\n<\/span>\u2022 Fast cure
\n<\/span>\u2022 Black\u00a0 pigmentation\u00a0 for\u00a0 blocking\u00a0 stray light<\/span><\/td>\n<\/tr>\n
ABLEBOND 8387B \u00a0nonconductive \u00a0die \u00a0attach \u00a0adhesive \u00a0has been formulated for use in high throughput die attach applications. This adhesive can be fast cured using directed heat energy or hot plate curing techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100\u00baC.<\/p>\n
TYPICAL PROPERTIES OF UNCURED MATERIAL
\nThixotropic Index (0.5\/5 rpm) \u22654.5
\nViscosity, Brookfield CP51, 25 \u00b0C, mPa\u00b7s (cP): \u00a0Speed 5 rpm 9,500
\nWork Life @ 25\u00b0C, hours 48
\nShelf Life @ -40\u00b0C (from date of manufacture), year 1<\/p>\n
TYPICAL CURING PERFORMANCE
\nCure Schedule\u00a0\u00a0 2 minutes @ 150\u00b0C
\nAlternative Cure Schedule\u00a0\u00a0 30 minutes @ 100\u00b0C
\nThe above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.<\/p>\n
TYPICAL PROPERTIES OF CURED MATERIAL
\nPhysical Properties:
\nCoefficient of Thermal Expansion : \u00a0\u00a0Below Tg, ppm\/\u00b0C 94
\nAbove Tg, ppm\/\u00b0C 165
\nGlass Transition Temperature (Tg) by TMA, \u00b0C \u00a0 \u00a0 \u00a096<\/p>\n
Tensile Modulus, DMTA :
\n@ -65 \u00b0C \u00a0 \u00a0 N\/mm\u00b2 \u00a0 \u00a0 2,840 \u00a0 \u00a0(psi) (411,000)
\n@ 25 \u00b0C \u00a0 \u00a0 \u00a0N\/mm\u00b2 \u00a0 \u00a0 1,400 \u00a0 \u00a0(psi) (203,000)
\n@ 100 \u00b0C \u00a0 N\/mm\u00b2 \u00a0 \u00a0 580 \u00a0 \u00a0 \u00a0\u00a0(psi) (84,000)
\n@ 150 \u00b0C N\/mm\u00b2 \u00a0 \u00a0 \u00a0 77 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0(psi) (11,000)
\n@ 200 \u00b0C N\/mm\u00b2 \u00a0 \u00a0 \u00a059 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0(psi) (8,500)
\n@ 250 \u00b0C N\/mm\u00b2 \u00a0 \u00a0 \u00a053 \u00a0 \u00a0 \u00a0 \u00a0 \u00a0(psi) (7,700)
\nExtractable Ionic Content, @ 100\u00b0C ppm: \u00a0 \u00a0Chloride (Cl-) <300
\nSodium (Na+) <10
\nPotassium (K+) <5
\nWater Extract Conductivity, \u03bcmhos\/cm \u00a0 \u00a0 \u00a0 \u00a0 190<\/p>\n
TYPICAL PERFORMANCE OF CURED MATERIAL
\nDie Shear Strength:
\n2 X 2 mm Si die, MPa (psi),<\/p>\n
Substrate<\/strong><\/td>\n| \n | @25\u00b0C<\/strong><\/p>\n<\/td>\n<\/tr>\n 27 (3900)<\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n 3 X 3 mm Si die, MPa (psi),<\/p>\n Substrate<\/strong><\/p>\n<\/td>\n @25\u00b0C<\/strong><\/p>\n<\/td>\n<\/tr>\n 12.7 X 12.7 mm Si die, MPa (psi),<\/p>\n @250\u00b0C<\/strong><\/p>\n<\/td>\n<\/tr>\n 1.9 (270)<\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n Chip Warpage vs Chip Size: Warpage:<\/strong><\/p>\n<\/td>\n<\/tr>\n 35<\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n GENERAL INFORMATION<\/strong><\/p>\n For safe handling information on this product, consult the<\/strong><\/p>\n Material Safety Data Sheet, (MSDS).<\/strong><\/p>\n THAWING:<\/strong><\/p>\n 1. \u00a0Allow container to reach room temperature before use.<\/p>\n 2. \u00a0After removing from the freezer, set the syringes to stand vertically while thawing.<\/p>\n 3. \u00a0DO NOT open the container before contents reach 25\u00b0C temperature. Any moisture that collects on the thawed container should be removed prior to opening the container.<\/p>\n 4. \u00a0DO NOT re-freeze. Once thawed to -40\u00b0C, the adhesive should not be re-frozen.