PRODUCT DESCRIPTION<\/p>\n
384\u2122 provides the following product characteristics:<\/p>\n
Technology\uff1aAcrylic<\/p>\n
Chemical Type\uff1a Modified acrylic<\/p>\n
Appearance (uncured) \uff1aWhite to off-white pasteLMS<\/p>\n
Components\uff1a One component – requires no mixing<\/p>\n
Viscosity\uff1a High<\/p>\n
Cure \uff1aActivator<\/p>\n
Cure Benefit \uff1aRoom temperature cure<\/p>\n
Application\uff1a Bonding<\/p>\n
Strength \uff1aMedium<\/p>\n
384\u2122 is a thermally conductive adhesive system designed for bonding heat generating components to heat sinks. The high thermal conductivity provides excellent heat dissipation for thermally sensitive components, while the controlled strength permits field and service repair. In high pot applications this product should be limited to a maximum of 500 volts. Typical applications include bonding transformers, transistors and other heat generating electronic components to printed circuit board assemblies or heat sinks.<\/p>\n
TYPICAL PROPERTIES OF UNCURED MATERIAL<\/p>\n
Specific Gravity@ 25 \u00b0C 1.64<\/p>\n
Flash Point – See MSDS<\/p>\n
Viscosity, Brookfield – HBT, 25 \u00b0C, mPa\u2022s (cP):<\/p>\n
Spindle TE, speed 2.5 rpm, Helipath 500,000 to 2,250,000LMS<\/p>\n
Spindle TE, speed 20 rpm, Helipath 300,000 to 800,000LMS<\/p>\n
TYPICAL PROPERTIES OF CURED MATERIAL<\/p>\n
Physical Properties:<\/p>\n
Coefficient of Thermal Expansion, ISO 11359-2, K-1\u00a0 69\u00d710-6<\/p>\n
Coefficient of Thermal Conductivity, ISO 8302, W\/(m\u2022K) 0.757<\/p>\n
Elongation, at break, ISO 527-3, % 0.9<\/p>\n
Tensile Strength, at break, ISO 527-3 N\/mm\u00b2 13\u00a0\u00a0\u00a0 (psi) (1,800)<\/p>\n
Young’s Modulus N\/mm\u00b2 2,800\u00a0 (psi) (400,000)<\/p>\n
Electrical Properties:<\/p>\n
Volume Resistivity, IEC 60093, \u03a9\u2022cm 1.3\u00d71012<\/p>\n
Surface Resistivity, IEC 60093, \u03a9 5.1\u00d71013<\/p>\n
Dielectric Breakdown Strength, IEC 60243-1, kV\/mm 26.7<\/p>\n
Dielectric Constant \/ Dissipation Factor, IEC 60250:<\/p>\n
100-Hz 6.48 \/ 0.1<\/p>\n
1-kHz 5.86 \/ 0.04<\/p>\n
1-MHz 5.22 \/ 0.03<\/p>\n
TYPICAL PERFORMANCE OF CURED MATERIAL<\/p>\n
Adhesive Properties<\/p>\n
Cured for 24 hours @ 22 \u00b0C, Activator 7387\u2122 on 1 side<\/p>\n
Lap Shear Strength, ISO 4587: Steel N\/mm\u00b2 \u22655.2LMS (psi) (\u2265754)<\/p>\n
TYPICAL ENVIRONMENTAL RESISTANCE<\/p>\n
Cured for 72 hours @ 22 \u00b0C, Activator 7387\u2122 on 1 side Lap Shear Strength, ISO 4587:Steel<\/p>\n
Chemical\/Solvent Resistance<\/p>\n
Aged under conditions indicated and tested @ 22 \u00b0C.<\/p>\n
% of initial strength\u00a0 Environment \u00b0C 720 h<\/p>\n
Air 87 140<\/p>\n
Water 87 75<\/p>\n
Freon TF 87 85<\/p>\n
Thermal Cycle Resistance<\/p>\n
Bonded aluminum to epoxy glass lap shears cured 72 hours using Activator 7387\u2122 on 1 side were subjected to thermal cycling of 15\u00b0C to 100\u00b0C with a ramp time of 30 minutes. No loss in strength occurred after 1,000 hours of cycle time.<\/p>\n
GENERAL INFORMATION<\/p>\n
For safe handling information on this product, consult the Material Safety Data Sheet (MSDS).<\/p>\n
Directions for use<\/p>\n
1. For best performance bond surfaces should be clean and free from grease.<\/p>\n
2. Use applicator to apply the activator to the surface to be bonded.<\/p>\n
3. After the solvent evaporates, the active ingredients will appear wet, and will remain active for up to 2 hours after application. Contamination of the surface before bonding should be prevented.<\/p>\n
4. Apply adhesive to the un activated surface.<\/p>\n
5. Secure the assembly, and wait for the adhesive to fixture (approximately 5 minutes) before any further handling. Full cure occurs in 4 – 24 hours.<\/p>\n
6. The amount of adhesive applied to the part or heat sink should be limited to the amount necessary to fill the bond and just enough to give a small fillet.<\/p>\n
7. The dispensing or application of the adhesive should be done as to minimize air entrapment within the bondline.<\/p>\n
Device Removal\/Repair<\/p>\n
Components or devices bonded with 384\u2122 can be removed while hot using heat from a hot air jet. Bond strength decreases at approximately 65 \u00b0C to 93 \u00b0C allowing components to be removed with lower shear forces. Method of removal\/repair should be specifically determined due to the<\/p>\n
variety of components or devices bonding behavior.<\/p>\n
Loctite Material SpecificationLMS<\/p>\n
LMS dated October-24, 2003. Test reports for each batch are available for the indicated properties. LMS test reports include selected QC test parameters considered appropriate to specifications for customer use. Additionally, comprehensive controls are in place to assure product quality and consistency. Special customer specification requirements may be coordinated through Henkel Quality.<\/p>\n
Storage<\/p>\n
Store product in the unopened container in a dry location. Storage information may be indicated on the product container labeling. Optimal Storage: 2 \u00b0C to 8 \u00b0C. Storage below 2 \u00b0C or greater than 8 \u00b0C can adversely affect product properties. Material removed from containers may be contaminated during use. Do not return product to the original container. Henkel Corporation cannot assume responsibility for product which has been contaminated or stored under conditions other than those previously indicated. If additional information is required, please contact your local Technical Service Center or Customer Service Representative.<\/p>\n
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