{"id":285,"date":"2009-01-18T21:51:44","date_gmt":"2009-01-18T13:51:44","guid":{"rendered":"http:\/\/www.g4e.cn\/wordpress\/?p=285"},"modified":"2013-11-14T16:13:22","modified_gmt":"2013-11-14T08:13:22","slug":"advanced-packaging-and-wafer-level-packaging-of-the-basic-principles","status":"publish","type":"post","link":"http:\/\/www.g4e.cn\/wordpress\/electronicindustry\/285.html","title":{"rendered":"\u5148\u9032\u5c01\u88dd\u8207\u6676\u5713\u7d1a\u5c01\u88dd\u7684\u57fa\u672c\u539f\u7406"},"content":{"rendered":"

\u4eca\u65e5\u62bd\u7a7a\u5728\u5bb6\u770b\u4e86\u6b64\u7bc7\u8bb2\u7a3f\u2014\u300a\u5148\u9032\u5c01\u88dd\u8207\u6676\u5713\u7d1a\u5c01\u88dd\u7684\u57fa\u672c\u539f\u7406\u300b\uff0c\u662f\u7531\u98db\u4fe1\u534a\u5c0e\u9ad4\u80a1\u4efd\u6709\u9650\u516c\u53f8\u7814\u53d1\u5904\uff08International Semiconductor Technology Ltd. \u6771\u65b9\u6280\u8853\u5b78\u9662\uff09\u7684\u6768\u667a\u8f89\u5148\u751f\uff08Charles Yang\uff09\u4e8e2004\u5e74\u5e95\u64b0\u5199\u7684\uff0c\u4e3b\u8981\u662f\u9488\u5bf9CSP, WLP, Flip Chip, MCP\/SiP& Lead Free\u7b49\u5148\u8fdb\u7684\u5c01\u88c5\u65b9\u5f0f\u7684\u539f\u7406\u53ca\u76f8\u5173\u5e94\u7528\u505a\u4e86\u5168\u9762\u7684\u9610\u8ff0\uff0c\u4e0b\u9762\u5c31\u6458\u5f55\u90e8\u5206\u4ee5\u53ca\u4e0e\u7535\u5b50\u80f6\u6c34\u76f8\u5173\u7684\u90e8\u5206\u4e0e\u5927\u5bb6\u5206\u4eab\u4e4b\uff1a<\/p>\n

\u4e0e\u7535\u5b50\u80f6\u6c34\u76f8\u5173\u5185\u5bb9\uff1a
\n\u25a0Why Underfill?
\nTheunderfillprotects the bumps from moisture or other environmental hazards, and provides additional mechanical strength to the assembly. However, its most important purpose is to compensate for any thermal expansion difference between the chip and the substrate.Underfillmechanically “locks together” chip and substrateso that differences in thermal expansion do not break or damage the electrical connection of the bumps
\nUnderfillmay be needle-dispensed along the edges of each chip. It is drawn into theunder-chip space by capillary action, and heat-cured to form a permanent bond.