<\/p>\n <\/p>\n DIRECTIONS FOR USE<\/strong><\/p>\n 1. Thawed adhesive should be immediately placed on dispense equipment for use.<\/p>\n 2. \u00a0If \u00a0the \u00a0adhesive \u00a0is \u00a0transferred \u00a0to \u00a0a \u00a0final \u00a0dispensing reservoir, care must be exercised to avoid entrapment of contaminants and\/or air into the adhesive.<\/p>\n 3. Adhesive must be completely used within the products recommended work life of 48 hours.<\/p>\n <\/p>\n Not for product specifications<\/strong><\/p>\n The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.<\/p>\n <\/p>\n Storage<\/strong><\/p>\n Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling.<\/p>\n Optimal Storage: \u00a0-40 \u00b0C. \u00a0Storage below minus (-)40 \u00b0C or greater than minus (-)40 \u00b0C can adversely affect product properties.<\/strong><\/p>\n Material removed from containers may be contaminated during use. \u00a0Do not return product to the original container. \u00a0Henkel Corporation cannot assume responsibility for product \u00a0which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please\u00a0 \u00a0contact\u00a0\u00a0 your\u00a0 \u00a0local\u00a0 \u00a0Technical\u00a0 \u00a0Service\u00a0 \u00a0Center\u00a0 \u00a0or Customer Service Representative.<\/p>\n <\/p>\n Conversions<\/strong><\/p>\n (\u00b0C x 1.8) + 32 = \u00b0F kV\/mm x 25.4 = V\/mil mm \/ 25.4 = inches<\/p>\n N x 0.225 = lb N\/mm x 5.71 = lb\/in N\/mm\u00b2 \u00a0x 145 = psi MPa x 145 = psi N\u00b7m x 8.851 = lb\u00b7in N\u00b7m x 0.738 = lb\u00b7ft<\/p>\n N\u00b7mm x 0.142 = oz\u00b7in mPa\u00b7s = cP<\/p>\n Note<\/strong><\/p>\n The data contained herein are furnished for information only and are believed to be reliable.\u00a0 We cannot assume responsibility for the results obtained by others over whose methods we have no control. \u00a0It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation\u2019s products. \u00a0Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. <\/strong>The discussion herein of various processes or compositions is not to be interpreted \u00a0as \u00a0representation \u00a0that\u00a0 they \u00a0are \u00a0free \u00a0from domination of patents owned by others or as a license under any\u00a0 \u00a0Henkel\u00a0 \u00a0Corporation\u00a0 \u00a0patents\u00a0 \u00a0that\u00a0\u00a0 may\u00a0 \u00a0cover\u00a0 \u00a0such processes or compositions.\u00a0 We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. \u00a0This product may be covered by one or more United States or foreign patents or patent applications.<\/p>\n \u636e\u8bf4\u662f\u4f7f\u752830G\u9488\u5934\u70b9\u80f6\u4e0d\u5835\u9488\u5934\uff0c\u800c\u4e14\u53ef\u4ee580\u5ea6\u56fa\u5316\u7684\u80f6\u6c34\u3002\u4f46\u662f\u67e5\u5230\u4e86\u56db\u4e2a\u578b\u53f7\uff0c\u4e0d\u77e5\u9053\u54ea\u4e2a\u662f\u8fd9\u4e2a\u5e94\u7528\u70b9\u3002\u5835\u9488\u5934\u53ef\u662f\u5f88\u591a\u80f6\u6c34\u90fd\u53ef\u80fd\u9700\u8981\u9762\u5bf9\u7684\u95ee\u9898\u3002 \uff08\u56fd\u5185\u7684\u4e24\u5bb6\u516c\u53f8\u636e\u8bf4\u4e5f\u5feb\u5f00\u53d1\u51fa\u7c7b\u4f3c\u7684\u80f6\u6c34\uff0c\u5173\u6ce8\u9a8c\u8bc1\u4e2d\uff09<\/p>\n |
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ablebond 8387B<\/strong> (248.6 KB, 8 \u6b21)