\n| Technology<\/span><\/td>\n | Proprietary Hybrid Chemistry<\/span><\/td>\n<\/tr>\n\n| Appearance<\/span><\/td>\n | Red<\/span><\/td>\n<\/tr>\n\n| Cure<\/span><\/td>\n | Heat cure<\/span><\/td>\n<\/tr>\n\n| Product Benefits<\/span><\/td>\n | \u2022 Non-conductive
\n<\/span>\u2022 Single component
\n<\/span>\u2022 Fast cure
\n<\/span>\u2022 Low cure temperature
\n<\/span>\u2022 Low stress<\/span><\/td>\n<\/tr>\n\n| Application<\/span><\/td>\n | Die attach<\/span><\/td>\n<\/tr>\n\n| pH<\/span><\/td>\n | 3.7<\/td>\n<\/tr>\n | \n| Filler Type<\/span><\/td>\n | Silica<\/span><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n <\/p>\n ABLEBOND 2035SC nonconductive die attach adhesive has\u00a0been formulated for use in high throughput die attach\u00a0applications. This material is designed to minimize stress and\u00a0resulting warpage between dissimilar surfaces.
\nTYPICAL PROPERTIES OF UNCURED MATERIAL
\nThixotropic Index (0.5\/5 rpm) 4.2
\nViscosity, Brookfield CP51, 25 \u00b0C, mPa\u00b7s (cP):\u00a0Speed 5 rpm 11,000
\nWork Life @ 25\u00b0C, hours 24
\nShelf Life @ -40\u00b0C (from date of manufacture), year 1<\/p>\n TYPICAL CURING PERFORMANCE
\nCure Schedule
\n90 seconds @ 110\u00b0C
\nAlternative Cure Schedule
\n60 seconds @ 120\u00b0C or 10 seconds @ 150\u00b0C
\nThe above cure profiles are guideline recommendations. Cure\u00a0conditions (time and temperature) may vary based on customers’
\nexperience and their application requirements, as well as customer\u00a0curing equipment, oven loading and actual oven temperatures.
\nTYPICAL PROPERTIES OF CURED MATERIAL
\nPhysical Properties:
\nCoefficient of Thermal Expansion :
\nBelow Tg, ppm\/\u00b0C 54
\nAbove Tg, ppm\/\u00b0C 128
\nGlass Transition Temperature (Tg) by TMA, \u00b0C 120
\nThermal Conductivity, W\/mK 0.35<\/p>\n Tensile Modulus, DMTA :
\n@ -65 \u00b0C N\/mm\u00b2 3,700 \u00a0(psi) (540,000)
\n@ 25 \u00b0C N\/mm\u00b2 2,500 \u00a0(psi) (360,000)
\n@ 150 \u00b0C N\/mm\u00b2 70 \u00a0(psi) (11,000)
\n@ 250 \u00b0C N\/mm\u00b2 68 \u00a0(psi) (10,000)
\nExtractable Ionic Content, ppm:
\nChloride (Cl-) <30
\nSodium (Na+) <50
\nPotassium (K+) <20
\nWater Extract Conductivity, \u03bcmhos\/cm 75
\nWeight Loss @ 300\u00baC, % 2.51<\/p>\n TYPICAL PERFORMANCE OF CURED MATERIAL
\nDie Shear Strength:\u00a02 X 2 mm die, kg-f,<\/p>\n \n\n <\/colgroup>\n\n\n| Die on Substrate:<\/span><\/td>\n | @25\u00b0C<\/span><\/td>\n<\/tr>\n\n| Au die on Au PBGA<\/span><\/td>\n | 11<\/td>\n<\/tr>\n | \n| Si die on Ag leadframe<\/span><\/td>\n | 13<\/td>\n<\/tr>\n | \n| Si die on Pd leadframe<\/span><\/td>\n | 12<\/td>\n<\/tr>\n | \n| Si die on PBGA-FR4<\/span><\/td>\n | 12<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n <\/p>\n Die Shear Strength vs Temperature, kg-f:
\n3 X 3 mm Si die, kg-f,<\/p>\n \n\n\n\n\n <\/colgroup>\n\n\n| Substrate<\/span><\/td>\n | @25\u00b0C<\/span><\/td>\n | @150\u00b0C<\/span><\/td>\n | @200\u00b0C<\/span><\/td>\n<\/tr>\n\n| PBGA-FR4<\/span><\/td>\n | 25<\/td>\n | 7.0<\/td>\n | 4.0<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n <\/p>\n Chip Warpage vs Chip Size:
\n0.38 mm thick Si die on Diff substrates @ 25\u00b0C, \u03bcm<\/p>\n \n\n <\/colgroup>\n\n\n| Chip Size:<\/span><\/td>\n | Warpage:<\/span><\/td>\n<\/tr>\n\n| 12.7 x 12.7 mm<\/span><\/td>\n | 34<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n <\/p>\n GENERAL INFORMATION
\nFor safe handling information on this product, consult the \u00a0Material Safety Data Sheet, (MSDS).