\n\u25a0Process Anisotropic Conductive Film (ACF) COG\/ NCP Process Flow
\nFilm \u2192Pre-Laminate\u2192Pre-Bonding\u2192Final Bonding
\n\u25a0\u586b\u81a0\u6280\u8853(Underfilldispensing)
\na.\u9ede\u81a0\u6a5f\u53f0\u52a0\u71b1\u7cfb\u7d71\uff1a\u6eab\u5ea6\u8981\u7a69\u5b9a\u8aa4\u5dee\u5c0f\uff0c\u6eab\u5ea6\u63a7\u5236\u8aa4\u5dee\u00b15\u2103\u4ee5\u4e0b\u3002\u57fa\u677f\u8981\u5e73\u8cbc\u5728\u52a0\u71b1\u5de5\u4f5c\u53f0\u4e0a\uff0c\u4f7f\u57fa\u677f\u5747\u52fb\u53d7\u71b1\u3002\u81a0\u91cf\u63a7\u5236\uff1a\u8981\u91cf\u5316\u3001\u6709\u76e3\u63a7\u53ca\u6821\u6b63\u7cfb\u7d71\u4e14\u91cd\u73fe\u6027\u4f73\u3002
\nb.\u52a0\u71b1\u65b9\u5f0f\uff1a\u52a0\u71b1\u5668\u6578\u91cf\uff0c\u7247\u72c0\u6216\u689d\u72c0\u5747\u6703\u5f71\u97ff\u6eab\u5ea6\u5747\u52fb\u5ea6\uff0c\u5de5\u6eab\u5ea6\u8aa4\u5dee\u4f5c\u53f0\u9762\u00b15\u2103\u4ee5\u4e0b\u3002
\nc.\u9ede\u81a0\u5716\u5f62\uff1a\u4e8b\u5148\u5206\u6790\u9ede\u81a0\u8def\u5f91\u9078\u64c7\u4e00\u5b57\u5f62\u3001L\u5b57\u5f62\u3001U\u5b57\u5f62\u90a3\u4e00\u578b\u6700\u9069\u5408\uff1f
\nd.\u8986\u6676\u586b\u81a0\u88fd\u7a0b\u5728\u5168\u90e8\u88fd\u7a0b\u4e2d\u901f\u5ea6\u6700\u6162\uff0c\u56e0\u70ba\u81a0\u6750\u4ee5\u6bdb\u7d30\u73fe\u8c61\u5728\u5fae\u5c0f\u9593\u9699\u5167\u6d41\u52d5\uff0c\u6676\u7c92\u5c3a\u5bf8\u589e\u52a0\u8981\u7dad\u6301\u826f\u54c1\u7387\u662f\u5f88\u56f0\u96e3\u7684\u4ea6\u5373\u9ede\u81a0\u6642\u9593\u548c\u5305\u8986\u6c23\u6ce1\u7684\u6a5f\u7387\u76f8\u5c0d\u589e\u52a0\u3002
\n\u25a0\u5404\u7a2e\u6d41\u52d5\u6a21\u5f0f\u6d41\u52d5\u5206\u6790
\n\u9ede\u81a0\u54c1\u8cea\u6703\u53d7\u5230\u6676\u7c92\u5c3a\u5bf8\u3001\u51f8\u584a\u6392\u5217\u4ee5\u53ca\u5bc6\u5ea6\u3001\u63a5\u9ede\u9ad8\u5ea6\u3001\u5de5\u4f5c\u6eab\u5ea6\u3001\u57fa\u677f\u5f71\u97ff\uff0c\u4e26\u4e14\u767c\u63ee\u81a0\u6750\u7279\u6027\uff0c\u53e6\u5916\u69cb\u88dd\u8a2d\u8a08\u968e\u6bb5\u5373\u5c07\u586b\u81a0\u5de5\u7a0b\u4e00\u4f75\u8003\u616e\uff0c\u65b9\u5448\u73fe\u826f\u597d\u7684\u9ede\u81a0\u54c1\u8cea\u3002
\n\u25a0\u9ede\u81a0\u6a5f\u9ede\u81a0\u95a5\u6bd4\u8f03
\n\u5982\u5716\u6240\u793a\u4e09\u7a2e\u9ede\u81a0\u95a5\uff1bNeedle\u95a5\uff1a\u9ede\u81a0\u91cf\u56e0\u81a0\u9ecf\u5ea6\u8b8a\u5316\u800c\u6539\u8b8a\uff0c\u9ede\u81a0\u91cf\u91cd\u73fe\u6027\uff1e\u00b110\ufe6a\u3002Auger\u95a5\uff1a\u9ede\u81a0\u91cf\u91cd\u73fe\u6027\u00b14\ufe6a\u81f3\u00b110\ufe6a\uff0c\u9ede\u81a0\u91cf\u4e5f\u6703\u56e0\u81a0\u9ecf\u5ea6\u8b8a\u5316\u800c\u6539\u8b8a\u3002LPDP\u95a5\uff1a\u9ede\u81a0\u91cf\u4e0d\u6703\u56e0\u81a0\u9ecf\u5ea6\u8b8a\u5316\uff0c\u9ede\u81a0\u91cf\u91cd\u73fe\u6027\u572820\u03bcc.c \u4ee5\u4e0b\u9ede\u81a0\u91cf\u00b11\ufe6a\u3002
\n\u25a0Dispensing Liquid Encapsulants:\u00a0 Glob-top\u2022Dam & Fill\u2022Underfill
\nlone of function of the bump is to provide a space between the chip and the board. In the final stage of assembly, this under-chip space is usually filledwith a non-conductive”underfill” adhesive joining the entire surface of the chip to the substrate, and re-distribute the residual stress from on the interconnection joints to all the chip surface.
