里面的胶粘剂估计应该是双组分的结构胶，节目里面消防员用各种拉拔的方法时我就想，一加热估计就解决了，果不其然，节目最后就是靠加热的方法让消防兵获胜。里面的胶粘剂提供者说没想到会用加热的方法，否则会使用耐温的胶粘剂，可以耐到600度，估计这个就应该是无机胶粘剂了。

这个胶粘剂的提供者是彭兴礼先生，后来在网上查了一下，是这家公司参与的这个节目：北京奥宇可鑫表面工程技术有限公司，彭兴礼先生是这家公司的总裁，看了一下他们的网站，他们应该是以修补技术为主的，而里面的胶粘剂多是修补的用途，这是他们产品的介绍：

“奥可”系列胶粘剂是北京奥宇可鑫公司在技术应用基础上，针对零件修复难题与国内胶粘剂著名专家、总工程师高应岑教授共同研发推出的系列产品，可用于金属填充、结构粘接、耐磨、减磨、自润滑、高温密封、防水、防腐等性能已超过国家标准，部分产品已超过国际先进水平，规格达十二大系列上百余种。

“奥可”系列胶粘剂已成为《军需产品首批采购指南》产品；获《中国知名品牌》称号；被中国石油化工协会授予“质量过硬、行业重点推广”产品。“奥可”各大系列胶种在不同的行业中解决着不同企业的修理难题，产生了显著的社会效益及经济效益。

这类产品估计也有点类似建筑业的植筋胶，其实像一个卖原材料的朋友说的，其实很多胶粘剂想达到某个特别强的性能（例如这个片子里面的的抗拉伸和剪切强度）不是太难，只要舍得用好的材料就能做出来， 其实难就难在在严格控制成本的情况下还能达到同样的性能。 因为他们是卖一些特殊增韧树脂和特种固化剂的，有时候跨了些行业后材料价格让客户觉得完全不可接受，感觉很离谱，都不是一个数量级的，呵呵！难怪他们也只能主要卖在电子胶水行业。

其实国内的一些老专家和老教授厉害就厉害在用最低的成本能做出客户需要的产品，所以有时候和他们谈起一些新兴材料他们都觉得价格太不可思议，估计也是一种思维惯性，但是电子胶水尤其是高端的电子胶水估计就得跳出这个思维了。另外还有些老专家和老教授在方向上有很好的指引，因为他们以前在学术上或者实验室合成研究的一些东西经过这些年的发展，国外甚至国内已经开始商品化了，所以能很快的进行试验验证，毕竟各类胶粘剂的基本原理都在那个地方了。

最后还有一个小细节，节目里面的彭先生说胶粘剂是发音胶粘（zhan）剂，而现在我们一般都发音胶粘（nian）剂，虽然粘是多音字，但估计这也是新老一代的一个习惯差异而已！

“晶片边胶粘结剂 (Edgebond) 通常使用於只需将BGA/CSP晶片边缘固定即可达到接著的目的，它不像底部填充剂（Underfill）必须完全渗透到覆晶晶片底部才可达到完全固定的作用。点胶时PCB不需要事先预热也没有像底部填充剂需等待胶材完全填充底部才可放入烤箱的问题，这缩短了工时且点胶的量少可重工所以成本也较低。”

“Reworkable edgebond adhesive improves CBGA and BGA thermal cycle performance:

April 7, 2011 – Zymet Inc. introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs.

In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, underfill was needed to achieve this level of performance, Zymet says.

Figure 1. Edgebonded CBGA.

The edgebond adhesive is easier to process than an underfill. When applying underfill, the printed circuit board (PCB) is preheated to facilitate capillary flow, and multiple dispense passes are used to deposit sufficient material. With UA-2605, only four beads of the adhesive are required, one at each corner. There is no need to preheat the PCB, wait for underfill flow, and make multiple dispensing passes.

Figure 2. After removal of underfilled BGA, underfill residues must be removed.

Reworking an underfilled BGA is a time consuming and delicate task. Underfill residues must be removed and, for fine-pitch BGAs, the risk of pad damage is high. With UA-2605, BGA rework is simple and straightforward. The temperature is raised and the adhesive is scraped away; then, the BGA is reflowed and lifted from the board. Little site cleaning is necessary.

Zymet is a manufacturer of microelectronic and electronic adhesives and encapsulants. Its products include die attach adhesives, substrate adhesives, UV curable glob top and cavity-fill encapsulants, and underfill encapsulants.

For more information, visit www.zymet.com.”

后来就Edgebond的应用查找了一些相关资料，发现原来汉高其实也有用于这个应用点的产品，其实大家比较熟悉的低温固化胶3128也可以用于这个用途，抓图如下：

在网上还找到了zymet公司的产品发布稿《Reworkable Edgebond Adhesive Improves CBGA and BGAThermal Cycle Performance and Eliminates Underfill》，有兴趣的朋友可以下载查看之：

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Product Description

3M™ Liquid Optically Clear Adhesive 2152A is a UV curing liquid adhesive. It has good bonding strength to various

display substrates like polycarbonate (PC), acrylic and glass without developing bubbles.

