{"id":3102,"date":"2012-06-12T22:24:25","date_gmt":"2012-06-12T14:24:25","guid":{"rendered":"http:\/\/www.g4e.cn\/wordpress\/?p=3102"},"modified":"2013-11-19T14:33:48","modified_gmt":"2013-11-19T06:33:48","slug":"henkel-hysol-eccobond-d125f-tds","status":"publish","type":"post","link":"http:\/\/www.g4e.cn\/wordpress\/datasheet\/3102.html","title":{"rendered":"HENKEL HYSOL ECCOBOND D125F TDS"},"content":{"rendered":"

\u4e00\u6b3e\u4e0d\u5927\u5e38\u89c1\u7684\u6c49\u9ad8\u65d7\u4e0b\u7684SMT\u7c98\u63a5\u5242\uff0c\u4e0d\u8fc7\u4e0d\u662f\u5728\u4e50\u6cf0\u54c1\u724c\u4e0b\u800c\u662f\u5728HYSOL\u54c1\u724c\u4e0b\uff0c\u5e76\u4e14\u5176\u989c\u8272\u4e5f\u4e0d\u662f\u4f20\u7edf\u7684\u7ea2\u8272\uff0c\u800c\u662f\u9ec4\u8272\u7684\uff0c\u8c8c\u4f3c\u4e4b\u524d\u53ea\u89c1\u8fc7\u8d3a\u5229\u6c0fHeraeus\u65d7\u4e0b\u6709\u9ec4\u8272\u7684\u8d34\u7247\u80f6\uff0c\u800c\u4e14\u4e3b\u8981\u662f\u7528\u4e8e\u5237\u80f6\u7528\u9014\u3002\u800cHSYOL \u6b64\u6b3eD125F\u662f\u7528\u4e8e\u70b9\u80f6\u7684\uff0c\u6709\u5174\u8da3\u4e86\u89e3\u7684\u670b\u53cb\u53ef\u4ee5\u5230\u6587\u7ae0\u672b\u5c3e\u4e0b\u8f7dTDS\u67e5\u770b\u4e4b\uff1a<\/p>\n

PRODUCT DESCRIPTION<\/strong>
\nECCOBOND D125F provides\u00a0the\u00a0following\u00a0product\u00a0characteristics:<\/p>\n\n\n\n<\/colgroup>\n\n\n\n\n\n\n\n\n\n
Technology<\/span><\/td>\nEpoxy<\/span><\/td>\n<\/tr>\n
Appearance<\/span><\/td>\nYellow<\/span><\/td>\n<\/tr>\n
Components<\/span><\/td>\nOne-component<\/span><\/td>\n<\/tr>\n
Product Benefits<\/span><\/td>\n\u2022 Low exotherm
\n<\/span>\u2022 Low water absorption
\n<\/span>\u2022 No stringing
\n<\/span>\u2022 High hot strength
\n<\/span>\u2022 High speed dispensing
\n<\/span>\u2022 Low cure temperature
\n<\/span>\u2022 Non-sag<\/span><\/td>\n<\/tr>\n
Cure<\/span><\/td>\nHeat Cure<\/span><\/td>\n<\/tr>\n
Application<\/span><\/td>\nSurface mount adhesive<\/span><\/td>\n<\/tr>\n
Operating Temperature<\/span><\/td>\n-40 to 105 \u00b0C<\/span><\/td>\n<\/tr>\n
Typical Assembly
\n<\/span>Applications<\/span><\/td>\n		Chip\u00a0\u00a0 capacitors,\u00a0\u00a0 Chip\u00a0\u00a0\u00a0 resistors, SOTs, SOICs and PLCCs<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

 <\/p>\n

ECCOBOND D125F surface mount adhesive is designed for high speed dispensing.<\/p>\n

 <\/p>\n

TYPICAL PROPERTIES OF UNCURED MATERIAL<\/strong><\/p>\n

Viscosity, Brookfield , 25 \u00b0C, mPa\u00b7s (cP):<\/p>\n

Speed 1 rpm, #TD\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 1,500,000 to2,000,000<\/p>\n

Speed 10 rpm, #TD\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 300,000 to 400,000<\/p>\n

Calculated Yield (Bingham), mPa\u00b7s (cP)\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 \u00a0300,000 to 400,000<\/p>\n

Specific Gravity\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 \u00a01.25 to 1.3<\/p>\n

Hegman Fineness, \u00b5m\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 \u00a0<50<\/p>\n

Shelf Life:<\/p>\n

@ 0 to 8\u00baC, months\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 6<\/p>\n

@ 18 to 25\u00baC, months\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 2<\/p>\n

Flash Point – See MSDS<\/p>\n

TYPICAL CURING PERFORMANCE<\/strong><\/p>\n

IR or Convection Conveyor Oven<\/strong><\/p>\n

20 minutes @ 100\u00b0C or<\/p>\n

7 minutes @ 110\u00b0C or<\/p>\n

2.5 minutes @ 120\u00b0C or<\/p>\n

1.5 minutes @ 150\u00b0C<\/p>\n

Convection Box Oven<\/strong><\/p>\n

30 minutes @ 100\u00b0C or<\/p>\n

20 minutes @ 110\u00b0C or<\/p>\n

10 minutes @ 120\u00b0C or<\/p>\n

5 minutes @ 150\u00b0C<\/p>\n

Note: <\/strong>A ramp up temperature of not more than 1\u00b0C per second should be used.<\/p>\n

