CF3350 provides the following product characteristics:<\/p>\n
Technology <\/strong>Epoxy Film<\/p>\n Appearance Gray Tan<\/p>\n Cure <\/strong>Heat cure<\/p>\n Product Benefits \u2022 High electrical conductivity<\/p>\n \u2022 High thermal conductivity<\/p>\n \u2022 Uniform bondline adhesion<\/p>\n \u2022 Custom preforms available<\/p>\n \u2022 Adhesion with flexibility<\/p>\n \u2022 Void-free bondline<\/p>\n \u2022 Clean, easy application with no waste<\/p>\n \u2022 Even heat dissipation<\/p>\n \u2022 Provides electrical continuity<\/p>\n \u2022 Minimum thermal resistance to heat sink<\/p>\n Application <\/strong>Assembly<\/p>\n Filler Type Silver<\/p>\n Operating Temperature -40 to 160 \u00b0C<\/p>\n Thickness 2 or 4 mils (\u00b10.5 mils)<\/p>\n Carrier Type Polyester<\/p>\n Typical Assembly<\/p>\n Applications<\/p>\n Circuit board materials, Metal backplanes<\/p>\n and Heatsinks<\/p>\n Substrates Fluoropolymer circuits, Ceramic circuits,<\/p>\n Copper, Brass, Kovar and Aluminum<\/p>\n pH 6.0<\/p>\n CF3350 film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance.<\/p>\n TYPICAL PROPERTIES OF UNCURED MATERIAL<\/strong><\/p>\n Work Life @ 25\u00b0C, months 3<\/p>\n Shelf Life @ 5\u00b0C (from date of manufacture), months 9<\/p>\n Peak Exotherm Temperature, DSC,<\/p>\n Ramp Rate=10\u00baC\/<\/p>\n 177.5\u00baC \u00b1 5\u00baC<\/p>\n Flash Point – See MSDS<\/p>\n TYPICAL CURING PERFORMANCE<\/strong><\/p>\n Cure Schedule<\/strong><\/p>\n 30 minutes @ 150\u00b0C<\/p>\n Alternative Cure Schedule<\/strong><\/p>\n 10 minutes @ 175\u00b0C or<\/p>\n 50 minutes @ 137\u00b0C or<\/p>\n 120 minutes @ 125\u00b0C<\/p>\n Cure Pressure<\/strong><\/p>\n 5 to 60 psi<\/p>\n Cure pressure may vary depending on the materials being bonded and their size. All temperatures are measured at the adhesive and do not include ramp-up time. The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers’ experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.<\/p>\n <\/p>\n TYPICAL PROPERTIES OF CURED MATERIAL<\/strong><\/p>\n Physical Properties<\/strong>:<\/p>\n Coefficient of Thermal Expansion TMA:<\/p>\n Below Tg, 10-6\/\/\u00baC 65<\/p>\n Above Tg, 10-6\/\/\u00baC 150<\/p>\n Glass Transition Temperature ,DMA, \u00b0C 90<\/p>\n Thermal Conductivity, W\/mK 7<\/p>\n Thermal Resistance for 1sq cm area @ 10psi assembly pressure:<\/p>\n 50\u03bcm bondline, W\/\u00baC 0.15<\/p>\n 100\u03bcm bondline, W\/\u00baC 0.23<\/p>\n Storage Modulus, DMA :<\/p>\n @ -40 \u00b0C N\/mm\u00b2 4,000<\/p>\n (psi) (580,151)<\/p>\n @ 0 \u00b0C N\/mm\u00b2 3,000<\/p>\n (psi) (435,113)<\/p>\n @ 25 \u00b0C N\/mm\u00b2 2,400<\/p>\n (psi) (348,090)<\/p>\n @ 100 \u00b0C N\/mm\u00b2 680<\/p>\n (psi) (98,625)<\/p>\n @ 150 \u00b0C N\/mm\u00b2 60<\/p>\n (psi) (8,702)<\/p>\n Extractable Ionic Content, ppm:<\/p>\n Chloride (Cl-) 50<\/p>\n Sodium (Na+) 30<\/p>\n Potassium (K+) 5<\/p>\n Electrical Properties<\/strong>:<\/p>\n Volume Resistivity, ohm\/cm @ 25\u00baC 0.0002<\/p>\n TYPICAL PERFORMANCE OF CURED MATERIAL<\/strong><\/p>\n Tensile Lap Shear Strength (psi):<\/p>\n 4 mil thickness, @ 25\u00baC<\/p>\n Substrate<\/strong><\/p>\n Aluminum to aluminum 3,400<\/p>\n Gold to Gold 3,500<\/p>\n GENERAL INFORMATION<\/strong><\/p>\n For safe handling information on this product, consult the Material Safety Data Sheet, (MSDS).<\/strong><\/p>\n THAWING:<\/strong><\/p>\n 1. Allow container to reach room temperature before use.<\/p>\n 2. DO NOT open the container before contents reach 22\u00b0C temperature. Any moisture that collects on the thawed container should be removed prior to opening the container.<\/p>\n <\/p>\n DIRECTIONS FOR USE<\/strong><\/p>\n 1. While substrate cleaning is not mandatory, wiping with an organic solvent (e.g. isopropanol) is recommended to remove any oils that might interfere with the bonding process .