Key Features

• UV curable

• Cures in seconds

• Excellent adhesion to glass, polycarbonate, acrylics, etc

Suggested Light Source Wavelength Ranges

UV Cure: 250-400 nm

Technical Data December, 2008

Recommended Curing Conditions

Option 1: Fusion Systems D bulb (high intensity UV Lamp)

• Power: 500W

• Line speed: 10 feet/minute

• Dose: ~2J/cm2 in UVA region

Option 2: Sylvania 15W 350BL (low intensity UV Lamp)

• Curing Time: 5 min

• Dose: ~2J/cm2 in UVA region

Alternate curing systems may be used, providing they deliver a total dose of ~2J/cm2 in UVA region

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OCA Product Description
Adhesive Transfer Tape (ATT) Format or Double Coat
ATT = Unsupported adhesive sandwiched between two release liners
Formulated for Optical Applications
– Transparent and non-yellowing
– Bonds well to common display polymers and glass
– Bonds well to printed and coated surfaces
Manufactured for Optical Applications
– Clean room or clean practices to minimize defects
–No gels or voids
–Precision coating for uniform caliper
–Clean room ready packaging

几个专有缩写：

ATT—Adhesive Transfer Tape
CEF—Contrast Enhancement Film
OCA—Optically Clear Adhesive
ASF—Anti-splinter film
HTMF—High Transmission Mirror Film
LOCA—Liquid Optically Clear Adhesive
3M Solutions for Touch

Protective tape 
3M Novec  EGC 1720 Electronic Coating
Anti Splinter Film
High Transmission Mirror Film
Trizact Diamond Tile
Optically Clear Adhesive
Contrast Enhancement Film
8880 Ultra Transparent EMI Film
Double Coated Bonding Tapes 
Anisotropic Conductive Film 
Labels

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Hernon  Tuffbond  395 is a single component, high temperature resistant, heat activated epoxy. It cures to a high performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond  395 will change from amber-yellow to a reddish brown upon cure.

Bonding the voice coil to the cone has been a challenge for  engineers,  specifically  when  the  adhesive temperature resistance requirement is above 200ºF (93ºC). Two component epoxy has been most commonly used for this application, but limitations such as mixing ratio, cure speed, potential solidification in equipment and static mixers and the need for equipment flushing solvents have made Tuffbond  395 more practical.

Product Benefits
High temperature resistance.
Single component (no mixing, no pot life). Solventless.
Cures on demand (heat cure).
Will not slip during cure.
Fast setting: 1.5 minutes at 150oC bondline. Changes color upon cure (yellow to brown). Excellent adhesion to various substrates. Gives high shear.
Low water absorption. Very rigid.
Low density.
No porosity upon cure.

Typical Properties (Uncured)

Product Description          3M™ Scotch-Weld™ Epoxy Adhesive DP100 Plus Clear is a fast setting, two-part,1:1 mix ratio mercaptan-cured epoxy adhesive. It is unique among fast setting mercaptan cure epoxies in that it combines high shear strength with good peel performance properties. Scotch-Weld epoxy adhesive DP100 Plus Clear is transparent and slightly flexible when cured. Available in bulk containers as 3M™ Scotch-Weld™ Epoxy Adhesive 100 Plus B/A Clear.

Typical Uncured Physical Properties

Note: The following technical information and data should be considered representative or typical only and should not be used for specification purposes.

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产品名称：
DEVCON PUH94167-HV
产品备注：电子粘接胶
产品类别：消费电子行业

产 品 说 明
PUH94167-HV 电子粘接胶

特性
100%固含量、反应性、单组份聚氨酯热熔胶
较好的开放时间
极好的抗剥离力
高粘度，高强度粘接，耐热耐化学性
较低的应用温度
操作设施方便
在施胶温度中具有较好的粘接温度性

应用
该产品在特定的电子行业具有极好初粘性和粘接强度。例如：手机和比较表电脑等小型电子产品上的金属和塑胶，以及塑胶与塑胶直接的粘接等。

产品技术参数：

哪位网友如果有完整版的TDS资料，麻烦共享一下哦，谢谢咯！

ECCOBOND 45 Clear/Catalyst 15 Clear provides the following
product characteristics:

ECCOBOND 45 Clear/Catalyst 15 Clear is a clear, unfilled epoxy adhesive which, by varying the amount of catalyst used, can adjust the hardness from flexible to rigid. It has an easy mix ratio and bonds well to a wide variety of substrates. ECCOBOND 45 Clear/Catalyst 15 Clear is the clear, unfilled version of ECCOBOND 45/Catalyst 15.

ECCOBOND 45 Clear/Catalyst 15 Clear can be used with a variety of catalysts.  For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations.

TYPICAL PROPERTIES OF UNCURED MATERIAL

Part A Properties 45 Clear
Viscosity, Brookfield , ASTM D2393, mPa•s (cP) 13,500
Density, ASTM D792, g/cm³ 1.17
Flash Point – See MSDS

Part B Properties Catalyst 15
Viscosity, Brookfield , ASTM D2393, mPa•s (cP) 25,000
Density, ASTM D792, g/cm³ 0.97
Flash Point – See MSDS

Mixed Properties
Rigid Formulation:
Viscosity, Brookfield , ASTM D2393, mPa•s (cP) 20,000
Density, ASTM D792, g/cm³ 1.06

此产品据悉PCB行业有用到，分为透明和黑色两种！

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FC-BGA

CUF (solder bump) NUF (solder bump)

Stacked CSP
CUF (solder bump) NUF (solder bump) NCP (Au bump)

Stacked Die

TH Electrode
CUF (High flow) NUF (Voidless)

CUF:Capillary flow underfill NUF:Non flow underfill
Working on Wonders
Flip Chip Trend

Silicon chip trend

Bump count Silicon performance Bump pitch Die gap Large die Low-k Thin die Pb free bump Solder joint

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PRODUCT DESCRIPTION

LOCTITE 3541 is a reactive hot-melt adhesive based on polyurethane prepolymers.   The adhesive is pressure sensitive and gives a high initial strength instantly after joining the parts. Additionally it has a long open time to be suitable for automatic or manual assembly line.

