{"id":2771,"date":"2011-11-22T22:50:52","date_gmt":"2011-11-22T14:50:52","guid":{"rendered":"http:\/\/www.g4e.cn\/wordpress\/?p=2771"},"modified":"2013-11-18T15:26:46","modified_gmt":"2013-11-18T07:26:46","slug":"flip-chip-technology-flip-chip","status":"publish","type":"post","link":"http:\/\/www.g4e.cn\/wordpress\/adhesiveapplication\/2771.html","title":{"rendered":"\u8986\u6676\u6280\u672f\uff08Flip-Chip\uff09"},"content":{"rendered":"

\u672c\u6587\u8f6c\u8f7d\u81ea\u7ef4\u57fa\u767e\u79d1\uff1a<\/p>\n

\u8986\u6676\u6280\u672f<\/strong>\uff08Flip-Chip\uff09\uff0c\u4e5f\u79f0\u201c\u5012\u6676\u5c01\u88c5\u201d\u6216\u201c\u5012\u6676\u5c01\u88c5\u6cd5\u201d\uff0c\u662f\u82af\u7247\u5c01\u88c5\u6280\u672f\u7684\u4e00\u79cd\u3002\u6b64\u4e00\u5c01\u88c5\u6280\u672f\u4e3b\u8981\u5728\u4e8e\u6709\u522b\u4e8e\u8fc7\u53bb\u82af\u7247\u5c01\u88c5\u7684\u65b9\u5f0f\uff0c\u4ee5\u5f80\u662f\u5c06\u82af\u7247\u7f6e\u653e\u4e8e\u57fa\u677f(chip pad)\u4e0a\uff0c\u518d\u7528\u6253\u7ebf\u6280\u672f(wire bonding)\u5c06\u82af\u7247\u4e0e\u57fa\u677f\u4e0a\u4e4b\u8fde\u7ed3\u70b9\u8fde\u63a5\uff0c\u800c\u8986\u6676\u5c01\u88c5\u6280\u672f\u662f\u5c06\u82af\u7247\u8fde\u63a5\u70b9\u957f\u51f8\u5757(bump)\uff0c\u7136\u540e\u5c06\u82af\u7247\u7ffb\u8f6c(flip)\u8fc7\u6765\u4f7f\u51f8\u5757\u4e0e\u57fa\u677f(substrate,board)\u76f4\u63a5\u8fde\u7ed3\u800c\u5f97\u5176\u540d\u3002<\/p>\n

Flip Chip \u6280\u672f\u8d77\u6e90\u4e8e1960\u5e74\u4ee3\uff0c\u662fIBM \u5f00\u53d1\u51fa\u4e4b\u6280\u672f\u3002IBM\u6700\u65e9\u5728\u5927\u578b\u4e3b\u673a\u4e0a\u7814\u53d1\u8986\u6676\u6280\u672f[1]<\/sup>\u3002\u7531\u4e8e\u8986\u6676\u6bd4\u5176\u5b83BGA\u5c01\u88c5\u5728\u4e0e\u57fa\u677f\u6216\u886c\u5e95\u7684\u4e92\u8fde\u5f62\u5f0f\u8981\u65b9\u4fbf\u7684\u591a\uff0c\u76ee\u524d\u8986\u6676\u6280\u672f\u5df2\u7ecf\u88ab\u666e\u904d\u5e94\u7528\u5728\u5fae\u5904\u7406\u5668\u5c01\u88c5\uff0c\u800c\u4e14\u4e5f\u6210\u4e3a\u7ed8\u56fe\u3001\u7279\u79cd\u5e94\u7528\u3001\u548c\u7535\u8111\u82af\u7247\u7ec4\u7b49\u7684\u4e3b\u6d41\u5c01\u88c5\u6280\u672f\uff0c\u501f\u52a9\u5e02\u573a\u5bf9\u8986\u6676\u6280\u672f\u7684\u63a8\u529b\uff0c\u5c01\u88c5\u4e1a\u8005\u5fc5\u9700\u63d0\u4f9b8\u540b\u4e0e12\u540b\u6676\u5706\u63a2\u9488\u6d4b\u8bd5\u3001\u51f8\u5757\u589e\u957f\u3001\u7ec4\u88c5\u3001\u81f3\u6700\u7ec8\u6d4b\u8bd5\u7684\u5b8c\u6574\u670d\u52a1\u3002<\/p>\n