\nTHAWING:
\n1. Allow container to reach room temperature before use.
\n2. After removing from the freezer, set the syringes to stand\u00a0vertically while thawing.
\n3. DO NOT open the container before contents reach 25\u00b0C\u00a0temperature. Any moisture that collects on the thawed\u00a0container should be removed prior to opening the\u00a0container.
\n4. DO NOT re-freeze. Once thawed to -40\u00b0C, the adhesive\u00a0should not be re-frozen.<\/p>\n DIRECTIONS FOR USE
\n1. Thawed adhesive should be immediately placed on\u00a0dispense equipment for use.
\n2. If the adhesive is transferred to a final dispensing\u00a0reservoir, care must be exercised to avoid entrapment of\u00a0contaminants and\/or air into the adhesive.
\n3. Adhesive must be completely used within the product’s\u00a0recommended work life.
\nNot for product specifications
\nThe technical data contained herein are intended as reference\u00a0only. Please contact your local quality department for\u00a0assistance and recommendations on specifications for this\u00a0product.
\nStorage
\nStore product in the unopened container in a dry location.\u00a0Storage information may be indicated on the product container\u00a0labeling.\u00a0Optimal Storage: -40 \u00b0C. Storage below minus (-)40 \u00b0C or\u00a0greater than minus (-)40 \u00b0C can adversely affect product
\nproperties.
\nMaterial removed from containers may be contaminated during\u00a0use. Do not return product to the original container. Henkel\u00a0Corporation cannot assume responsibility for product which\u00a0has been contaminated or stored under conditions other than\u00a0those previously indicated. If additional information is required,\u00a0please contact your local Technical Service Center or\u00a0Customer \u00a0service Representative.
\nConversions
\n(\u00b0C x 1.8) + 32 = \u00b0F
\nkV\/mm x 25.4 = V\/mil
\nmm \/ 25.4 = inches
\nN x 0.225 = lb
\nN\/mm x 5.71 = lb\/in
\nN\/mm\u00b2 x 145 = psi
\nMPa x 145 = psi
\nN\u00b7m x 8.851 = lb\u00b7in
\nN\u00b7m x 0.738 = lb\u00b7ft
\nN\u00b7mm x 0.142 = oz\u00b7in
\nmPa\u00b7s = cP<\/p>\n <\/p>\n \u4e0b\u8f7d\u9644\u4ef6\u67e5\u770b\u5168\u6587\uff1a<\/p>\n \u534e\u4e3a\u7f51\u76d8\u4e0b\u8f7d\uff1ahttp:\/\/dl.dbank.com\/c0gsn1uyya<\/a><\/p>\n\u6ce8\u518c\u672c\u5730\u4e0b\u8f7d\uff1a ![\"\"](\"http:\/\/www.g4e.cn\/wordpress\/wp-content\/plugins\/hacklog-downloadmanager\/images\/ext\/pdf.gif\" "\\"\\"") ABLEBOND 2035SC-EN<\/strong> (64.7 KB, 15 \u6b21)
\u60a8\u6ca1\u6709\u6743\u9650\u4e0b\u8f7d\u6b64\u6587\u4ef6\u3002<\/i><\/p><\/p>\n","protected":false},"excerpt":{"rendered":"\u8fd9\u662fablestik\u6bd4\u8f83\u7ecf\u5178\u7684\u56fa\u6676\u7edd\u7f18\u80f6\u4e4b\u4e00\uff0c\u4e4b\u524d\u4ecb\u7ecd\u7684\u300aHENKEL ABLESTIK ABLEBOND 2 […]<\/p>\n","protected":false},"author":1,"featured_media":3748,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[667],"tags":[591,592,593,594],"_links":{"self":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts\/3071"}],"collection":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/comments?post=3071"}],"version-history":[{"count":0,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts\/3071\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/media\/3748"}],"wp:attachment":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/media?parent=3071"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/categories?post=3071"},{"taxonomy":"post_tag","embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/tags?post=3071"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}
| | | | | | | | | | | |