The adhesive provides the following characteristics:

Pretreatment

The bonding surfaces must be clean, dry and free of oil and grease.    Substrate temperature  should not fall below 20degC during application.   Lower temperatures will lead to and early solidification of the adhesive and thus to a reduced open time, possibly the adhesive might even flake off.  If necessary the substrates may be preheated, however longer open times and thus extended  cycle times  will have  to be taken  into consideration at temperatures above 45degC.

Application

LOCTITE  3541 can be applied  from heatable  cartridge  guns, from  usual  syringe  type  melting  equipment.    At  longer  rest periods melting and application temperatures should be decreased.   Longer exposure to higher temperatures  can lead to a viscosity increase.

Curing

LOCTITE  3541  cures  exclusively  by  moisture  and  gains  its final strength after 1-5 days, but exhibits high handling strength instantly after joining.

Curing  is  a  chemical  reaction  depending   on  the  following
parameters:
-       Humidity in the rooms of application and storage
-       Humidity of the substrates
-       Permeability of the substrates to be bonded
-       Application weight/ layer of the adhesive film
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PRODUCT DESCRIPTION

LOCTITE® 460™      provides       the      following      product characteristics:

LOCTITE® 460™ has low odor and low blooming properties and is particularly suitable for applications where vapor control is difficult. The product provides rapid bonding of a wide range of materials, including metals,  plastics and  elastomers. LOCTITE® 460™  is particularly suited for bonding porous or absorbent materials such as wood, paper, leather and fabric.

TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C                                        1.1
Flash Point – See MSDS
Viscosity, Cone & Plate, mPa·s (cP):
Temperature: 25 °C, Shear Rate: 3,000 s-1                 25 to 55LMS
Viscosity, Brookfield – LVF, 25 °C, mPa·s (cP):
Spindle 1, speed 30 rpm                                  30 to 60

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CIPG 工艺，是指法兰面上涂布液态密封剂后，一般通过加热固化后再进行组装；FIPG 工艺，是指在法兰面上涂布液态密封剂后，在未固化的状态下进行工件组装，之后需要放置一段时间使密封剂完全固化。

附件文章做了详细介绍，有兴趣的朋友可以下载查看之，另外有一份资料是《New Series of Fuel Cell Sealing Compounds – ThreeBond》也提到了类似的工艺，应该是用在燃料电池封装里面的。

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Semiconductor Market Solutions
Discrete Components . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Quad Flat Pack (QFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Quad Flat No-Lead (QFN) . . . . . . . . . . . . . . . . . . . . . . 11
Ball Grid Array/Chip Scale Package (BGA/CSP) . . . . 14
System-in-Package (SiP) . . . . . . . . . . . . . . . . . . . . . . . 18
Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Semiconductor Materials
Hysol® Die Attach Adhesives . . . . . . . . . . . . . . . . . . . . 23
Hysol® Semiconductor Underfills . . . . . . . . . . . . . . . . 29
Hysol® Semiconductor Encapsulants . . . . . . . . . . . . . 32
Hysol® Thermal Compression Materials . . . . . . . . . . . 34
Hysol® Coating Powders . . . . . . . . . . . . . . . . . . . . . . . 36
Hysol® Electronic Molding Compounds . . . . . . . . . . . 37
Hysol® and Hysol® Huawei™ Semiconductor
Molding Compounds . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Multicore® Accurus™ Solder Spheres . . . . . . . . . . . . . 47
Printed Circuit Board (PCB) Assembly Materials
Multicore® Solder Paste . . . . . . . . . . . . . . . . . . . . . . . . 50
Multicore® Fluxes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Multicore® Cored Wire . . . . . . . . . . . . . . . . . . . . . . . . . 54
Multicore® Solder Accessories . . . . . . . . . . . . . . . . . . 55
Chip on Board Encapsulant Materials . . . . . . . . . . . . 56
Loctite® Board Level Underfills . . . . . . . . . . . . . . . . . . 59
Loctite® Thermal Management Materials . . . . . . . . . . 61
Loctite® Electrically Conductive Adhesives . . . . . . . 64
Loctite® Chipbonder™ Surface Mount Adhesives . . . 66
Circuit Board Protection Solutions . . . . . . . . . . . . . . . 68
Flat Panel Display Materials
Flat Panel Display Solutions . . . . . . . . . . . . . . . . . . . . 79
Semiconductor Solutions . . . . . . . . . . . . . . . . . . . . . . 84
Solutions Across the Board . . . . . . . . . . . . . . . . . . . . . 86
Periodic Table of Elements . . . . . . . . . . . . . . . . . . . . . 88

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Prawin Paulraj* & Brian K. Paul

*Corresponding author address:

