{"id":2839,"date":"2012-01-01T14:30:03","date_gmt":"2012-01-01T06:30:03","guid":{"rendered":"http:\/\/www.g4e.cn\/wordpress\/?p=2839"},"modified":"2013-11-19T15:35:10","modified_gmt":"2013-11-19T07:35:10","slug":"underfill-for-high-end-application","status":"publish","type":"post","link":"http:\/\/www.g4e.cn\/wordpress\/adhesiveapplication\/2839.html","title":{"rendered":"Underfill for High-end Application"},"content":{"rendered":"<p>\u6700\u8fd1\u5728\u767e\u5ea6\u6587\u5e93\u53d1\u73b0\u4e86\u8fd9\u7bc7\u7531Hitachi Chemical Co.,Ltd Semiconductor Materials Div.\u53d1\u5e03\u7684\u300aUnderfill for High-end Application\u300b\uff0c\u91cc\u9762\u5bf9underfil\u7684\u4e00\u4e9b\u53ef\u9760\u6027\u6d4b\u8bd5\u505a\u4e86\u4e00\u4e9b\u5206\u6790\u548c\u63cf\u8ff0\uff0c\u975e\u5e38\u4e13\u4e1a\u3002\u4ece\u8fd9\u4efd\u8d44\u6599\u91cc\u9762\u4e5f\u77e5\u9053\u4e86\u534e\u4e3a\u7ec8\u7aef\u5728\u505aunderfill\u9ad8\u4f4e\u6e29\u51b2\u51fb\u7684\u4f9d\u636e\uff0c\u8fd9\u91cc\u9762\u4e5f\u6709\u63d0\u5230\uff0c\u548c\u534e\u4e3a\u7684\u65b9\u6cd5\u4e00\u6a21\u4e00\u6837\u3002\u5927\u5bb6\u53ef\u4ee5\u4e0b\u8f7d\u9644\u4ef6\u5b66\u4e60\u67e5\u770b\u4e4b\uff1a<\/p>\n<p>FC-BGA<\/p>\n<p>CUF (solder bump) NUF (solder bump)<\/p>\n<p>Stacked CSP<br \/>\nCUF (solder bump) NUF (solder bump) NCP (Au bump)<\/p>\n<p>Stacked Die<\/p>\n<p>TH Electrode<br \/>\nCUF (High flow) NUF (Voidless)<\/p>\n<p>CUF:Capillary flow underfill NUF:Non flow underfill<br \/>\nWorking on Wonders<br \/>\nFlip Chip Trend<\/p>\n<p>Silicon chip trend<\/p>\n<p>Bump count Silicon performance Bump pitch Die gap Large die Low-k Thin die Pb free bump Solder joint<\/p>\n<p>\u70b9\u51fb\u9644\u4ef6\u4e0b\u8f7d\u4e4b\uff1a<p><img src=\"http:\/\/www.g4e.cn\/wordpress\/wp-content\/plugins\/hacklog-downloadmanager\/images\/ext\/pdf.gif\" alt=\"\" title=\"\" style=\"vertical-align: middle;\" \/>&nbsp;&nbsp;<strong>Underfill for High-end Application<\/strong> (602.7 KB, 33 \u6b21)<br \/><i>\u60a8\u6ca1\u6709\u6743\u9650\u4e0b\u8f7d\u6b64\u6587\u4ef6\u3002<\/i><\/p><\/p>\n<p>\u534e\u4e3a\u7f51\u76d8\u4e0b\u8f7d\uff1a<a href=\"http:\/\/dl.dbank.com\/c0h9xqdbw9\" target=\"_blank\">http:\/\/dl.dbank.com\/c0h9xqdbw9<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>\u6700\u8fd1\u5728\u767e\u5ea6\u6587\u5e93\u53d1\u73b0\u4e86\u8fd9\u7bc7\u7531Hitachi Chemical Co.,Ltd Semiconductor Mat [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":3764,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[672],"tags":[499,500],"_links":{"self":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts\/2839"}],"collection":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/comments?post=2839"}],"version-history":[{"count":0,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts\/2839\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/media\/3764"}],"wp:attachment":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/media?parent=2839"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/categories?post=2839"},{"taxonomy":"post_tag","embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/tags?post=2839"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}