 <\/p>\n

The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.<\/p>\n\n\n\n<\/colgroup>\n\n\n\n\n\n\n\n\n
TYPICAL PROPERTIES OF CURED MATERIAL
\nPhysical Properties:<\/strong><\/td>\n		<\/td>\n<\/tr>\n
Coefficient of Thermal Expansion ASTM D 3386: Below Tg, ppm\/\u00b0C<\/td>\n55 to 60<\/td>\n<\/tr>\n
Glass Transition Temperature, ISO 11357-2, \u00b0C<\/td>\n85<\/td>\n<\/tr>\n
Coefficient of Thermal Conductivity,\u00a0\u00a0 W\/(m\u00b7K)<\/td>\n0.3<\/td>\n<\/tr>\n
Shore Hardness, ISO 868, Durometer D<\/td>\n>80<\/td>\n<\/tr>\n
Linear Shrinkage, , %<\/td>\n0.5<\/td>\n<\/tr>\n
Degree of Conversion by DSC, %: 3 minutes @ 125\u00b0C<\/td>\n>90<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

 <\/p>\n

Electrical Properties<\/strong>:<\/p>\n

Dielectric Constant IEC 60250: \u00a0 \u00a01mHz \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 3.5<\/p>\n

Volume Resistivity, IEC 60093, \u03a9\u00b7cm \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0 1\u00d71014<\/p>\n

TYPICAL PERFORMANCE OF CURED MATERIAL<\/strong>
\nLap Shear Strength , ISO 4587: \u00a0\u00a0Aluminum @ 25 \u00b0C\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 N\/mm\u00b2 >8 \u00a0 \u00a0\u00a0(psi) (>1,160)<\/p>\n

GENERAL INFORMATION<\/strong><\/p>\n

For safe handling information on this product, consult the\u00a0<\/strong>Material Safety Data Sheet, (MSDS).<\/strong><\/p>\n

THAWING:<\/strong><\/p>\n

1. \u00a0Allow material to reach room temperature before use.<\/p>\n

DIRECTIONS FOR USE<\/strong><\/p>\n

1. \u00a0ECCOBOND D125F can be applied by dispensing, pin transfer, screen or stencil printing.<\/p>\n

2. \u00a0Equipment \u00a0set-up \u00a0and \u00a0related \u00a0product \u00a0information \u00a0is available from your Henkel Corporation support group.<\/p>\n

Storage<\/strong><\/p>\n

Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.<\/p>\n

Optimal Storage : 0 to 8 \u00b0C<\/strong><\/p>\n

Material removed from containers may be contaminated during use. \u00a0Do not return product to the original container. \u00a0Henkel Corporation cannot assume responsibility for product \u00a0which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please\u00a0 \u00a0contact\u00a0\u00a0 your\u00a0 \u00a0local\u00a0 \u00a0Technical\u00a0 \u00a0Service\u00a0 \u00a0Center\u00a0 \u00a0or Customer Service Representative.<\/p>\n

Not for product specifications<\/strong><\/p>\n

The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.<\/p>\n

 <\/p>\n

Conversions<\/strong><\/p>\n

(\u00b0C x 1.8) + 32 = \u00b0F
\nkV\/mm x 25.4 = V\/mil
\nmm \/ 25.4 = inches
\nN x 0.225 = lb
\nN\/mm x 5.71 = lb\/in
\nN\/mm\u00b2 \u00a0x 145 = psi
\nMPa x 145 = psi
\nN\u00b7m x 8.851 = lb\u00b7in
\nN\u00b7m x 0.738 = lb\u00b7ft
\nN\u00b7mm x 0.142 = oz\u00b7in
\nmPa\u00b7s = cP<\/p>\n

 <\/p>\n

Note<\/strong><\/p>\n

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation and its affiliates (\u201cHenkel\u201d) specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel products. Henkel specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. <\/strong>The discussion herein of various processes or compositions is not to be interpreted \u00a0as \u00a0representation \u00a0that\u00a0 they \u00a0are \u00a0free \u00a0from domination of patents owned by others or as a license under any Henkel patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.<\/p>\n

\u534e\u4e3a\u7f51\u76d8\u4e0b\u8f7d\uff1ahttp:\/\/dl.dbank.com\/c0w8bqlm1d<\/a><\/span><\/span><\/p>\n

\u6ce8\u518c\u672c\u5730\u4e0b\u8f7d\uff1a

\"\"  Hysol ECCOBOND D125F TDS<\/strong> (69.6 KB, 10 \u6b21)
\u60a8\u6ca1\u6709\u6743\u9650\u4e0b\u8f7d\u6b64\u6587\u4ef6\u3002<\/i><\/p><\/p>\n","protected":false},"excerpt":{"rendered":"

\u4e00\u6b3e\u4e0d\u5927\u5e38\u89c1\u7684\u6c49\u9ad8\u65d7\u4e0b\u7684SMT\u7c98\u63a5\u5242\uff0c\u4e0d\u8fc7\u4e0d\u662f\u5728\u4e50\u6cf0\u54c1\u724c\u4e0b\u800c\u662f\u5728HYSOL\u54c1\u724c\u4e0b\uff0c\u5e76\u4e14\u5176\u989c\u8272\u4e5f\u4e0d\u662f\u4f20\u7edf\u7684\u7ea2\u8272\uff0c […]<\/p>\n","protected":false},"author":1,"featured_media":3736,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[667],"tags":[623,622,624,625],"_links":{"self":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts\/3102"}],"collection":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/comments?post=3102"}],"version-history":[{"count":0,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts\/3102\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/media\/3736"}],"wp:attachment":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/media?parent=3102"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/categories?post=3102"},{"taxonomy":"post_tag","embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/tags?post=3102"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}