7871 SW 173^rd Pl.

Beaverton,OR97007

Phone: 503-550-5690

Fax: 503-627-5538

E-mail: paulraj_prawin@yahoo.com

Abstract

This paper reports the feasibility of using surface mount adhesives to produce low temperature microchannel arrays in a wide variety of metals. Sheet metal embossing and chemical etching processes have been used to produce sealing bosses that eliminate channel laminae, resulting in approximately 50% material savings over traditional methods. An assembly process using adhesive dispense and cure is outlined to produce leak-free devices. Optimal fill ratios were determined to be between 1.1 and 1.25. Bond strength investigation reveals robustness to surface conditions and a bond strength of 5.5-8.5 MPa using a 3X safety factor.  Dimensional characterization reveals a two sigma (95%) post-bonded channel height tolerance under 10% after bonding.  Patterning tolerance and surface roughness of the laminae faying surfaces were found to have a significant influence on the final post-bonded channel height. Leakage and burst pressure testing on several samples has established confidence that adhesive bonding can produce leak-free joints.  Operating pressures up to 413 kPa have been satisfied equating to tensile pressure on bond joints of 1.9 MPa.  Higher operating pressures can be accommodated by increasing the bond area of devices.

Keywords: Adhesive bonding, microchannel array, microlamination, low temperature heat exchanger.

1.      Introduction

Microchannel process technology (MPT) is the use of microchannel arrays for the bulk processing of mass and energy.  Although MPT devices can be on the order of meters in dimension, MPT devices include critical microchannel dimensions ranging from 100 µm to several mm [1].  One of the major advantages of MPT is the high surface area to volume ratios compared to conventional fluidic technology.  These ratios allow accelerated rates of heat and mass transfer within microchannels due to shorter diffusional distances.  Consequently, microchannels provide the ability to reduce the size and weight of energy and chemical systems [2].  Applications of MPT include portable heat exchange, distributed climate control, solvent separation, fuel processing, and at-home hemodialysis among others [1]; [3].

One growing area for MPT application is low-temperature thermal management, such as the cooling of consumer electronics.  The improved performance and shrinking dimensions of integrated circuits have resulted in the need to dissipate ever-increasing amounts of power. Today, microprocessors require heat dissipation of 50-75W for standard applications, and well in excess of 100W for enthusiast and gamer applications. While the thermal dissipation requirements of microprocessors have steadily increased, the maximum allowable temperature of these devices has remained relatively steady around 65-85°C, limited by many factors including ergonomics and safety.  Due to these limits, several researchers have shown that the theoretical maximum for air cooling of electronic components is in the range of 100 -130 W [4]; [5].

Traditional strategies for increasing heat dissipation have centered on reducing the thermal resistance of the heat sink assembly by increasing the convective surface area through finned surfaces and the use of fans to increase the convective heat transfer coefficient.  However, increases in surface area are usually accompanied by increases in mass and cost. Alternatively, microchannel arrays provide a means of increasing surface area per unit mass, while increasing convective heat transfer coefficients [6].

To further reduce thermal resistance, the ideal microchannel heat sink would be made of a high thermal conductivity material. Copper has the highest thermal conductivity among engineering materials, and has been extensively used for both passive and active heat sinks including microchannel heat exchangers for the cooling of laser diode arrays [7]; [8]. Aluminum alloys offer several advantages over copper alloys as a heat exchanger material. While the thermal conductivity of aluminum is not as good as copper (though comparable), aluminum alloys are light-weight (almost 3x lighter than copper) and are lower in material cost.  Aluminum also forms a very stable and tenacious oxide that is resistant to surface corrosion.  For these reasons, 300X series aluminum alloys are widely used in the traditional heat exchanger industry. Aluminum microchannel heat exchangers have not been reported for application in the electronics industry.  This is largely due to challenges associated with bonding of aluminum microchannel arrays.

Beyond the electronics industry, other low temperature heat exchanger applications require low thermal conductivity materials such as stainless steel. In some heat exchanger applications, such as regenerators within heat engines, low thermal conductivity metals such as stainless steel are actually desirable [9]. For a given microchannel heat exchanger, it has been shown that an optimal thermal conductivity exists that minimizes axial conductive transfer down microchannel fins without significantly penalizing conductive heat transfer across the fin in the thickness direction [10].  Maranzana et al. [10] also showed that in low-temperature (below 100°C) countercurrent microchannel heat exchanger applications, a stainless steel heat exchanger can be as much as 20% more efficient than a copper one.

In the context of low temperature heat exchange, it is desirable to find fabrication methods that can be applied to many materials. Fabrication methods used for microchannel arrays are based on microchannel lamination [1], or microlamination architectures involving the patterning, registration and bonding of thin foils of metal called laminae.  Lamina patterning generally includes either surface machining, through cutting or forming processes.  Once patterned, the laminae are registered relative to each other and bonded together in a stack to make a monolithic device. Typical patterning and bonding steps for microlaminated components are chemical etching and diffusion bonding.  The objective of this paper is to introduce a microlamination architecture capable of meeting the requirements for low temperature heat exchanger applications across a wide variety of materials.

