{"id":2812,"date":"2011-12-25T22:27:28","date_gmt":"2011-12-25T14:27:28","guid":{"rendered":"http:\/\/www.g4e.cn\/wordpress\/?p=2812"},"modified":"2013-11-20T10:35:01","modified_gmt":"2013-11-20T02:35:01","slug":"henkel-electronic-solutions","status":"publish","type":"post","link":"http:\/\/www.g4e.cn\/wordpress\/adhesiveapplication\/2812.html","title":{"rendered":"Henkel Electronic Solutions"},"content":{"rendered":"<p>\u5e74\u521d\u627e\u5230\u4e86\u4e00\u4efd<a href=\"http:\/\/www.g4e.cn\/wordpress\/archives\/henkel-electronic-solutions-division-electronic-assembly-in-english\/\" target=\"_blank\">\u300a\u6c49\u9ad8\u7535\u5b50\u90e8 \u7535\u5b50\u7ec4\u88c5\u89e3\u51b3\u65b9\u6848\u300b\u300aHenkel Electronics Assembly Solutions\u300b<\/a>\uff0c\u8fd9\u4e24\u5929\u5728\u67e5\u627e3036\u7684underfill\u6280\u672f\u8d44\u6599\u65f6\uff0c\u627e\u5230\u4e86\u8fd9\u4efd\u300aHenkel Electronic Solutions\u300b\uff0c\u597d\u50cf\u4e3b\u8981\u662f\u9488\u5bf9\u5c01\u88c5\u65b9\u9762\u7684\u7528\u80f6\u548c\u6750\u6599\uff0c\u5f88\u591a\u578b\u53f7\u4e4b\u524d\u90fd\u6ca1\u600e\u4e48\u63a5\u89e6\uff0c\u91cc\u9762\u7684underfill\u4e4b\u7c7b\u7684\u6750\u6599\u66f4\u4fa7\u91cd\u4e8e\u4e00\u9053underfill\uff0c\u6b64\u7c7b\u6750\u6599\u662f\uff1aMATERIAL SOLUTIONS FORELECTRONIC PACKAGINGAND ASSEMBLY\u3002 \u7f57\u5217\u4ea7\u54c1\u76ee\u5f55\u5982\u4e0b\uff0c\u6709\u9700\u8981\u4e86\u89e3\u7684\u670b\u53cb\u53ef\u4ee5\u4e0b\u8f7d\u9644\u4ef6\u67e5\u770b\uff1a<\/p>\n<p>Semiconductor Market Solutions<br \/>\nDiscrete Components . . . . . . . . . . . . . . . . . . . . . . . . . . 5<br \/>\nQuad Flat Pack (QFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 9<br \/>\nQuad Flat No-Lead (QFN) . . . . . . . . . . . . . . . . . . . . . . 11<br \/>\nBall Grid Array\/Chip Scale Package (BGA\/CSP) . . . . 14<br \/>\nSystem-in-Package (SiP) . . . . . . . . . . . . . . . . . . . . . . . 18<br \/>\nFlash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21<br \/>\nSemiconductor Materials<br \/>\nHysol\u00ae Die Attach Adhesives . . . . . . . . . . . . . . . . . . . . 23<br \/>\nHysol\u00ae Semiconductor Underfills . . . . . . . . . . . . . . . . 29<br \/>\nHysol\u00ae Semiconductor Encapsulants . . . . . . . . . . . . . 32<br \/>\nHysol\u00ae Thermal Compression Materials . . . . . . . . . . . 34<br \/>\nHysol\u00ae Coating Powders . . . . . . . . . . . . . . . . . . . . . . . 36<br \/>\nHysol\u00ae Electronic Molding Compounds . . . . . . . . . . . 37<br \/>\nHysol\u00ae and Hysol\u00ae Huawei\u2122 Semiconductor<br \/>\nMolding Compounds . . . . . . . . . . . . . . . . . . . . . . . . . . 39<br \/>\nMulticore\u00ae Accurus\u2122 Solder Spheres . . . . . . . . . . . . . 47<br \/>\nPrinted Circuit Board (PCB) Assembly Materials<br \/>\nMulticore\u00ae Solder Paste . . . . . . . . . . . . . . . . . . . . . . . . 50<br \/>\nMulticore\u00ae Fluxes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52<br \/>\nMulticore\u00ae Cored Wire . . . . . . . . . . . . . . . . . . . . . . . . . 54<br \/>\nMulticore\u00ae Solder Accessories . . . . . . . . . . . . . . . . . . 55<br \/>\nChip on Board Encapsulant Materials . . . . . . . . . . . . 56<br \/>\nLoctite\u00ae Board Level Underfills . . . . . . . . . . . . . . . . . . 59<br \/>\nLoctite\u00ae Thermal Management Materials . . . . . . . . . . 61<br \/>\nLoctite\u00ae Electrically Conductive Adhesives . . . . . . . 64<br \/>\nLoctite\u00ae Chipbonder\u2122 Surface Mount Adhesives . . . 66<br \/>\nCircuit Board Protection Solutions . . . . . . . . . . . . . . . 68<br \/>\nFlat Panel Display Materials<br \/>\nFlat Panel Display Solutions . . . . . . . . . . . . . . . . . . . . 79<br \/>\nSemiconductor Solutions . . . . . . . . . . . . . . . . . . . . . . 84<br \/>\nSolutions Across the Board . . . . . . . . . . . . . . . . . . . . . 86<br \/>\nPeriodic Table of Elements . . . . . . . . . . . . . . . . . . . . . 88<\/p>\n<p>\u534e\u4e3a\u7f51\u76d8\u4e0b\u8f7d\uff1a<a href=\"http:\/\/dl.dbank.com\/c041y3iul2\" target=\"_blank\">http:\/\/dl.dbank.com\/c041y3iul2<\/a><\/p>\n<p>\u70b9\u51fb\u4e0b\u8f7d\u9644\u4ef6\u67e5\u770b\uff1a<p><img src=\"http:\/\/www.g4e.cn\/wordpress\/wp-content\/plugins\/hacklog-downloadmanager\/images\/ext\/pdf.gif\" alt=\"\" title=\"\" style=\"vertical-align: middle;\" \/>&nbsp;&nbsp;<strong>Henkel Electronic Solutions<\/strong> (2.9 MB, 38 \u6b21)<br \/><i>\u60a8\u6ca1\u6709\u6743\u9650\u4e0b\u8f7d\u6b64\u6587\u4ef6\u3002<\/i><\/p><\/p>\n","protected":false},"excerpt":{"rendered":"<p>\u5e74\u521d\u627e\u5230\u4e86\u4e00\u4efd\u300a\u6c49\u9ad8\u7535\u5b50\u90e8 \u7535\u5b50\u7ec4\u88c5\u89e3\u51b3\u65b9\u6848\u300b\u300aHenkel Electronics Assembly Sol [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":3803,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[672],"tags":[487,195],"_links":{"self":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts\/2812"}],"collection":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/comments?post=2812"}],"version-history":[{"count":0,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts\/2812\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/media\/3803"}],"wp:attachment":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/media?parent=2812"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/categories?post=2812"},{"taxonomy":"post_tag","embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/tags?post=2812"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}