{"id":2995,"date":"2012-03-16T20:12:54","date_gmt":"2012-03-16T12:12:54","guid":{"rendered":"http:\/\/www.g4e.cn\/wordpress\/?p=2995"},"modified":"2013-11-19T15:12:58","modified_gmt":"2013-11-19T07:12:58","slug":"henkel-hysol-underfill-uf3810-tds-msds-data","status":"publish","type":"post","link":"http:\/\/www.g4e.cn\/wordpress\/datasheet\/2995.html","title":{"rendered":"HENKEL HYSOL UNDERFILL UF3810 TDS&#038;MSDS\u8d44\u6599"},"content":{"rendered":"<p>\u6c49\u9ad8\u516c\u53f83\u670812\u65e5\u5728\u5b98\u7f51\u53d1\u5e03\u4e86\u4ed6\u4eec\u6700\u65b0\u7684\u5e95\u586b\u80f6\u6c34\u4ea7\u54c1UF3810\u4ea7\u54c1\u7684\u76f8\u5173\u65b0\u95fb\uff0c\u5b98\u7f51TDS\u6570\u636e\u5e93\u91cc\u9762\u4e5f\u6709\u5bf9\u5e94\u7684TDS\u8d44\u6599\u3002\u8d44\u6599\u663e\u793a\u662f2011\u5e7412\u6708\u4efd\u53d1\u5e03\u7684\u3002\u6458\u5f55\u5b66\u4e60\u4e4b\uff1a<\/p>\n<p><strong>PRODUCT DESCRIPTION<\/strong><\/p>\n<p>UF3810 provides the following product characteristics:<\/p>\n<table width=\"600\" border=\"0\" cellspacing=\"0\" cellpadding=\"0\">\n<tbody>\n<tr>\n<td valign=\"top\" width=\"116\"><strong>Technology<\/strong><\/td>\n<td valign=\"top\" width=\"278\">Epoxy<\/td>\n<\/tr>\n<tr>\n<td valign=\"top\" width=\"116\">Appearance<\/td>\n<td valign=\"top\" width=\"278\">Black liquid<\/td>\n<\/tr>\n<tr>\n<td valign=\"top\" width=\"116\">Product Benefits<\/td>\n<td valign=\"top\" width=\"278\">\u25cf\u00a0 \u00a0One component\u25cf\u00a0 \u00a0Fast cure at moderate temperatures\u25cf\u00a0 \u00a0High Tg<\/p>\n<p>\u25cf\u00a0 \u00a0Halogen free<\/p>\n<p>\u25cf\u00a0 \u00a0Compatible with most Pb-free solders<\/p>\n<p>\u25cf\u00a0 \u00a0Stable electrical performance in\u00a0Temperature Humidity Bias<\/p>\n<p>\u25cf\u00a0 \u00a0Reworkable<\/td>\n<\/tr>\n<tr>\n<td valign=\"top\" width=\"116\"><strong>Cure<\/strong><\/td>\n<td valign=\"top\" width=\"278\">Heat cure<\/td>\n<\/tr>\n<tr>\n<td valign=\"top\" width=\"116\"><strong>Application<\/strong><\/td>\n<td valign=\"top\" width=\"278\">Underfill<\/td>\n<\/tr>\n<tr>\n<td valign=\"top\" width=\"116\">Typical Package\u00a0Application<\/td>\n<td valign=\"top\" width=\"278\">Chip scale packages and BGA<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p>&nbsp;<\/p>\n<p>UF3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to\u00a0minimize stress to other components. When cured, this material provides excellent mechanical properties to\u00a0protect solder joints during thermal cycling.<\/p>\n<p>TYPICAL PROPERTIES OF UNCURED MATERIAL<br \/>\nViscosity, Cone &amp; Plate,@ 25 \u00b0C , mPa\u2219s (cP):<br \/>\n@ 20 s-1 394<br \/>\nSpecific Gravity, 1.13<br \/>\nPot life @ 25 \u00b0C, 25% viscosity increase, days 3<br \/>\nShelf Life @ -20\u00b0C (from date of manufacture), months 6<br \/>\nFlash Point &#8211; See MSDS<\/p>\n<p>TYPICAL CURING PERFORMANCE<br \/>\nCure Schedule \u00a0 \u00a0\u22658 minutes @ 130\u00b0C<br \/>\nThe above cure profile is a guideline recommendation. Cure conditions\u00a0(time and temperature) may vary based on customers&#8217; experience and\u00a0their application requirements, as well as customer curing equipment,\u00a0oven loading and actual oven temperatures.<\/p>\n<p>TYPICAL PROPERTIES OF CURED MATERIAL<br \/>\nPhysical Properties:<br \/>\nCoefficient of Thermal Expansion , TMA, ppm\/\u00b0C:<br \/>\nBelow Tg 55<br \/>\nAbove Tg 171<br \/>\nGlass Transition Temperature (Tg) by TMA, \u00b0C 102<br \/>\nStorage Modulus, DMA:<br \/>\n@ 25 \u00b0C N\/mm\u00b2 2,990<br \/>\n(psi) (435,000)<\/p>\n<p>Electrical Properties:<br \/>\nDielectric Constant @ 23\u00baC :<br \/>\n@ 1GHz 3.44<br \/>\n@ 2GHz 2.87<br \/>\nDissipation Factor @ 23\u00baC:<br \/>\n@ 1GHz 0.0071<br \/>\n@ 2GHz 0.0037<br \/>\nTYPICAL PERFORMANCE OF CURED MATERIAL<br \/>\nLap Shear Strength , ISO 4587: \u00a0Glass Epoxy to Glass Epoxy N\/mm\u00b2 9.7(psi) (1,400)<\/p>\n<p>GENERAL INFORMATION<br \/>\nFor safe handling information on this product, consult the\u00a0Material Safety Data Sheet, (MSDS).