很久没看纯英文的学术文章，看完这篇还真花了不少时间，呵呵！ 感兴趣的朋友可以下载看看：注意：该页面嵌入了下载文件，请访问 该页面下载该文件。

PRODUCT DESCRIPTION
LOCTITE® 3106™ provides the following product
characteristics:
Technology Acrylic
Chemical Type Acrylated urethane
Appearance (uncured) Transparent liquidLMS
Components One component – requires no mixing
Viscosity Medium, thixotropic
Cure Ultraviolet (UV)/ visible light
Cure Benefit Production – high speed curing
Application Bonding
Flexibility Enhances load bearing & shock
absorbing characteristics of the bond
area.
LOCTITE® 3106™ is primarily designed for bonding rigid or
flexible PVC to polycarbonate where large gap filling
capabilities and flexible joints are desired. The product has
shown excellent adhesion to a wide variety of substrates
including glass, many plastics and most metals. The thixotropic
nature of LOCTITE® 3106™ reduces the migration of liquid
product after application to the substrate.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.08
Refractive Index 1.48
Flash Point – See MSDS
Viscosity, Brookfield – RVT, 25 °C, mPa·s (cP):
Spindle 4, speed 20 rpm 3,500 to 7,500LMS
TYPICAL CURING PERFORMANCE
LOCTITE® 3106™ can be cured by exposure to UV and/or
visible light of sufficient intensity. To obtain full cure on
surfaces exposed to air, radiation @ 220 to 260 nm is also
required. The speed of cure will depend upon the UV intensity
and spectral distribution of the light source, the exposure time
and the light transmittance of the substrates.
Stress Cracking
Liquid adhesive is applied to a polycarbonate bar 6.4 cm by
13 mm by 3 mm which is then flexed to induce a known stress
level.
Stress Cracking, ASTM D 3929, minutes:
7 N/mm² stress on bar >15
12 N/mm² stress on bar 13 to 14

Fixture Time
Fixture time is defined as the time to develop a shear strength
of 0.1 N/mm².
UV Fixture Time, Glass microscope slides, seconds:
Black light, Zeta® 7500 light source:
6 mW/cm², measured @ 365 nm ≤15LMS
UV Fixture Time, Polycarbonate to PVC, seconds:
Metal halide bulb, Zeta® 7400:
30 mW/cm², measured @ 365 nm, <5
Electrodeless, H & V bulbs:
50 mW/cm², measured @ 365 nm, <5
Electrodeless, D bulb:
50 mW/cm², measured @ 365 nm, <5
Depth of Cure vs. Irradiance (365 nm)
The graph below shows the increase in depth of cure with time
at 50mW/cm² – 100mW/cm² as measured from the thickness
of the cured pellet formed in a 15mm diameter PTFE die.
Note: When exposed to a V Bulb at irradiances of 50 and 100
mW/cm² for 30 seconds, a depth of cure greater than 13 mm
was achieved. The performance for medium pressure Hg will
be similar to Electrodeless system, H bulb

TYPICAL PROPERTIES OF CURED MATERIAL
Cured @ 30 mW/cm², measured @ 365 nm, for 80 seconds using
a glass filtered metal halide light source
Physical Properties:
Shore Hardness, ISO 868, Durometer D 53
Refractive Index 1.5
Water Absorption, ISO 62, %:
2 hours in boiling water 3.18
Elongation, at break, ISO 527-3, % 250
Tensile Modulus, ISO 527-3 N/mm² 255
(psi) (37,000)
Tensile Strength, at break, ISO 527-3 N/mm² 18.6
(psi) (2,700)
Electrical Properties:
Surface Resistivity, IEC 60093, Ω∙cm 9.2×1014
Volume Resistivity, IEC 60093, Ω·cm 7.7×1014
Dielectric Breakdown Strength, , kV/mm 26
Dielectric Constant / Dissipation Factor, IEC 60250:
100-Hz 5.17 / 0.04
1-kHz 5.01 / 0.02
1-MHz 4.61 / 0.04
TYPICAL PERFORMANCE OF CURED MATERIAL
Adhesive Properties
Cured @ 30 mW/cm², measured @ 365 nm, for 80 seconds using
a metal halide light source, (samples with 0.5 mm gap).
Lap Shear Strength, ISO 4587:
Polycarbonate N/mm² *5.2
(psi) (750)
* substrate failure

TYPICAL ENVIRONMENTAL RESISTANCE
Cured @ 30 mW/cm², measured @ 365 nm, for 80 seconds using
a metal halide light source, (samples with 0.5 mm gap).
Lap Shear Strength, ISO 4587:
Polycarbonate:
0.5 mm gap
Chemical/Solvent Resistance
Aged under conditions indicated and tested @ 22 °C.
% of initial strength
Environment °C 2 h 24 h 170 h
Boiling water 100 * 100 ——– ——–
Water immersion 49 * 100 ——– ——–
Water immersion 87 * 100 ——– ——–
Isopropanol immersion 22 ——– 95 ——–
Heat/humidity 38 ——– ——– * 100
Heat Aging
Lap Shear Strength, ISO 4587, % of initial strength:
Polycarbonate:
Aged @ 71 °C for 170 hours *100
Aged @ 71 °C for 340 hours *100
Aged @ 93 °C for 170 hours *100
Aged @ 93 °C for 340 hours *100
* substrate failure
GENERAL INFORMATION
This product is not recommended for use in pure oxygen
and/or oxygen rich systems and should not be selected as
a sealant for chlorine or other strong oxidizing materials.
For safe handling information on this product, consult the
Material Safety Data Sheet (MSDS).
Where aqueous washing systems are used to clean the
surfaces before bonding, it is important to check for
compatibility of the washing solution with the adhesive. In
some cases these aqueous washes can affect the cure and
performance of the adhesive.
This product is not normally recommended for use on plastics
(particularly thermoplastic materials where stress cracking of
the plastic could result). Users are recommended to confirm
compatibility of the product with such substrates.
Directions for use
1. This product is light sensitive; exposure to daylight, UV
light and artificial lighting should be kept to a minimum
during storage and handling.
2. The product should be dispensed from applicators with
black feedlines.
3. For best performance bond surfaces should be clean and
free from grease.
4. Cure rate is dependent on lamp intensity, distance from
light source, depth of cure needed or bondline gap and
light transmittance of the substrate through which the
radiation must pass.
5. Recommended intensity for cure in bondline situation is 5
mW/cm² minimum (measured at the bondline) with an
exposure time of 4-5 times the fixture time at the same
intensity.

