纤方面用胶时就是听说的此款型号，后来通过和国内一些光纤厂商的沟通陆续了解了NTT等一些品牌，详情可参看之前写过的《关于光纤及光学器件封装用胶水初探》，不过这两家产品的用途点是完全不一样的。后来咨询了国内之前做此类产品的厂家，索取了一些样品，打算让朋友去尝试一下。 其实这类产品价格貌似也比较透明，在网上就找到了一个公开的报价页面（点击查看之），与实际了解到的价格相差也不是很离谱。今天有空又在Epoxy Technology, Inc.的官网上找到了TDS和MSDS资料，感兴趣的朋友可以下载参考一下：

EPO-TEK® 353ND
Technical Data Sheet
For Reference Only
High Temperature Epoxy

Number of Components:
Two
Frozen Syringe
Minimum Bond Line Cure Schedule*:
Mix Ratio By Weight:
10:1
150°C
1 Minute
Specific Gravity:
1.18
120°C
5 Minutes
Part A
1.20
100°C
10 Minutes
Part B
1.02
80°C
30 Minutes
Pot Life:
≤ 3 Hours
2 Hours
Shelf Life:
One year at 23°C
Six months at -40°C
Note: Container(s) should be kept closed when not in use. *Please see Applications Note available on our website.
-TOTAL MASS SHOULD NOT EXCEED 25 GRAMS -
-- IF PART A CRYSTALIZES IN STORAGE, PLACE CONTAINER IN A WARM OVEN UNTIL CRYSTALIZATION DISAPPEARS. ALLOW TO COOL TO ROOM TEMPERATURE BEFORE MIXING WITH THE PART B HARDENER *Please refer to Tech Tip #7 on our website --

Product Description:
EPO-TEK® 353ND is a two component, high temperature epoxy designed for semiconductor, hybrid, fiber optic, and medical applications. It is one of the most popular EPO-TEK® brand products, and is known throughout the world for its performance and reliability. Also available in a single component frozen syringe.
EPO-TEK® 353ND Advantages & Application Notes:
 Reasonable pot-life that allows for low temperature curing to be realized. It has an amber color change upon cure.
 Passes NASA low outgassing standard ASTM E595 with proper cure - http://outgassing.nasa.gov/
 Semiconductor suggested applications: wafer-wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill.
 Hybrid suggested applications: providing near hermetic seals and UHV seals in sensor devices, resisting high temperature packaging
o Down-Hole petrochemical fiber optic sensors, resisting >200°C field conditions
 Fiber optic adhesive designed to meet Telecordia 1221 - suggested applications:
o Sealing fiber into ferrules, transmitting light in the optical pathway from 800- 1550 nm range
o Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays
 Medical suggested applications:
o Potting fiber optic bundles into ferrules for light guides and endoscopes; capable of resisting several sterilization techniques including ETO, gamma, ION beam, H202 plasma, and >200 autoclave steam cycles; excellent adhesion to surfaces including SST, diamond, titanium, brass, ceramics, glass and most plastics.
o Certified to USP Class VI Biocompatiblility Standards for medical implants; adhesive for catheter devices including stents and guide wires
 Electronics Assembly suggested applications:
o Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics found in ultrasound or ink-jetting devices
o Impregnating and insulating copper coil windings in motors and inductor coils. Bonding ferrite cores and magnets.
o Structural grade epoxy found in hard-disk drive devices; bonding of SST metals, kapton, and magnets
Typical Properties: (To be used as a guide only, not as a specification. Data below is not guaranteed. Different batches, conditions and applications yield differing results; Cure condition: 150°C/1 hour; * denotes test on lot acceptance basis)

Physical Properties:
*Color: Part A: Clear (Gardner <5) Part B: Amber (Gardner <18)
Weight Loss:
*Consistency: Pourable liquid
@ 200°C: 0.22%
*Viscosity (@ 50 RPM/23°C): 3,000 – 5,000 cPs
@ 250°C: 0.39%
Thixotropic Index: N/A
@ 300°C: 0.87%
*Glass Transition Temp.(Tg): ≥ 90°C (Dynamic Cure
Operating Temp:
20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min)
Continuous: - 55°C to 250°C
Coefficient of Thermal Expansion (CTE):
Intermittent: - 55°C to 350°C
Below Tg: 54 x 10-6 in/in/°C
Storage Modulus @ 23°C: 516,912 psi
Above Tg: 206 x 10-6 in/in/°C
Ions: Cl - 329 ppm
Shore D Hardness: 85
Na+
Lap Shear Strength @ 23°C: > 2,000 psi
NH4+ 409 ppm
Die Shear Strength @ 23°C: ≥ 15 Kg / 5,100 psi
K+ 5 ppm
Degradation Temp. (TGA): 412°C
Particle Size: N/A Optical Properties @ 23°C:
Refractive Index @ 23°C (uncured): 1.5694 @ 589 nm
Spectral Transmission: > 50% @ 550 nm; > 98% @ 800-1000 nm
> 95% @ 1100 - 1600 nm Electrical & Thermal Properties:
Thermal Conductivity: N/A
Volume Resistivity @ 23°C: ≥ 1.8 x 1013 Ohm-cm
Dielectric Constant @ 23°C (1 KHz): 3.17
Dissipation Factor @ 23°C (1 KHz): 0.005

复制成文本形式格式都破坏了（但貌似可以增加网站被检索出来的概率，呵呵），感兴趣的朋友可以直接下载附件的TDS和MSDS文件查看之：

  Epoxy Technology 353ND  TDS&MSDS (260.3 KB, 13 次)
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双组分underfill产品，好像是用于一道底部填充工艺！

Document No. 43 Rev. D

点击下载TDS资料：

  OE121_BLACK.pdf (110.0 KB, 8 次)
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