\u70b9\u51fb\u4e0b\u8f7dTDS\u6587\u4ef6\uff1a
Product Description<\/p>\n
Hernon \u00a0Dissipator \u00a0746 is a thermally conductive adhesive formulated for bonding electrical components to heat sinks or printed circuit boards. Fast room temperature cure combined with excellent heat dissipation for thermally sensitive components and controlled strength for service repair provide perfect replacement for tapes, epoxies, silicones, fasteners and mechanical clips.<\/p>\n
Typical Applications<\/p>\n
Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.<\/p>\n
Typical Properties (Uncured)<\/p>\n
Property Value<\/p>\n
Chemical type Modified acrylic<\/p>\n
Appearance White paste<\/p>\n
Viscosity at 77\u00baF (25\u00baC), Cp \u00a0at 2.5 rpm\u00a0\u00a0\u00a0 500,000 to 2,000,000<\/p>\n
at 20 rpm\u00a0\u00a0\u00a0\u00a0 300,000 to 800,000<\/p>\n
Specific gravity 1.64<\/p>\n
Flash point See MSDS<\/p>\n
Typical Properties (Cured)<\/p>\n
Physical Properties<\/p>\n
Property Value<\/p>\n
Coefficient of thermal expansion, ASTM D696 (K-1)\u00a0\u00a0\u00a0 69 x 10-6<\/p>\n
Coefficient of thermal conductivity,ASTM C 177, W\/(m\u00b7K)\u00a0 0.76<\/p>\n
Tensile Strength at break, ISO 527, N\/mm\u00b2 (psi)\u00a0 12.8 (1,860)<\/p>\n
Elongation at break, ISO 527, %\u00a0 \u00a00.92<\/p>\n
Young’s Modulus, N\/mm\u00b2 (psi) 2,760 (400,000)<\/p>\n
Temperature Range, \u00baC (\u00baF) -55 to 150 (-65 to 300)<\/p>\n
Electrical Properties<\/p>\n
Property Value<\/p>\n
Dielectric Strength, IEC 60243-1, kV\/mm\u00a0 26.7<\/p>\n
Dielectric Constant \u00a0\u00a0IEC 60250 @ 100 Hz\u00a0 6.49<\/p>\n
1kHz\u00a0\u00a0 \u00a05.87<\/p>\n
1 MHz \u00a05.23<\/p>\n
Dissipation Factor \u00a0IEC 60250\u00a0 @ 100 Hz\u00a0 0.10<\/p>\n
1 kHz\u00a0\u00a0 0.04<\/p>\n
10 kHz\u00a0 0.03<\/p>\n
Volume Resistivity, \u03a9\u00b7cm, IEC 60093\u00a0 \u00a01.3 \u00d7 1012<\/p>\n
Surface Resistivity, \u03a9, IEC 60093\u00a0\u00a0\u00a0\u00a0 \u00a05.1 \u00d7 1013<\/p>\n
Typical Curing Performance<\/p>\n
Dissipator\uf8e8 746, when used with Hernon\uf8e8 EF\uf8e8Activator 63, fixtures at room temperature in less than five minutes.<\/p>\n
Typical Cured Performance<\/p>\n
Cured for 24 hours @ 22\u00baC.<\/p>\n
Steel lap-shear specimens (EF\uf8e8 Activator 63 applied to one surface), Shear Strength, ISO 4587<\/p>\n
Property Value\u00a0\u00a0\u00a0 Shear Strength, N\/mm\u00b2 (psi) \u2265 6.9 (\u2265 1000)<\/p>\n
Typical Environmental Resistance<\/p>\n
Cured for 72 hours @ 22\u00baC.<\/p>\n
steel lap-shear specimens (EF\uf8e8 Activator 63 applied to one surface), Shear Strength, ISO 4587<\/p>\n
Chemical\/Solvent Resistance<\/p>\n
Aged under conditions indicated for 720 hours and\u00a0 tested at 22\u00baC.<\/p>\n
Chemical\/Solvent Temp (\u00baC) % of Initial Strength<\/p>\n
Air \u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a087\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0 \u00a0140<\/p>\n
Water \u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a087 \u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a075<\/p>\n
Freon TF \u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a087 \u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a0\u00a085<\/p>\n
Thermal Cycle Resistance<\/p>\n
Bonded aluminum to epoxyglass lapshears cured 72hours using EF\uf8e8 Activator 63 on 1 side were subjected to thermal cycling of 15\u00baC to 100\u00baC with a ramp time of 30 minutes. No loss in strength occurred after 1,000 hours of cycle time.<\/p>\n
General Information<\/p>\n
For safe handling information on this product, consult the Material Safety Data Sheet (MSDS).<\/p>\n
Directions for use<\/p>\n
1. For best performance bond surfaces should be clean and free from grease.<\/p>\n
2. Use applicator to apply the activator to the surface to be bonded.<\/p>\n
3. After the solvent evaporates, the active ingredients will appear wet, and will remain active for up to 2 hours after application. Contamination of the surface before bonding should be prevented.<\/p>\n
4. Apply adhesive to the unactivated surface.<\/p>\n
5. Secure the assembly, and wait for the adhesive to fixture (approximately 5 minutes) before any further handling. Full cure occurs in 4 to 12 hours.<\/p>\n
6. The amount of adhesive applied to the part or heat sink should be limited to the amount necessary to fill the bond and just enough to give a small fillet.<\/p>\n
7. The dispensing or application of the adhesive should be done as to minimize air entrapment within the bondline.<\/p>\n
Device Removal\/Repair<\/p>\n
Components or devices with this thermally conductive adhesive can be removed while hot using heat from a hot air jet. Bond strength decreases at approximately 65\u00baC to 93\u00baC allowing components to be removed with lower shear forces. Method of removal\/repair should be specifically determined due to the variety of components or devices bonding behavior.<\/p>\n
Storage<\/p>\n
Dissipator\uf8e8 746 should be stored in a cool, dry location in unopened containers at a temperature between 46\u00baF to 82\u00baF (8\u00baC to 28\u00baC) unless otherwise labeled. Optimal storage is at the lower half of this temperature range. To prevent contamination of unused material, do not return any material to its original container.<\/p>\n
Dispensing Equipment<\/p>\n
Hernon\uf8e8 offers a complete line of semi and fully automated dispensing equipment. Contact Hernon\uf8e8 Sales for additional information.<\/p>\n
These suggestions and data are based on information we believe to be reliable and accurate, but no guarantee of their accuracy is made. HERNON MANUFACTURING, INC. shall not be liable for any damage, loss or injury, direct or consequential arising out of the use or the inability to use the product. In every case, we urge and recommend that purchasers, before using any product in full scale production, make their own tests to determine whether the product is of satisfactory quality and suitability for their operations, and the user assumes all risk and liability whatsoever, in connection therewith. Hernon\u2019s Quality Management System for the design and manufacture of high performance adhesives and sealants is registered to the ISO 9001 Quality Standard.<\/p>\n
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