6. For dry curing of exposed surfaces, higher intensity UV is
required (100 mW/cm²).
7. Cooling should be provided for temperature sensitive
substrates such as thermoplastics.
8. Crystalline and semi-crystalline thermoplastics should be
checked for risk of stress cracking when exposed to liquid
adhesive.
9. Excess adhesive can be wiped away with organic solvent.
10. Bonds should be allowed to cool before subjecting to any
service loads.
Loctite Material SpecificationLMS
LMS dated April-22, 2002. Test reports for each batch are
available for the indicated properties. LMS test reports include
selected QC test parameters considered appropriate to
specifications for customer use. Additionally, comprehensive
controls are in place to assure product quality and
consistency. Special customer specification requirements may
be coordinated through Henkel Quality.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 8 °C to 21 °C. Storage below 8 °C or
greater than 28 °C can adversely affect product properties.
Material removed from containers may be contaminated during
use. Do not return product to the original container. Henkel
Corporation cannot assume responsibility for product which
has been contaminated or stored under conditions other than
those previously indicated. If additional information is required,
please contact your local Technical Service Center or
Customer Service Representative.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
μm / 25.4 = mil
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP

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网友： Anndi，不知道您有沒有遇到過這樣的問題：PC管塗了密封膠固化之後出現管體的裂痕和凹槽。此密封膠固化過程中會產生酮胺基。而裂解的產物為一氧化矽、一氧化碳和微量的燃燒不完全的碳化物、氧化金屬和甲醛。我能得到的信息就這些，不知道您對此有什麼看法，麻煩您了。

anndi ： 密封胶缩合型的会产生小分子物质（如醇类、酸类或酮类小分子物质），可能会对材料有腐蚀！但你说的裂解我个人觉得不大可能出现， 这个应该是常温固化的密封胶吧！ 即使是加热固化应该也不会发生裂解的现象

网友： 這種密封膠屬於常溫固化類型，在與空氣接觸之後會產生醇類物質，但是PC管與密封膠接觸的部位沒有發現任何腐蝕現象，而是剩餘的管體發生變形而形成凹槽。個人認為是不是pc的內應力所引起的呢？

anndi ： 不打胶没这个现象吗？

网友： 嗯嗯，是的，固話之後才有這個問題，估計是膠和pc發生某種反應而產生的

anndi ： 如果是有机硅胶不应该会有这么大应力的，应该还是你所说的反应产物导致的，用的什么牌号的硅胶？

网友： 我們是台灣***的品牌，我這邊沒有msds

anndi : 哦，你可以自己做个实验试试

网友： 具體怎樣操作呢？

anndi : 如果是你说的现象那就基本可以可肯定是胶的问题，换别的密封胶试试

网友： 我們做過類似的實驗。採用不同品牌的矽膠對pc護欄管進行實驗，都發生了變形；之後，我們採用同一品牌密封膠，換不同品牌的pc管（德國拜耳生產和國內生產），但還是出現了一樣的問題。不過今天發生了一件事情，我們用另外一種膠水，卻發現pc管沒有發生變形

anndi : 另外一种胶水不是有机硅系列吧

网友： 還是有机硅

anndi : 哦，有机硅分脱酸、脱醇、脱酮、脱甲醛等等

网友： 是的

anndi : 你们发生腐蚀的是脱什么的啊？

网友： 脱酮
anndi : 哦，那不腐蚀的呢
网友： 會釋放酮肟基，不腐蝕的是脱醇

anndi : 脱酮肟型的不适用于PC的密封，对铜也有腐蚀的

网友： 明白

anndi : 改用脱醇的好些

网友： 怪不得

anndi :
：）

再次复习一下知识点：

单组分室温硫化硅橡胶的硫化反应是靠空气中的水分来引发的。常用的交链剂是甲基三乙酰氧基硅烷，它的Si-O-C键很易被水解，乙酰氧基与水中的氢基结合成醋酸，而将水中的羟基移至原来的乙酰氧基的位置上，成为三羟基甲基硅烷。三羟基甲基硅烷极不稳定，易与端基为羟基的线型有机硅缩合而成为交链结构。平时，将含有硅醇端基的有机硅生胶与填料、催化剂、交链剂等各种配合剂装入密封的软管中，使用时由容器挤出，借助于空气中的水分而硫化成弹性体， 同时放出低分子物。交链剂除甲基三乙酰氧基硅烷外，还可以是含烷氧基、肟基、胺基、酰胺基、酮基的硅烷。当与烷氧基交链后放出醇，称为脱醇型单组分室温硫化硅橡胶，当与肟基交链后生成肟，称为脱肟型室温硫化硅橡胶、因此，随着交链剂的不同，单组分室温硫化硅橡胶可为脱酸型、脱肟型、脱醇型、脱胺型、脱酰胺型和脱酮型等许多品种。

Henkel offers complete engineering services for projects demanding expertise and support beyond the limits of our standard technical services.
As a result, our engineers provide the following value-added services.
• On-site engineering assistance and consultation
• Joint product development programs
• Contract lab services and testing
• Prototype testing
• Custom formulations

Global Capabilities
We are the global technology leader with extensive network to support customers’ value chain.