<\/p>\n 2. Pressure needs to be applied during cure to promote proper wetting of substrate surfaces. .<\/p>\n 3. Common industry practices to apply pressure include the use of spring clamps, lamination presses, dead weights and vacuum bagging.<\/p>\n 4. The technique to apply pressure will vary by application and customer preference.<\/p>\n 5. For large surface area applications, a load distribution material is recommended between one of the pressure plates and the bonding part in order to equalize the applied pressure over the entire area.<\/p>\n 6. After fixturing, the parts are then cured at an elevated temperature.<\/p>\n 7. The specified temperatures and times refer to the bondline values. It should be noted that large mass<\/p>\n assemblies will take longer time to achieve bondline temperatures.<\/p>\n 8. This material becomes brittle at temperatures below -5\u00baC. If material goes below this temperature, it should be handled gently and the entire package should be warmed to room temperature before opening. This will minimize the possibility of fracturing in the brittle state or allowing condensation to collect on the product.<\/p>\n <\/p>\n Not for product specifications<\/strong><\/p>\n The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product.<\/p>\n Storage<\/strong><\/p>\n Store in original, tightly covered containers in clean, dry areas. Storage information may be indicated on the product container labeling. Usable shelf life may vary depending on method of application and storage conditions<\/p>\n Optimal Storage: 5\u00b0C. Storage below 5\u00b0C or greater than minus 5\u00b0C can adversely affect product properties.<\/strong><\/p>\n Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.<\/p>\n <\/p>\n Conversions<\/strong><\/p>\n (\u00b0C x 1.8) + 32 = \u00b0F<\/p>\n kV\/mm x 25.4 = V\/mil<\/p>\n mm \/ 25.4 = inches<\/p>\n N x 0.225 = lb<\/p>\n N\/mm x 5.71 = lb\/in<\/p>\n N\/mm\u00b2 x 145 = psi<\/p>\n MPa x 145 = psi<\/p>\n N\u00b7m x 8.851 = lb\u00b7in<\/p>\n N\u00b7m x 0.738 = lb\u00b7ft<\/p>\n N\u00b7mm x 0.142 = oz\u00b7in<\/p>\n mPa\u00b7s = Cp<\/p>\n <\/p>\n Note<\/strong><\/p>\n The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation<\/strong><\/p>\n specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation\u2019s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. <\/strong>The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications.<\/p>\n <\/p>\n \u70b9\u51fb\u4e0b\u8f7d\u9644\u4ef6\u67e5\u770b\u4e4b\uff1a \u4eca\u5929\u6709\u4e2a\u4ee5\u524d\u7684\u540c\u4e8b\u54a8\u8be2\u5230\u8fd9\u6b3e\u4ea7\u54c1CF3350 Film Adhesive, Electrically and […]<\/p>\n","protected":false},"author":1,"featured_media":3770,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[667],"tags":[442,443,441,444],"_links":{"self":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts\/2752"}],"collection":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/comments?post=2752"}],"version-history":[{"count":0,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts\/2752\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/media\/3770"}],"wp:attachment":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/media?parent=2752"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/categories?post=2752"},{"taxonomy":"post_tag","embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/tags?post=2752"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}![\"\"](\"http:\/\/www.g4e.cn\/wordpress\/wp-content\/plugins\/hacklog-downloadmanager\/images\/ext\/rar.gif\" "\\"\\"")
CF3350 Film Adhesive, Electrically and Thermally Conductive<\/strong> (578.7 KB, 12 \u6b21)
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