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乐泰反应性热熔胶3541和3542技术资料

之前学习过《关于反应性热熔胶—PUR-HM》里面提到过乐泰的3541和3542两款产品,后来学习乐泰公司《Bonding, Sealing and Coating Solutions for Mobile Devices》中也多次提到此款产品。但在乐泰的官网上没法下载到其TDS资料,google和baidu上也没找到完整的资料,后来在电子胶水论坛上发帖求助,有两位热心的网友@haz_2008和@A_camel给我发来了资料。 惊奇地发现这款产品居然1997年就有了,一份TDS是1997年的,一份是2009年的。但仔细看过之后发现不是同一个产品,一个是环氧体系的(1997年),一个是聚氨酯体系的(2009年)。但怎么会取一样的型号呢,呵呵!第一次发现这个问题。 聚氨酯体系才是最近在手机组装中尤其是触控屏手机组装中应用得非常普遍的这款。这份资料应该还只是实验室数据,里面及提供了几个简单的参数。对比了3541和3542的资料,发现除了open time差一分钟外,其它的好像没有任何区别! 技术资料摘录如下,大家可以到后面下载查看之。

PRODUCT DESCRIPTION

LOCTITE 3541 is a reactive hot-melt adhesive based on polyurethane prepolymers.   The adhesive is pressure sensitive and gives a high initial strength instantly after joining the parts. Additionally it has a long open time to be suitable for automatic or manual assembly line.

The adhesive provides the following characteristics:

Colour: Transparent when molten, after cooling light ivory
Odour: Weak
Density: 1.15±0.05g/cm3
Solids: 100%
Voiscosity: 6000-10000mPa.s  @110degC
Equipment: Brookfield Thermosel, Spindle 27
Open time: 2-4 min
ApplicationTemperature: 110 to 140 degC
Temperature resistance: Short-term (up to 1 h) -30 to 100 degC-30 to 120 degC

Pretreatment

The bonding surfaces must be clean, dry and free of oil and grease.    Substrate temperature  should not fall below 20degC during application.   Lower temperatures will lead to and early solidification of the adhesive and thus to a reduced open time, possibly the adhesive might even flake off.  If necessary the substrates may be preheated, however longer open times and thus extended  cycle times  will have  to be taken  into consideration at temperatures above 45degC.

Application

LOCTITE  3541 can be applied  from heatable  cartridge  guns, from  usual  syringe  type  melting  equipment.    At  longer  rest periods melting and application temperatures should be decreased.   Longer exposure to higher temperatures  can lead to a viscosity increase.

Curing

LOCTITE  3541  cures  exclusively  by  moisture  and  gains  its final strength after 1-5 days, but exhibits high handling strength instantly after joining.

Curing  is  a  chemical  reaction  depending   on  the  following
parameters:
–       Humidity in the rooms of application and storage
–       Humidity of the substrates
–       Permeability of the substrates to be bonded
–       Application weight/ layer of the adhesive film
点击下载附件查看:

  loctite 3541and 3542 TDS (84.4 KB, 29 次)
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华为网盘下载:http://dl.dbank.com/c0knq6tfuz

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