Design Partnership
Our large experienced team of engineers provide documented design and application support.

Best-in-Class Technical Support
Our professional engineering support empowers our customers to improve their quality and efficiency.

Innovative & Sustainable Solutions
We enable customers’ innovation to meet fast design changes and development with green solutions.

Cost Saving & Reliability
Our superior adhesives and equipment improve productivity, durability and reduce overall cost.

华为网盘下载：http://dl.dbank.com/c0gauebiaa

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固化后材料典型性能
后24小时 @ 22 °C
物理性能:
热膨胀系数 ISO 11359-2, K-1 80×10-6
导热系数, ISO 8302, W/(m·K) 0,1
玻璃转化温度, ASTM E 228, °C 120
电性能:
介电常数/损失, IEC 60250:
0,05-kHz 2,3 / <0,02
1-kHz 2,3 / <0,02
1 000-kHz 2,3 / <0,02
体积电阻率, IEC 60093, ·cm 10×1015
介电强度, IEC 60243-1, kV/mm 25
固化后材料特性
胶粘剂性能
24小时后 @ 22 °C
剪切强度, ISO 4587:
钢材(喷砂) N/mm² 22
(psi) (3 190)
铝 (蚀刻) N/mm² 15
(psi) (2 175)
ABS N/mm² >6
(psi) (>870)
PVC N/mm² >6
(psi) (>870)
聚碳酸酯 N/mm² >5
(psi) (>725)
酚醛树脂 N/mm² 10
(psi) (1 450)
氯丁橡胶 N/mm² >10
(psi) (>1 450)
丁腈橡胶 N/mm² >10
(psi) (>1 450)
抗拉强度, ISO 6922:
钢材(喷砂) N/mm² 18,5
(psi) (2 680)
后48小时 @ 22 °C
剪切强度, ISO 4587:
钢材(喷砂) N/mm² ≥15,8
(psi) (≥2 290)
65 °C时固化12小时， 之后@ 22 °C进行4小时固化
剪切强度, ISO 4587:
钢材(喷砂) N/mm² ≥19,3LMS
(psi) (≥2 800)

典型环境抵抗性能
1周后 @ 22 °C
剪切强度, ISO 4587:
低碳钢(喷砂)
热强度
在测试温度下进行强度测试
% 强度
温度（°C）
100
75
50
25
0
0 60 80 100 120
老化强度
在测试温度下进行老化,在22 °C进行测试
% 初始强度
时间
150
125
100
75
50
25
0
24 100 500 1000 5000
80 °C
100 °C
耐化学品/溶剂测试
在下列条件下进行老化，在22 °C进行测试.
初始粘结强度的剩有率%
环境°C 100 h 500 h 1000 h
机油(MIL-L-46152) 40 85 85 85
汽油22 90 70 70
异丙醇22 75 75 75
工业甲基化酒精22 95 95 80
1,1,1 三氯乙烷22 80 70 50
氟立昂 TA 22 90 90 85
热/湿95% RH 40 100 100 100
注意事项
本产品不宜在纯氧与（或）富氧环境中使用，不能作为氯
气或其它强氧化性物质的密封材料使用。
有关本产品的安全注意事项，请查阅乐泰的材料安全数据
资料(MSDS).

使用指南
1. 要想获得最好的粘接性能，被粘接的材料表面应当干
净，无油脂.
2. 本产品最适合较小间隙 (0.05 mm)的粘接.
3. 多余的胶粘剂可用乐泰清洗剂，硝基甲烷或丙酮溶解
.
乐泰材料说明LMS
LMS于6月-13, 2001. 每一批号产品都有测试报告
。LMS测试报告中含有一些对客户有用的质检测试参数
。此外，我们也通过多种质量控制，确保产品质量的一致
性。特殊客户的要求可以由汉高乐泰质量中心负责协调。
贮存条件
产品贮存于未开封的原包装内存放在阴凉干燥处。贮存方
法在产品外包装上有所标注。
理想贮存条件: 2 °C to 8 °C. 如将该产品贮存在低
于2 °C或高于8 °C 的温度条件下，可能会影响产品性
能.
被取出包装盒外使用的产品有可能在使用中受到污染。为
避免污染未用胶液，不要将任何胶液倒回原包装内。本公
司将不会对已受到污染的或上面已提及的贮存方法不恰当
的产品负责。如需更多信息，请与当地的乐泰公司技术服
务部或客户服务部联系。
单位换算
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
μm / 25.4 = mil
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP
说明
本文中所含的各种数据仅供参考，并被认为是可靠的。对
于任何人采用我们无法控制的方法得到的结果，我们恕不
负责。自行决定把本产品用在本文中提及的生产方法上
，及采取本文中提及的措施来防止产品在贮存和使用过程
中可能发生的损失和人身伤害都是用户自己的责任。鉴于
汉高乐泰公司明确声明对所有因销售乐泰产品或特定场合
下使用乐泰产品而出现的所有问题，包括针对某一特殊用
途的可商品化和适用性的问题，不承担责任。汉高乐泰公
司明确声明对任何必然的或意外损失包括利润方面的损失
都不承担责任。本文中所论述的各种生产工艺或化学成分
都不能被理解为这些专利可以被其他人随便使用和拥有或
被理解为得到了包括这些生产工艺和化学成分的汉高公司
的专利许可证。建议用户每次在正式使用前都要根据本文
提供的数据先做实验。本产品受美国、外国专利或专利应
用的保护。

