资料

PRODUCT DESCRIPTION FP4323 provides the following product characteristics: Technology Epoxy Appearance (Part A) Black Appearance (Part B) Cream Appearance (Mixed) Black Product Be...

DESCRIPTION Hysol® FP4322 is a high purity liquid epoxy encapsulant designed for semiconductor encapsulation. It is a high flow material which requires a cavity or flow control barrier to preven...

PRODUCT DESCRIPTION Hysol® OS2800 is a fast curing, water-white epoxy casting system designed specifically for the encapsulation of seven segment displays. This new system will cure rapidly at t...

PRODUCT DESCRIPTION FP4450 provides the following product characteristics: Technology Epoxy Appearance Black Product Benefits • High purity • Low stress • Good moisture resistance • Exhibi...

Product Description Hernon  Dissipator  746 is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure co...

PRODUCT DESCRIPTION 384™ provides the following product characteristics: Technology：Acrylic Chemical Type： Modified acrylic Appearance (uncured) ：White to off-white pasteLMS Compo...

今日有人提到loctite 3703的替代品问题，据说是用于四角邦定用途的。翻墙下载了一份TDS技术资料来学习了一下。 从资料显示此款产品是Acrylated urethane聚氨酯丙烯酸酯类型的，可由紫外线及可见光进行固化，尤...

今天有位同事咨询到日本施敏打印8008型号的产品，上网略查了一下，该品牌英文名应该是cemedine，但中文音译就有好多了，呵呵！像施敏打印、施敏打硬、施敏打等等，其官网地址为https://www.cemedine.co.jp/，但是...

今天在论坛有位站友咨询到“有Hysol的HL2002资料吗？谢谢”，参看http://www.r4e.cn/bbs/thread-11621-1-1.html。先上汉高乐泰的官网TDS查询页面找了一下，没有找到对应的技术资料。开始还以为是hysol新推的产品，...

近日又了解到汉高旗下的一款底填胶的型号Hysol 3500，以前汉高的底填材料一般都是以乐泰品牌出现的，不知这款为何延用了Hysol的品牌，从TDS发布的时间来看是2009年2月份，也应该是在3548等的后面，与UF3800类似的...