{"id":2689,"date":"2011-08-03T10:32:06","date_gmt":"2011-08-03T02:32:06","guid":{"rendered":"http:\/\/www.g4e.cn\/wordpress\/?p=2689"},"modified":"2013-11-19T16:02:19","modified_gmt":"2013-11-19T08:02:19","slug":"underfill-epo-tek-oe121-black-tds","status":"publish","type":"post","link":"http:\/\/www.g4e.cn\/wordpress\/datasheet\/2689.html","title":{"rendered":"UNDERFILL EPO-TEK OE121 Black TDS"},"content":{"rendered":"

\u53cc\u7ec4\u5206underfill\u4ea7\u54c1\uff0c\u597d\u50cf\u662f\u7528\u4e8e\u4e00\u9053\u5e95\u90e8\u586b\u5145\u5de5\u827a\uff01<\/p>\n

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Product Information Sheet <\/span><\/strong><\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n\n
MATERIAL ID: <\/strong><\/td>\nEPO-TEK\u00ae <\/sup>OE121 Black <\/strong><\/td>\n<\/tr>\n
Date: <\/strong>08\/2007<\/td>\nPer: <\/strong><\/td>\n<\/tr>\n
Rev: <\/strong>III<\/td>\n<\/tr>\n
Material Description: <\/strong><\/td>\nA two component, low temperature curing epoxy adhesive designed for semiconductor flip chip underfill. It is color coded black for visual ID during the underfilling process. It may also be used for adhesive, potting, sealing, and encapsulation applications found within the electronics, medical, and optical industries. It is a black version of EPO-TEK\u00ae <\/sup>OE121.<\/td>\n<\/tr>\n
Number of Components: <\/strong><\/td>\nTwo<\/td>\n<\/tr>\n
Mix Ratio by weight: <\/strong><\/td>\n100:35<\/td>\n<\/tr>\n
Cure Schedule (minimum) <\/strong><\/td>\n90\u00b0C\/1 Hour – 80\u00b0C\/3 Hours – 23\u00b0C\/2 Days<\/td>\n<\/tr>\n
Specific Gravity: <\/strong><\/td>\n\n

— <\/strong><\/p>\n<\/td>\n

Part A:<\/td>\n1.18<\/td>\nPart B:<\/td>\n0.96<\/td>\n<\/tr>\n
Pot Life: <\/strong><\/td>\n5 Hours<\/td>\n<\/tr>\n
Shelf Life: <\/strong><\/td>\nOne year at room temperature<\/td>\n<\/tr>\n
<\/td>\n<\/td>\n<\/td>\n<\/td>\n<\/td>\n<\/td>\n<\/td>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

