{"id":1815,"date":"2011-02-10T15:10:50","date_gmt":"2011-02-10T07:10:50","guid":{"rendered":"http:\/\/www.g4e.cn\/wordpress\/?p=1815"},"modified":"2013-11-20T10:38:40","modified_gmt":"2013-11-20T02:38:40","slug":"henkel-electronic-solutions-division-electronic-assembly-in-english","status":"publish","type":"post","link":"http:\/\/www.g4e.cn\/wordpress\/adhesiveapplication\/1815.html","title":{"rendered":"\u300a\u6c49\u9ad8\u7535\u5b50\u90e8\u7535\u5b50\u7ec4\u88c5\u89e3\u51b3\u65b9\u6848\u300b\u4e2d\u82f1\u6587\u7248"},"content":{"rendered":"

\u5927\u5e74\u521d\u516b\u5f00\u5de5\uff0c\u6ca1\u4ec0\u4e48\u7d27\u6025\u7684\u4e8b\u60c5\u8981\u5904\u7406\uff0c\u5728\u7f51\u4e0a\u627e\u5230\u4e86\u6c49\u9ad8\u516c\u53f8\u65b0\u53d1\u884c\u7684\u300a\u6c49\u9ad8\u7535\u5b50\u90e8 \u7535\u5b50\u7ec4\u88c5\u89e3\u51b3\u65b9\u6848\u300b\uff0c\u53bb\u5e74\u66fe\u627e\u5230\u8fc7\u6b64\u4efd\u8d44\u6599\u7684\u82f1\u6587\u7248\u300aHenkel Electronics Assembly Solutions\u300b\uff0c\u5927\u7ea66~7M\uff0c\u4eca\u5929\u5f88\u5076\u7136\u7684\u627e\u5230\u4e86\u4e00\u4efd\u4e2d\u6587\u7248\uff0c\u4f46\u6587\u4ef6\u5374\u6709\u5927\u698260M\u3002\u8fd9\u91cc\u9762\u57fa\u672c\u4e0a\u6db5\u76d6\u4e86\u6c49\u9ad8\u7535\u5b50\u80f6\u7c98\u5242\u6240\u6709\u7684\u884c\u4e1a\u548c\u76f8\u5173\u578b\u53f7\uff0c\u6709\u5174\u8da3\u7684\u670b\u53cb\u53ef\u4ee5\u4e0b\u8f7d\u5b66\u4e60\u4e00\u4e0b\uff0c\u4e0b\u9762\u7b80\u8981\u7684\u5217\u660e\u4e00\u4e0b\u76ee\u5f55\uff1a<\/p>\n

\u7ec4\u88c5\u5e02\u573a\u89e3\u51b3\u65b9\u6848
\n\u6c7d\u8f66\u7535\u5b50\u8bbe\u5907 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 – 7
\n\u6d88\u8d39\u4e0e\u5de5\u4e1a\u7535\u5b50\u8bbe\u5907. . . . . . . . . . . . . . . . . . . . . . . . . . 8 – 9
\n\u56fd\u9632\u548c\u822a\u7a7a\u7535\u5b50\u8bbe\u5907. . . . . . . . . . . . . . . . . . . . . . . . 10 – 11
\n\u624b\u6301\u5f0f\u901a\u4fe1\u548c\u8ba1\u7b97\u8bbe\u5907. . . . . . . . . . . . . . . . . . . . . . 12 – 13
\n\u7eff\u8272\u548c\u4fbf\u643a\u5f0f\u80fd\u6e90 (GAPE) . . . . . . . . . . . . . . . . . . . . . . . 14
\nLED\u7167\u660e . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
\n\u533b\u7597\u7535\u5b50\u8bbe\u5907 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 – 17
\n\u5c04\u9891\u8bc6\u522b (RFID) . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 – 19
\n\u65e0\u7ebf\u7535\u4fe1\u8bbe\u65bd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 – 21
\n\u7ec4\u88c5\u6750\u6599
\n\u7c98\u5408\u5242. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 – 31
\n\u663e\u793a\u5668\u6750\u6599 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 – 35
\n\u6cb9\u58a8\u548c\u6d82\u6599 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 – 37
\n\u5fae\u7535\u5b50\u704c\u5c01\u6750\u6599(CSP\u5e95\u90e8\u586b\u5145\u5242). . . . . . . . . . . . . . . 38 – 39
\n\u5fae\u7535\u5b50\u704c\u5c01\u6750\u6599(COB\u5305\u5c01\u6750\u6599) . . . . . . . . . . . . . . . . 40 – 42
\n\u7ebf\u8def\u677f\u4fdd\u62a4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 – 51
\n\u710a\u63a5\u6750\u6599. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 – 57
\n\u8d34\u7247\u80f6 (Chipbonder\u2122). . . . . . . . . . . . . . . . . . . . . . . 58 – 59
\n\u5bfc\u70ed\u6750\u6599. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 – 63
\n\u9644\u5f55 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
\n\u7d22\u5f15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 – 68<\/p>\n

Assembly Market Solutions
\nAutomotive Electronics 6 – 7
\nConsumer & Industrial Electronics 8 – 9
\nDefense & Aerospace Electronics . 10 – 11
\nHandheld Communications & Computing 12 – 13
\nGreen and Portable Energy (GAPE) . 14
\nLED Lighting 15
\nMedical Electronics . 16 – 17
\nRadio Frequency Identification (RFID) 18 – 19
\nWireless DataCom Infrastructure 20 – 21
\nAssembly Materials
\nAdhesives . 22 – 31
\nDisplay Materials . 32 – 35
\nInks & Coatings . 36 – 37
\nMicro-Encapsulants (CSP Underfills) 38 – 39
\nMicro-Encapsulants (COB Encapsulants) . . . . . .40 – 42
\nPCB Protection 43 – 51
\nSolder Materials 52 – 57
\nSurface Mount Adhesives (Chipbonder\u2122) 58 – 59
\nThermal Management Materials 60 – 63
\nAppendix 64
\nIndex . 65 – 68<\/p>\n

\u534e\u4e3a\u7f51\u76d8\u4e0b\u8f7d\uff1ahttp:\/\/dl.dbank.com\/c0axbn8qa3<\/a><\/p>\n

\u6ce8\u518c\u672c\u5730\u4e0b\u8f7d\uff1a

\"\"  \u6c49\u9ad8\u7535\u5b50\u7528\u80f6\u5f69\u9875<\/strong> (4.7 MB, 49 \u6b21)
\u60a8\u6ca1\u6709\u6743\u9650\u4e0b\u8f7d\u6b64\u6587\u4ef6\u3002<\/i><\/p><\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

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