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Features

1. Reactive adhesive
2. Solventless
3. No gas produced during curing process
4. Excellent adhesive strength
5. Excellent heat and chemicals resistance
6. Small shrinkage by curing
7. Small creep under load
8. Excellent durability
9. Superb insulation

Tensile Modulus, DMTA :
@ -65 °C N/mm² 6,200
(psi) (900,000)
@ 25 °C N/mm² 3,300
(psi) (480,000)
@ 150 °C N/mm² 350
(psi) (50,000)
@ 250 °C N/mm² 450
(psi) (65,000)
Extractable Ionic Content, @ 100°C ppm:
Chloride (Cl-) <20
Sodium (Na+) <30
Potassium (K+) <5
Weight Loss After Cure, %:
16 hours Isothermal @ 125ºC 0.41
Ramp to 230ºC 0.5
Electrical Properties:
Volume Resistivity, ohms-cm:
cured 90 seconds @ 110ºC 0.0002
Bond Joint Resistance, ohms:
cured 90 seconds @ 110ºC, Cu/Cu, 25μm Bondline 0.008
TYPICAL PERFORMANCE OF CURED MATERIAL
Die Shear Strength vs Substrate:
2 X 2 mm die, kg-f,
Die on Substrate: @ RT
Si die on Pd 1.90
Au die on SS 2.24
Au die on Au 2.11
Die Shear Strength vs Die Shear Temperature:
3 X 3 mm Si die, kg-f,
cured 90 seconds @ 110ºC
Substrate @25°C @150°C @200°C
PBGA-FR4 1.90 0.96 0.87
GENERAL INFORMATION
For safe handling information on this product, consult the
Material Safety Data Sheet, (MSDS).
THAWING:
1. Allow container to reach room temperature before use.
2. After removing from the freezer, set the syringes to stand
vertically while thawing.
3. Refer to the Syringe Thaw time chart for the thaw time
recommendation.
4. DO NOT open the container before contents reach 25°C
temperature. Any moisture that collects on the thawed
container should be removed prior to opening the
container.

5. DO NOT re-freeze. Once thawed to -40°C, the adhesive
should not be re-frozen.
Temperature, °C
Syringe Thaw Time, Minutes
30
20
10
0
-10
-20
-30
-40
0 10 20 30 40 50
1cc
3cc 10cc 30cc
DIRECTIONS FOR USE
1. Thawed adhesive should be immediately placed on
dispense equipment for use.
2. If the adhesive is transferred to a final dispensing
reservoir, care must be exercised to avoid entrapment of
contaminants and/or air into the adhesive.
3. Adhesive must be completely used within the products
recommended work life of 24 hours.
4. Silver-resin separation may occur if the adhesive is left
out at 25°C beyond the recommended work life.
Not for product specifications
The technical data contained herein are intended as reference
only. Please contact your local quality department for
assistance and recommendations on specifications for this
product.
Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: -40 °C. Storage below minus (-)40 °C or
greater than minus (-)40 °C can adversely affect product
properties.
Material removed from containers may be contaminated during
use. Do not return product to the original container. Henkel
Corporation cannot assume responsibility for product which
has been contaminated or stored under conditions other than
those previously indicated. If additional information is required,
please contact your local Technical Service Center or
Customer Service Representative.
Conversions
(°C x 1.8) + 32 = °F
kV/mm x 25.4 = V/mil
mm / 25.4 = inches
N x 0.225 = lb
N/mm x 5.71 = lb/in
N/mm² x 145 = psi
MPa x 145 = psi
N·m x 8.851 = lb·in
N·m x 0.738 = lb·ft
N·mm x 0.142 = oz·in
mPa·s = cP

Note
The data contained herein are furnished for information only
and are believed to be reliable. We cannot assume
responsibility for the results obtained by others over whose
methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production
methods mentioned herein and to adopt such precautions as
may be advisable for the protection of property and of persons
against any hazards that may be involved in the handling and
use thereof. In light of the foregoing, Henkel Corporation
specifically disclaims all warranties expressed or implied,
including warranties of merchantability or fitness for a
particular purpose, arising from sale or use of Henkel
Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental
damages of any kind, including lost profits. The discussion
herein of various processes or compositions is not to be
interpreted as representation that they are free from
domination of patents owned by others or as a license under
any Henkel Corporation patents that may cover such
processes or compositions. We recommend that each
prospective user test his proposed application before repetitive
use, using this data as a guide. This product may be covered
by one or more United States or foreign patents or patent
applications.

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