 <\/p>\n

NOTE: <\/em>Container(s) should be kept closed when not in use. Filled systems should be stirred thoroughly before mixing and prior to use<\/p>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
MATERIAL CHARACTERISTICS: <\/strong>To be used as a guide only, not as a specification. Data below is not guaranteed. Different batches, conditions and applications yield differing results; Cure condition: varies as required <\/em>* denotes test on lot acceptance basis<\/td>\n<\/tr>\n
PHYSICAL PROPERTIES: <\/strong><\/td>\n<\/tr>\n
*Color (before cure): <\/strong><\/td>\nPart A: BlackPart B: Clear\/Colorless<\/td>\nWeight Loss: <\/strong><\/td>\n<\/tr>\n
*Consistency: <\/strong><\/td>\nPourable liquid<\/td>\n@ 200\u00b0C: <\/strong><\/td>\n1.20 % <\/strong><\/td>\n<\/tr>\n
*Viscosity (23\u00b0C): <\/strong><\/td>\n@ 250\u00b0C: <\/strong><\/td>\n1.71 % <\/strong><\/td>\n<\/tr>\n
@ <\/strong>100 rpm <\/strong><\/td>\n300 – 500 cPs <\/strong><\/td>\n@ 300\u00b0C: <\/strong><\/td>\n3.91 % <\/strong><\/td>\n<\/tr>\n
Thixotropic Index: <\/strong><\/td>\nN\/A<\/td>\nOperating Temp: <\/strong><\/td>\n<\/tr>\n
*<\/strong>Glass Transition Temp: <\/strong><\/td>\n\u2265 55 \u00b0C <\/strong>(Dynamic Cure<\/td>\nContinuous: <\/strong><\/td>\n– 55\u00b0C to + <\/strong>200\u00b0C <\/strong><\/td>\n<\/tr>\n
20\u2014200\u00b0C \/ISO 25 Min; Ramp -10\u2014200\u00b0C @ 20\u00b0C\/Min)<\/td>\nIntermittent: <\/strong><\/td>\n– 55\u00b0C to <\/strong>+ 275\u00b0C <\/strong><\/td>\n<\/tr>\n
Coefficient of Thermal Expansion (CTE): <\/strong><\/td>\nStorage Modulus @ 23\u00b0C: <\/strong><\/td>\n248,652 psi <\/strong><\/td>\n<\/tr>\n
Below Tg: <\/strong><\/td>\n43 x 10-6 <\/sup>in\/in\u00b0C <\/strong><\/td>\nIon Content: <\/strong><\/td>\n<\/tr>\n
Above Tg: <\/strong><\/td>\n158 x 10-6 <\/sup>in\/in\u00b0C <\/strong><\/td>\nCl–<\/sup>: <\/strong><\/td>\n62 ppm <\/strong><\/td>\n<\/tr>\n
Shore D Hardness: <\/strong><\/td>\n81<\/td>\nNH4<\/sub>+<\/sup>: <\/strong><\/td>\n15 ppm <\/strong><\/td>\n<\/tr>\n
Lap Shear @ 23\u00b0C: <\/strong><\/td>\n1,716 psi <\/strong><\/td>\nNa+<\/sup>: <\/strong><\/td>\n16 ppm <\/strong><\/td>\n<\/tr>\n
Die Shear @ 23\u00b0C: <\/strong><\/td>\n\u2265 15 Kg \/ <\/strong>5,100 psi <\/strong><\/td>\nK+<\/sup>: <\/strong><\/td>\n1 ppm <\/strong><\/td>\n<\/tr>\n
Degradation Temp: <\/strong><\/td>\n350 \u00b0C <\/strong><\/td>\n*Particle Size: <\/strong><\/td>\n\u2264 20 microns <\/strong><\/td>\n<\/tr>\n
ELECTRICAL AND THERMAL PROPERTIES: <\/strong><\/td>\n<\/tr>\n
Thermal Conductivity: <\/strong><\/td>\nN\/A<\/td>\nDielectric Constant <\/strong>(1KHz)<\/strong>: <\/strong><\/td>\n3.67<\/td>\n<\/tr>\n
Volume Resistivity @ 23\u00b0C: <\/strong><\/td>\n\u2265 1 x 1013 <\/sup>Ohm-cm <\/strong><\/td>\nDissipation Factor <\/strong>(1KHz)<\/strong>: <\/strong><\/td>\n0.012<\/td>\n<\/tr>\n
OPTICAL PROPERTIES @ 23\u00b0C: <\/strong><\/td>\n<\/tr>\n
Spectral Transmission: <\/strong><\/td>\n< 1 % @ <\/strong>340-1260 nm <\/strong><\/td>\nIndex of Refraction: <\/strong><\/td>\nN\/A<\/td>\n<\/tr>\n
<\/td>\n<\/td>\n<\/td>\n<\/td>\n<\/td>\n<\/td>\n<\/td>\n<\/td>\n<\/td>\n<\/td>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

 <\/p>\n

EPOXY TECHNOLOGY, INC. <\/strong><\/p>\n

14 FORTUNE DRIVE, BILLERICA, MA 01821 (978) 667-3805, FAX (978) 663-9782 <\/strong><\/p>\n

WEB SITE: <\/strong>www.epotek.com <\/span><\/p>\n<\/div>\n

 <\/p>\n

Document No. 43 Rev. D<\/p>\n

 <\/p>\n

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\"\"  OE121_BLACK.pdf<\/strong> (110.0 KB, 8 \u6b21)
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\u53cc\u7ec4\u5206underfill\u4ea7\u54c1\uff0c\u597d\u50cf\u662f\u7528\u4e8e\u4e00\u9053\u5e95\u90e8\u586b\u5145\u5de5\u827a\uff01 Product Information Sheet […]<\/p>\n","protected":false},"author":1,"featured_media":3775,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":[],"categories":[667],"tags":[389,390,391],"_links":{"self":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts\/2689"}],"collection":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/comments?post=2689"}],"version-history":[{"count":0,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/posts\/2689\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/media\/3775"}],"wp:attachment":[{"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/media?parent=2689"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/categories?post=2689"},{"taxonomy":"post_tag","embeddable":true,"href":"http:\/\/www.g4e.cn\/wordpress\/wp-json\/wp\/v2\/tags?post=2689"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}