\n\u25a0Advantage of Die Attach Film!!( Comparison with Die Attach Paste )
\n\u6b64\u6bb5\u5185\u5bb9\u597d\u50cf\u662f\u7531ACF\u7684\u9f3b\u7956\u516c\u53f8\u65e5\u5386\u5316\u6210\uff08Hitachi Chemical\uff09\u63d0\u4f9b\u7684\uff0c\u4e2a\u4eba\u8ba4\u4e3a\u5e26\u6709\u4e00\u5b9a\u7684\u504f\u5411\u6027\uff0c\u6b64\u5904\u5f02\u5411\u5bfc\u7535\u819cACF\u4f3c\u4e4e\u5404\u65b9\u9762\u90fd\u6bd4\u5f02\u5411\u5bfc\u7535\u80f6ACA\u8981\u597d\uff0c\u4f46\u5728\u5b9e\u9645\u5e94\u7528\u4e2d\u5e94\u8be5\u8fd8\u5404\u6709\u5343\u79cb\u7684\uff0c\u867d\u7136\u76ee\u524dACF\u6bd4ACA\u7684\u5e94\u7528\u91cf\u8981\u5927\u4e00\u4e9b\uff0c\u4f46\u4e3b\u8981\u8fd8\u662f\u56e0\u4e3a\u5176\u66f4\u65e9\u7684\u5bfc\u5165\u5230\u76f8\u5e94\u5de5\u827a\u4e2d\uff0c\u800c\u4e0d\u4e00\u5b9a\u662f\u5176\u7efc\u5408\u7684\u4f18\u8d8a\u6027\uff0c\u5475\u5475\uff01 \u6211\u8fd9\u597d\u50cf\u4e5f\u6709\u70b9\u504f\u5411\u6027\uff0c\u504f\u5411\u80f6\u7684\u5e94\u7528\u4e86\uff0c\u5475\u5475\uff01 \u4f46\u662f\u65e0\u8bba\u5982\u4f55ACA\u60f3\u53d6\u4ee3ACF\u53ea\u6015\u8fd8\u662f\u4efb\u91cd\u9053\u8fdc\u554a\uff01<\/p>\n

\u70b9\u51fb\u4e0b\u8f7d\uff1a<\/p>\n

\u534e\u4e3a\u7f51\u76d8\u4e0b\u8f7d\uff1ahttp:\/\/dl.dbank.com\/c06ucpbl4l<\/a><\/p>\n

\u5148\u9032\u5c01\u88dd\u8207\u6676\u5713\u7d1a\u5c01\u88dd\u7684\u57fa\u672c\u539f\u7406<\/a> ,\u4e5f\u53ef\u5148\u770b\u770b\u4e0b\u9762\u7684\u524d\u8a00\u548c\u5185\u5bb9\u540e\u518d\u51b3\u5b9a\u662f\u5426\u9700\u8981\uff01<\/p>\n

\u524d\u8a00:
\n\u201c\u7531\u65bc\u6676\u7247\u8a2d\u8a08\u8d8a\u8da8\u8907\u96dc\u8207\u5fae\u5c0f\u5316\uff0c\u5c01\u88dd\u65b9\u5f0f\u8207\u6280\u8853\u4e5f\u540c\u6b65\u8ddf\u8457\u9032\u5165\u4e16\u4ee3\u4ea4\u66ff\uff0c\u904e\u53bb\u63a1\u7528\u5851\u81a0\u5e73\u9762\u6676\u7c92\u627f\u8f09\u5c01\u88dd\uff08QFP\uff09\u7684\u6578\u4f4d\u76f8\u6a5f\u7528\u63a7\u5236\u6676\u7247\u3001CompactFlash\u3001\u7121\u7dda\u7db2\u8def\u7522\u54c1\u7b49\uff0c\u5747\u904e\u5ea6\u5230\u7403\u72c0\u9598\u9663\u5217\uff08BGA\uff09\u5c01\u88dd\uff1