\u6b65\u9aa4<\/h2>\n
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  1. \u96c6\u6210\u7535\u8def\u662f\u5728\u6676\u5706\u4e0a\u521b\u5efa<\/li>\n
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  5. \u82af\u7247\u662f\u7ffb\u8f6c\u548c\u5b9a\u4f4d\uff0c\u4f7f\u710a\u7403\u6b63\u9762\u4e34\u7740\u5916\u90e8\u7535\u8def\u7684\u8fde\u63a5\u5668<\/li>\n
  6. \u7136\u540e\u91cd\u7194\u710a\u7403\uff08\u901a\u5e38\u4f7f\u7528\u70ed\u98ce\u56de\u6d41\u710a \uff09<\/li>\n
  7. \u5b89\u88c5\u7684\u82af\u7247\u662f\u201c\u5e95\u90e8\u586b\u5145\u7684\u201d \u4f7f\u7528\u7535\u6c14 \u7edd\u7f18\u80f6<\/li>\n<\/ol>\n
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      \u672a\u6765\u7535\u5b50\u4ea7\u54c1\u6301\u7eed\u671d\u5411\u8f7b\u8584\u77ed\u5c0f\u3001\u9ad8\u901f\u3001\u9ad8\u811a\u6570\u7b49\u7279\u6027\uff0c\u4ee5\u5bfc\u7ebf\u67b6\u4e3a\u57fa\u7840\u7684\u4f20\u7edf\u5c01\u88c5\u578b\u6001\u5c06\u6e10\u4e0d\u9002\u7528\uff0c\u5e94\u7528\u8303\u56f4\u4e5f\u5c06\u5c40\u9650\u4e8e\u4f4e\u9636\uff0f\u4f4e\u5355\u4ef7\u7684\u4ea7\u54c1\u3002\u6839\u636eIC Insights\u7684\u8c03\u67e5\u62a5\u544a\u663e\u793a\uff0c\u903b\u8f91IC\u4ea7\u54c1\u7531\u4e8e\u529f\u80fd\u8981\u6c42\u65e5\u76ca\u590d\u6742\uff0c\u5bf9\u4e8e\u5c01\u88c5\u5f15\u811a\u6570\u7684\u9700\u6c42\uff0c\u5927\u81f4\u5448\u73b0\u6bcf\u5e7412\uff05\uff5e13\uff05\u7684\u589e\u52a0\u901f\u7387\u3002\u4ee5\u9ad8\u9636\u7684ASIC\u4ea7\u54c1\u4e3a\u4f8b\uff0c2002\u5e74\u6700\u9ad8\u5f15\u811a\u6570\u9700\u6c42\u4e3a2,100\u811a\uff0c\u800c\u9884\u8ba1\u81f32007\u5e74\uff0c\u6700\u5927\u5f15\u811a\u6570\u5c06\u9ad8\u8fbe3,500\u811a\u3002\u5728\u672a\u6765\u8986\u6676\u5c01\u88c5\u7684\u8d8b\u52bf\u4e0a\uff0c\u4f9d\u7136\u4f1a\u671d\u7740\u9ad8\u811a\u6570\uff08I\/O\uff09\uff0c\u7ec6\u95f4\u8ddd\uff08fine pitch\uff09\u7684\u76ee\u6807\u524d\u8fdb\u3002\u6b64\u5916\uff0c\u672a\u6765\u9664\u4e86\u8986\u6676\u5c01\u88c5\u8bbe\u5907\u7684\u9700\u6c42\u5c06\u6301\u7eed\u6269\u5927\u5916\uff0c\u8986\u6676\u6240\u9700\u4e4b\u68c0\u6d4b\u8bbe\u5907\u4ea6\u662f\u5382\u5546\u53d1\u5c55\u7684\u91cd\u70b9\u3002\u7531\u4e8e\u8986\u6676\u5c01\u88c5\u5185\u90e8\u662f\u5229\u7528\u51f8\u5757\u4f5c\u4e3a\u7535\u6c14\u901a\u5bfc\u8def\u5f84\uff0c\u5206\u5e03\u8303\u56f4\u6574\u4e2a\u82af\u7247\uff0c\u4f4d\u4e8e\u82af\u7247\u4e2d\u5fc3\u9644\u8fd1\u7684\u51f8\u5757\u54c1\u8d28\u68c0\u6d4b\uff0c\u5219\u6709\u8d56\u81ea\u52a8\u5316\u68c0\u6d4b\u8bbe\u5907\u4ee5\u786e\u4fdd\u51f8\u5757\u54c1\u8d28\uff0c\u800c\u7531\u4e8e\u8986\u6676\u5c01\u88c5\u7684\u9ad8\u811a\u6570\u7279\u6027\uff0c\u5355\u7247\u63a2\u9488\u6570\u53ef\u8fbe1,000pin\u4ee5\u4e0a\u7684\u5782\u76f4\u63a2\u9488\u5361\uff0c\u5c06\u6210\u4e3a\u6d4b\u8bd5\u8bbe\u5907\u5546\u7ade\u9010\u7684\u6f5c\u529b\u5e02\u573a\u3002<\/p>\n