<br \/>\nTHAWING:<br \/>\n1. Thaw 30 cc syringes at least 1 hour at room temperature\u00a0prior to use.<br \/>\n2. Allow container to reach room temperature before use.<br \/>\n3. After removing from the freezer, set the syringes to stand\u00a0vertically while thawing.<br \/>\n4. DO NOT open the container before contents reach 25\u00b0C\u00a0temperature. Any moisture that collects on the thawed\u00a0container should be removed prior to opening the\u00a0container.<br \/>\n5. DO NOT re-freeze. Once thawed to 25\u00b0C, the adhesive\u00a0should not be re-frozen.<br \/>\nDIRECTIONS FOR USE<br \/>\n1. Thawed adhesive should immediately be placed on\u00a0dispense equipment for use.<br \/>\n2. If the adhesive is transferred to a final dispensing\u00a0reservoir, care must be exercised to avoid entrapment of\u00a0contaminants and\/or air into the adhesive.<br \/>\n3. Adhesive must be completely used within the product&#8217;s\u00a0recommended work life.<br \/>\nNot for product specifications<br \/>\nThe technical data contained herein are intended as reference\u00a0only. Please contact your local quality department for\u00a0assistance and recommendations on specifications for this\u00a0product.<br \/>\nStorage<br \/>\nStore product in the unopened container in a dry location.\u00a0Storage information may be indicated on the product container<br \/>\nlabeling.<\/p>\n<p>&nbsp;<\/p>\n<p>\u534e\u4e3a\u7f51\u76d8\u4e0b\u8f7d\uff1a<a href=\"http:\/\/dl.dbank.com\/c07tn5h5gj\" target=\"_blank\">http:\/\/dl.dbank.com\/c07tn5h5gj<\/a><\/p>\n<p>\u6ce8\u518c\u672c\u5730\u4e0b\u8f7d\uff1a<p><img src=\"http:\/\/www.g4e.cn\/wordpress\/wp-content\/plugins\/hacklog-downloadmanager\/images\/ext\/pdf.gif\" alt=\"\" title=\"\" style=\"vertical-align: middle;\" \/>&nbsp;&nbsp;<strong>UF3810 TDS<\/strong> (63.4 KB, 15 \u6b21)<br \/><i>\u60a8\u6ca1\u6709\u6743\u9650\u4e0b\u8f7d\u6b64\u6587\u4ef6\u3002<\/i><\/p>\u00a0<p><img src=\"http:\/\/www.g4e.cn\/wordpress\/wp-content\/plugins\/hacklog-downloadmanager\/images\/ext\/pdf.gif\" alt=\"\" title=\"\" style=\"vertical-align: middle;\" \/>&nbsp;&nbsp;<strong>UF3810 MSDS<\/strong> (44.5 KB, 10 \u6b21)<br \/><i>\u60a8\u6ca1\u6709\u6743\u9650\u4e0b\u8f7d\u6b64\u6587\u4ef6\u3002<\/i><\/p><\/p>\n","protected":false},"excerpt":{"rendered":"<p>\u6c49\u9ad8\u516c\u53f83\u670812\u65e5\u5728\u5b98\u7f51\u53d1\u5e03\u4e86\u4ed6\u4eec\u6700\u65b0\u7684\u5e95\u586b\u80f6\u6c34\u4ea7\u54c1UF3810\u4ea7\u54c1\u7684\u76f8\u5173\u65b0\u95fb\uff0c\u5b98\u7f51TDS\u6570\u636e\u5e93\u91cc\u9762\u4e5f\u6709\u5bf9\u5e94\u7684 [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":3736,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[667],"tags":[195,193,531,532],"_links":{"self":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts\/2995"}],"collection":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/comments?post=2995"}],"version-history":[{"count":0,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts\/2995\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/media\/3736"}],"wp:attachment":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/media?parent=2995"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/categories?post=2995"},{"taxonomy":"post_tag","embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/tags?post=2995"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}