b\u800c\u904e\u53bb\u63a1\u7528BGA\u5c01\u88dd\u7684\u4e2d\u592e\u8655\u7406\u5668\uff08CPU\uff09\u3001\u7e6a\u5716\u5361\u8207\u6676\u7247\u7d44\u7b49\uff0c\u4ea6\u9032\u968e\u5230\u8986\u6676\u5c01\u88dd\uff1b\u81f3\u65bc\u624b\u6a5f\u7528\u76f8\u95dc\u96f6\u7d44\u4ef6\u3001DDRII\u5747\u5c07\u5927\u898f\u6a21\u63a1\u7528\u6676\u5713\u7d1a\u5c01\u88dd\uff08Chip Scale Package\uff1bCSP\uff09\uff0c\u56e0\u6b64\uff0c\u9810\u8a08\u52302007\u5e74\u76844\u5e74\u5167\uff0cBGA\u8207CSP\u7b49\u9ad8\u968e\u5c01\u88dd\u61c9\u7528\uff0c\u5c07\u7368\u9818\u98a8\u9a37\uff0c\u4f9dElectronic Trend Publications\u7684\u7d71\u8a08\u8cc7\u6599\u986f\u793a\uff0cBGA\u8207CSP\u5169\u8005\uff0c\u57282002\u223c2007\u5e74\u9593\uff0c\u7522\u503c\u7684\u5e74\u5e73\u5747\u8907\u5408\u6210\u9577\u7387\uff0c\u5c07\u5206\u5225\u9ad8\u905413.39\uff05\u820717.58\uff05\u3002
\n\u2022\u6b77\u7d93\u8fd1\u5e74\u4f86\u5e74\u4f86\u7684\u534a\u5c0e\u9ad4\u7522\u696d\u4e0d\u666f\u6c23\u7684\u8003\u9a57\u5f8c\uff0c\u570b\u969bIDM\u5927\u5ee0\u7372\u5229\u56f0\u96e3\uff0c\u7d1b\u7d1b\u50be\u5411\u65bc\u9010\u6b65\u91cb\u51fa\u975e\u6838\u5fc3\u7684\u5f8c\u6bb5\u5c01\u6e2c\u696d\u52d9\uff0c\u50c5\u4fdd\u7559\u524d\u6bb5\u7684IC\u8a2d\u8a08\u8207\u88fd\u9020\uff0c\u4f7f\u5c01\u6e2c\u696d\u52d9\u5916\u5305\u8da8\u52e2\uff0c\u8fd1\u5e74\u4f86\u65e5\u76ca\u660e\u986f\u3002\u52a0\u4e0a\u56e0BGA\u8207CSP\u7b49\u9ad8\u968e\u5c01\u88dd\u6240\u9700\u6295\u5165\u7684\u6210\u672c\u65e5\u76ca\u589e\u52a0\uff0c\u56e0\u6b64\u8af8\u591aIDM\u5927\u5ee0\u5728\u7121\u529b\u8ca0\u8377\u7684\u60c5\u6cc1\u4e0b\uff0c\u9810\u671f\u91cb\u51fa\u9ad8\u968e\u5f8c\u6bb5\u8a02\u55ae\u6bd4\u91cd\uff0c\u5c07\u65e5\u76ca\u63d0\u9ad8\u3002\u5e74\u5e73\u5747\u8907\u5408\u6210\u9577\u7387\u90e8\u4efd\uff0cBGA\u70ba18.77\uff05\uff0c\u81f3\u65bcCSP\u66f4\u9ad8\u905420.45\uff05\uff0c\u56e0\u6b64\u5c31\u6574\u9ad4IDM\u5927\u5ee0\u6240\u91cb\u51fa\u7684\u59d4\u4ee3\u5c01\u6e2c\u8a02\u55ae\u4e2d\uff0cBGA\u8207CSP\u7b49\u9ad8\u968e\u5c01\u88dd\u5c07\u6210\u70ba\u5176\u4e2d\u6700\u5927\u5b97\u3002\u201d<\/p>\n