       <\/p>\n

      his article is about the semiconductor mounting technique. For the\u00a0DEC\u00a0trademark, see\u00a0Flip Chip (trademark). For the CPU format, see\u00a0Flip-chip pin grid array.<\/div>\n

      Flip chip<\/strong>, also known as\u00a0Controlled Collapse Chip Connection<\/strong>\u00a0or its acronym,\u00a0C4<\/strong>, is a method for interconnecting\u00a0semiconductor devices, such as\u00a0IC chips\u00a0and\u00a0Microelectromechanical systems\u00a0(MEMS), to external circuitry with\u00a0solder\u00a0bumps that have been deposited onto the chip pads. The solder bumps are deposited on the chip pads on the top side of the wafer during the final\u00a0wafer\u00a0processing step. In order to mount the chip to external circuitry (e.g., a\u00a0circuit board\u00a0or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is flowed to complete the interconnect. This is in contrast to\u00a0wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.<\/p>\n\n\n\n
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      Contents<\/h2>\n

      [hide]<\/p>\n<\/div>\n

        \n
      • 1\u00a0Process steps<\/li>\n
      • 2\u00a0Comparison of mounting technologies\n
          \n
        • 2.1\u00a0Wire bonding\/Thermosonic bonding<\/li>\n
        • 2.2\u00a0Flip chip<\/li>\n
        • 2.3\u00a0Advantages<\/li>\n
        • 2.4\u00a0Disadvantages<\/li>\n<\/ul>\n<\/li>\n
        • 3\u00a0History<\/li>\n
        • 4\u00a0Alternatives<\/li>\n
        • 5\u00a0See also<\/li>\n
        • 6\u00a0References<\/li>\n
        • 7\u00a0Further reading<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

          Process steps<\/h2>\n
            \n
          1. Integrated circuits are created on the wafer<\/li>\n
          2. Pads are metalized on the surface of the chips<\/li>\n
          3. Solder dots are deposited on each of the pads<\/li>\n
          4. Chips are cut<\/li>\n
          5. Chips are flipped and positioned so that the solder balls are facing the connectors on the external circuitry<\/li>\n
          6. Solder balls are then remelted (typically using\u00a0hot air reflow)<\/li>\n
          7. Mounted chip is \u201cunderfilled\u201d using an\u00a0electrically-insulating\u00a0adhesive<\/li>\n<\/ol>\n
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              Comparison of mounting technologies<\/h2>\n

              Wire bonding\/Thermosonic bonding<\/h3>\n
              \n
              \n

              \"\"<\/p>\n

              \n
              \"\"<\/div>\n

              The interconnections in a power package are made using thick aluminium wires (250 to 400 \u00b5m) wedge-bonded<\/p>\n<\/div>\n<\/div>\n<\/div>\n

              In typical\u00a0semiconductor fabrication\u00a0systems chips are built up in large numbers on a single large wafer of semiconductor material, typically silicon. The individual chips are patterned with small pads of metal near their edges that serve as the connections to an eventual mechanical carrier. The chips are then cut out of the wafer and attached to their carriers, typically via\u00a0wire bondingsuch as\u00a0Thermosonic Bonding. These wires eventually lead to pins on the outside of the carriers, which are attached to the rest of the circuitry making up the electronic system.<\/p>\n

              Flip chip<\/h3>\n
              \n
              \n

              \"\"<\/p>\n

              \n
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              Side-view schematic of a typical flip chip mounting<\/p>\n<\/div>\n<\/div>\n<\/div>\n

              Processing a flip chip is similar to conventional IC fabrication, with a few additional steps.[1]<\/sup>\u00a0Near the end of the manufacturing process, the attachment pads are metalized to make them more receptive to solder. This typically consists of several treatments. A small dot of solder is then deposited on each metalized pad. The chips are then cut out of the wafer as normal.<\/p>\n