\u4e3b\u8981\u5185\u5bb9\uff1a
\n\u25a0CSP Demands
\n\u25a0Definition & CSP
\n\u25a0Frequency, I\/O counts vs. Packaging Technology
\n\u25a0IC Package for mobile phone and Portable devices
\n\u25a0Mobile Phone IC Function Description
\n\u25a0\u624b\u6a5f\u5e02\u5834\u4e2d\u7684\u534a\u5c0e\u9ad4\u5927\u8da8\u52e2
\n\u25a0\u534a\u5c0e\u9ad4\u8207\u624b\u6a5f\u5ee0\u5546\u8da8\u52e2\u95dc\u4fc2
\n\u25a0Four Groups in CSPs
\n\u25a0ITRS forecast of minimum pitches of various mounting technologies for leading edge ICs
\n\u25a0Wafer Level Burn-in and Test
\n\u25a0\u6676\u5713\u7d1a\u69cb\u88dd\u7684\u5206\u985e
\n\u25a0\u6676\u5713\u7d1a\u6676\u65b9\u5c3a\u5ea6\u578b\u69cb\u88dd\u91cd\u5206\u5e03\u6280\u8853\u88fd\u7a0b\u6d41\u7a0b
\n\u25a0\u50b3\u7d71IC\u5c01\u88dd\u8207WLCSP\u4e4b\u6bd4\u8f03
\n\u25a0\u5404\u5bb6\u516c\u53f8\u4e4b\u6676\u5713\u7d1a\u6676\u65b9\u5c3a\u5ea6\u578b\u69cb\u88dd\u7d50\u69cb\u6bd4\u8f03\u8868
\n\u25a0WL-CSP\u9762\u81e8\u7684\u6311\u6230
\n\u25a0\u5229\u7528\u91d1\u7403\u6216\u91d1\u51f8\u584a\u4f86\u9032\u884c\u9023\u7d50
\n\u25a0Flip Chip Technology
\n\u25a0Flip Chip Packaging: FCIP vs FCOB
\n\u25a0\u8986\u6676\u8f09\u677f(Flip Chip Substrate)
\n\u25a0Why Use Flip Chip?Why Underfill?
\n\u25a0Requirements of UBM
\n\u25a0Flip Chip (Soldering \/ C4) Process StepsPick
\n\u25a0Process Anisotropic Conductive Film (ACF) COG
\n\u25a0\u586b\u81a0\u6280\u8853(Underfilldispensing)
\n\u25a0\u5404\u7a2e\u6d41\u52d5\u6a21\u5f0f\u6d41\u52d5\u5206\u6790
\n\u25a0\u9ede\u81a0\u6a5f\u9ede\u81a0\u95a5\u6bd4\u8f03
\n\u25a0SiP \/ Stacked Chip \/ MCP
\n\u25a0\u591a\u91cd\u6676\u7247\u69cb\u88dd\u4e4b\u512a\u52e2Benefits
\n\u25a0Challenge on Stacked Chips Challenge on Stacked Chips -General
\n\u25a0Solutions to Overcome Challenges
\n\u25a0KGD manufacturing flow
\n\u25a0Lead Free & Green Package
\n\u25a0ITRS 2003 Assembly & Packaging Challenges<\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

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