              Recently, high-speed mounting methods evolved through a cooperation between Reel Service Ltd. and\u00a0Siemens AG\u00a0in the development of a high speed mounting tape known as ‘MicroTape.'[1]. By adding a tape-and-reel process into the\u00a0assembly methodology, placement at high speed, typically 20,000 placements per hour are achievable using standard PCB assembly equipment.[citation needed<\/em>]<\/sup><\/p>\n

              To attach the flip chip into a circuit, the chip is inverted to bring the solder dots down onto connectors on the underlying electronics or\u00a0circuit board. The solder is then re-melted to produce an electrical connection, typically using an\u00a0ultrasonic\u00a0or alternatively\u00a0reflow solder\u00a0process. This also leaves a small space between the chip’s circuitry and the underlying mounting. In most cases an electrically-insulating adhesive is then “underfilled” to provide a stronger mechanical connection, provide a\u00a0heat bridge, and to ensure the solder joints are not stressed due to differential heating of the chip and the rest of the system.<\/p>\n

              Advantages<\/h3>\n

              The resulting completed flip chip assembly is much smaller than a traditional carrier-based system; the chip sits directly on the circuit board, and is much smaller than the carrier both in area and height. The short wires greatly reduce\u00a0inductance, allowing higher-speed signals, and also conduct heat better.<\/p>\n

              Disadvantages<\/h3>\n

              Flip chips have several disadvantages. The lack of a carrier means they are not suitable for easy replacement, or manual installation. They also require very flat surfaces to mount to, which is not always easy to arrange, or sometimes difficult to maintain as the boards heat and cool. Also, the short connections are very stiff, so the thermal expansion of the chip must be matched to the supporting board or the connections can crack.[2]<\/sup>\u00a0The underfill material acts as an intermediate between the difference in CTE of the chip and board.<\/p>\n

              History<\/h2>\n

              The process was originally introduced commercially by\u00a0IBM\u00a0in the 1960s for individual transistors and diodes packaged for use in their\u00a0mainframe\u00a0systems.[3]<\/sup>\u00a0DEC\u00a0followed IBM’s lead, but was unable to achieve the quality they demanded, and eventually gave up on the concept. It was pursued once again in the mid-90s for the Alpha product line, but then abandoned due to the fragmentation of the company and subsequent sale to Compaq. In the 1970s it was taken up by\u00a0Delco Electronics, and has since become very common in automotive applications.<\/p>\n

              Alternatives<\/h2>\n

              Since the flip chip’s introduction a number of alternatives to the solder bumps have been introduced, including\u00a0goldballs or molded studs, electrically\u00a0conductive polymer\u00a0and the “plated bump” process that\u00a0removes<\/em>\u00a0an insulating plating by chemical means. Flip chips have recently gained popularity among manufacturers of\u00a0cell phones,\u00a0pagers\u00a0and other small electronics where the size savings are valuable.[citation needed<\/em>]<\/sup><\/p>\n

              See also<\/h2>\n
                \n
              • Solid Logic Technology<\/li>\n
              • IBM 3081<\/li>\n<\/ul>\n

                References<\/h2>\n
                \n
                  \n
                1. ^<\/strong>\u00a0Solder Bump Flip Chip<\/li>\n
                2. ^<\/strong>\u00a0Demerjian, Charlie (2008-12-17),\u00a0Nvidia chips show underfill problems<\/em>, The Inquirer, retrieved 2009-01-30<\/li>\n
                3. ^<\/strong>\u00a0Introduction to Flip Chip: What, Why, How<\/li>\n<\/ol>\n<\/div>\n

                  Further reading<\/h2>\n
                    \n
                  • Wikihowto: Guide to IC packages<\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"

                    \u672c\u6587\u8f6c\u8f7d\u81ea\u7ef4\u57fa\u767e\u79d1\uff1a \u8986\u6676\u6280\u672f\uff08Flip-Chip\uff09\uff0c\u4e5f\u79f0\u201c\u5012\u6676\u5c01\u88c5\u201d\u6216\u201c\u5012\u6676\u5c01\u88c5\u6cd5\u201d\uff0c\u662f\u82af\u7247\u5c01\u88c5\u6280\u672f\u7684\u4e00\u79cd\u3002 […]<\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[672],"tags":[69,463,462],"_links":{"self":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts\/2771"}],"collection":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/comments?post=2771"}],"version-history":[{"count":0,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts\/2771\/revisions"}],"wp:attachment":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/media?parent=2771"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/categories?post=2771"},{"taxonomy":"post_tag","embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/tags?post=2771"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}